• Sunday | 20 September 2026
Lam Research and NY CREATES Launch Semiconductor Training Programme to Address US Talent Shortage

Robert E. Geer, Vice President for Education and Workforce Development at NY CREATES, speaks to Semicon Leaders Asia about the five-year partnership with Lam Research to strengthen semiconductor talent development. The programme aims to equip around 3,500 students with advanced process integration skills through virtual fabrication and digital-twin technology, helping prepare the workforce for the...

27 Aug 2026 | Thursday | Interaction
AMD Brings UCIe Connectivity to Select Versal Adaptive SoCs for Advanced Chiplet Designs

AMD is expanding the capabilities of its Versal adaptive SoC portfolio by introducing native support for the Universal Chiplet Interconnect Express (UCIe) 1.1 standard. The move will initially apply to selected Versal RF Series devices, enabling high-bandwidth, low-power communication between the adaptive SoCs and specialised chiplets integrated within the same package. The addition of UCIe refle...

27 Aug 2026 | Thursday | NEWS
Baya Systems Expands in Japan to Support AI, HPC and Chiplet Semiconductor Growth

Baya Systems, a pioneer in software-driven, chiplet-ready semiconductor fabric IP, announced its expansion into Japan, one of the world's fastest-growing semiconductor markets. Amid Japan's investment in advanced manufacturing and AI infrastructure, Baya is deepening engagement with Japanese semiconductor companies, foundries and technology leaders building AI, HPC, automotive and chiplet-based sy...

26 Aug 2026 | Wednesday | NEWS
Apple Unveils M6 and M5 Ultra Chips With Major AI and Performance Gains

Apple® debuted M6 in the new Mac mini® and M5 Ultra in the new Mac Studio®, providing an extraordinary leap in performance and AI capabilities. M6, Apple’s first state-of-the-art 2-nanometer chip, advances every compute block, delivering gains across every dimension of performance. The chip features a larger 12-core CPU complex with the world’s fastest CPU core, a larger 12...

26 Aug 2026 | Wednesday | NEWS
GPPC and AIR WATER Invest in Taiwan Semiconductor Speciality Gas Market

Amid growing demand for advanced semiconductor materials, Grand Pacific Petrochemical Corporation (GPPC) (TWSE: 1312) announced that it has partnered with Japanese industrial gas manufacturer AIR WATER INC. (AWI) to participate in Hong-Kuang Hi-Tech Corp.’s capital increase, a manufacturer of speciality gases for the semiconductor industry. GPPC and AWI will each hold a 35% stake, making the...

26 Aug 2026 | Wednesday | NEWS
Infineon Acquires C2i Semiconductors to Strengthen Silicon Carbide Power Portfolio

Infineon Technologies has acquired Bengaluru-based C2i Semiconductors, strengthening its capabilities in power management technologies for AI data centres and high-performance computing platforms. C2i specialises in software-defined multiphase controllers and intelligent power stages, technologies that complement Infineon’s existing portfolio of power semiconductors and power systems. The tr...

26 Aug 2026 | Wednesday | NEWS
Micron Opens Boise Training Centre to Strengthen US Semiconductor Workforce

Micron Technology has opened a new 60,000-square-foot training centre in Boise, Idaho, as it expands efforts to develop the skilled workforce needed for advanced semiconductor manufacturing in the United States. The facility combines practical technical training, education programmes and apprenticeship opportunities, creating a dedicated pathway into semiconductor careers. New Training Facility S...

26 Aug 2026 | Wednesday | NEWS
Nordson Launches ASYMTEK Vantage XL for High-Precision Panel-Level Packaging

Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, introduces the new ASYMTEK Vantage® XL fluid dispensing platform, designed specifically to address the demanding requirements of panel-level packaging (PLP) and other advanced semiconductor packaging applications. The ASYMTEK Vantage XL extends Nordson's proven Vantage dispensing platf...

26 Aug 2026 | Wednesday | NEWS
AMD Plans $10 Billion Taiwan Investment with TSMC to Expand Advanced Chip Packaging

AMD is committing more than US$10 billion to Taiwan’s semiconductor ecosystem as it prepares for sustained growth in artificial intelligence (AI) and data-centre computing. The investment, which is expected to run through 2029, is aimed at expanding advanced packaging, semiconductor substrates and manufacturing capacity rather than being directed solely towards Taiwan Semiconductor Manufactu...

25 Aug 2026 | Tuesday | NEWS
Samsung Exynos 2700 Reportedly Beats Qualcomm Snapdragon 8 Elite Gen 6 in Performance Tests

Samsung Electronics’ next-generation mobile processor, the Exynos 2700, has reportedly delivered stronger results than Qualcomm’s upcoming Snapdragon 8 Elite Gen 6 in internal performance testing, according to industry sources. The reported results suggest that Samsung’s latest in-house application processor could strengthen its position in the premium smartphone market and pote...

25 Aug 2026 | Tuesday | NEWS
Northwestern Mutual Invests $31.34 Million in Semtech as AI and Data Centre Demand Grows

Northwestern Mutual Wealth Management Co. has established a new position in Semtech Corporation, purchasing 193,626 shares of the semiconductor company during the second quarter. The investment was valued at approximately $31.34 million, giving the investment firm a 0.21% stake in Semtech at the end of the reporting period. The move comes as several institutional investors have increased their ex...

25 Aug 2026 | Tuesday | NEWS
Infineon’s €30 Billion Order Book Faces New Test as Semiconductor Market Shifts

German semiconductor manufacturer Infineon Technologies is facing a growing disconnect between strong business fundamentals and weakening investor sentiment, with its nearly €30 billion order backlog coming under scrutiny as semiconductor stocks experience a broad market correction. The company recently reported record third-quarter revenue and maintained its full-year outlook, highlighting ...

25 Aug 2026 | Tuesday | NEWS
IBM Unveils Dual-Architecture Mainframe Processor with Native Arm Support

At the annual Hot Chips conference, IBM (NYSE: IBM) is announcing the first dual-architecture mainframe processor, which is being designed to enable enterprises to run operating systems and applications on both the IBM and Arm® compute platforms in future IBM Z and LinuxONE systems. This marks the first processor milestone to emerge from the IBM and Arm collaboration establ...

25 Aug 2026 | Tuesday | NEWS
Primemas Showcases CXL Memory Innovations for AI and HPC at FMS 2026

Primemas Inc., a pioneer in next-generation AI memory system architectures and chiplet-based silicon, showcased its latest CXL memory innovations at the Future of Memory and Storage (FMS) 2026. At the event, the company highlighted the industry's most comprehensive CXL memory portfolio and its strategic collaboration with Micron on the Abaco Project, a rack-scale compute system with over 100TB of ...

25 Aug 2026 | Tuesday | NEWS
Chiplets Market to Reach $605 Billion by 2036 as AI and Advanced Packaging Drive Growth

The global chiplets market is projected to grow from $54 billion in 2025 to $605 billion by 2036, supported by rising AI and HPC workloads, advanced packaging adoption and demand for scalable semiconductor architectures. The semiconductor industry is increasingly turning to chiplet-based architectures as conventional monolithic chip designs become more complex and costly at advanced process nodes...

24 Aug 2026 | Monday | NEWS
Nvidia Develops New AI Chip for China as It Seeks to Rebuild Market Presence

Nvidia is reportedly developing a new artificial intelligence (AI) processor specifically for the Chinese market, as the US chipmaker looks to maintain its position in one of the world's largest technology markets amid tightening export restrictions. The reported move comes as Nvidia faces growing challenges in China. US export controls have restricted the sale of some of the company's most advan...

24 Aug 2026 | Monday | NEWS
Qualcomm Snapdragon 8 Elite Gen 6 Extreme Could Introduce New Flagship Chip Naming

Qualcomm is reportedly preparing a new naming structure for its upcoming flagship smartphone processors, with the company potentially adding an ‘Extreme’ designation to its most powerful mobile chip. According to recent leaks, Qualcomm could introduce two flagship platforms under the Snapdragon 8 Elite Gen 6 family. The standard processor is expected to retain the Snapdragon 8 Elite G...

24 Aug 2026 | Monday | NEWS
SK hynix Reviews Chongqing Packaging Operations as AI Demand Drives HBM Expansion

South Korean memory semiconductor manufacturer SK hynix is reviewing the future of its packaging operations in Chongqing, China, as the company adjusts its manufacturing strategy to meet rapidly rising demand for artificial intelligence (AI) memory. The review comes as SK hynix continues to increase its focus on high-bandwidth memory (HBM) and advanced packaging technologies, which have become in...

24 Aug 2026 | Monday | NEWS
Qnity Electronics Appoints Ken Rizvi as Chief Financial Officer

Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, announced that it has appointed Ken Rizvi, a seasoned semiconductor finance executive, as Senior Vice President and Chief Financial Officer, effective October 1. Michael Goss, who has been serving as interim Chief Financial Officer, will assume the role of Qnity&rsqu...

24 Aug 2026 | Monday | NEWS
Mouser Launches Consumer Technology Resource Centre for Smarter Product Development

Mouser Electronics, Inc., the authorised global distributor with the newest electronic components and industrial automation products, highlights its new digital resource centre for consumer technology, providing engineers with emerging technologies, reference designs, and implementation guidance to accelerate product development. This resource centre supports faster prototyping, streamlined i...

24 Aug 2026 | Monday | NEWS

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