United Microelectronics Corporation (NYSE: UMC; TWSE: 2303)(“UMC”), a leading global semiconductor foundry, announced the release of its 55nm Bipolar-CMOS-DMOS (BCD) platform, enabling a new level of performance and power efficiency in next-generation mobile devices, consumer electronics, automotive, and industrial applications. Designed to address the growing complexity of pow...
-Tachyum® announced the opening of new offices in Taiwan, the world’s most advanced technology manufacturing and technological hub, in advance of production of the Prodigy® Universal Processor. As Tachyum continues towards tape-out for Prodigy, the company has chosen to establish manufacturing, testing, assembly, ODM, logistics and support facilities in Taiwan to ensure worl...
Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”) hereby announces the establishment of Rigaku Technology Taiwan Co., Ltd. (hereinafter “RTTW”), a new group company in Taiwan, in 2025. A facility within RTTW, Rigaku Technology Center Taiwan (hereinafter RTC-TW), began full-scale operation in October 2025. RTTW will assum...
Asian semiconductor equities climbed sharply on Thursday following TSMC’s unexpectedly strong forecast for the year, as the company pointed to robust demand for high-performance chips used in artificial-intelligence infrastructure. TSMC reported a record quarterly profit and raised its full-year revenue outlook, citing major customers ranging from Nvidia and Apple to global d...
Continues MediaTek's long history of collaboration with NVIDIA to advance AI innovation from supercomputers to vehicles, IoT devices, data center solutions, and beyond MediaTek has teamed with NVIDIA on the design of the GB10 Grace Blackwell Superchip in NVIDIA DGX Spark, a personal AI supercomputer that allows developers to prototype, fine-tune, and inference large AI models on the ...
Insyde Software, a leading global provider of UEFI and OpenBMC-based firmware, announced that it has joined Arm® Total Design, a collaborative ecosystem designed to simplify and accelerate custom silicon development powered by Arm Neoverse™ Compute Subsystems (CSS). In close alignment with Arm’s shift-left approach, Insyde empowers AI infrastructure providers to validate c...
The new S510AD joins the B360 Plus, F120 and next generation UX10 in Getac's rapidly growing lineup of Copilot+ PCs. Powered by AMD Ryzen™ AI technology, the S510AD delivers strong on-device AI performance, supporting faster insights and reducing reliance on cloud connectivity where applications allow. The S510AD is ideally suited to professionals working in industries including a...
InPsytech, a subsidiary of Egis Technology (6462.TWO) specializing in high-speed interface intellectual property (IP) development, announced that it will participate in the Open Compute Project (OCP) Global Summit 2025, to be held in San Jose, California, from October 13–16, 2025. At the event, InPsytech will showcase its latest 3nm UCIe high-speed interface technology dem...
Taiwan has firmly rejected a proposal from the U.S. Trump administration suggesting a 50-50 split in global semiconductor production. The proposal, reportedly introduced by U.S. Commerce Secretary Howard Lutnick, aimed to balance chip manufacturing between the U.S. and Taiwan. However, Taiwan's Vice Premier Cheng Li-chiun clarified that this specific arrangement was "not discussed" during the re...
As artificial intelligence continues to reshape the global economy, fiber optic connections have emerged as a key enabler of the scale and speed AI factories require. A little-known but critical component — optical transceivers — is at the core, and FIC Global Inc. (TWSE: 3701; FICG), a leading expert in packaging and installing semiconductors on optical modules, is drawing...
As artificial intelligence continues to reshape the global economy, fiber optic connections have emerged as a key enabler of the scale and speed AI factories require. A little-known but critical component — optical transceivers — is at the core, and FIC Global Inc. (TWSE: 3701; FICG), a leading expert in packaging and installing semiconductors on optical modules, is drawing...
Delta, a global leader in power management and smart green solutions, inaugurated in Taiwan its Smart Manufacturing Innovation Center, a strategic hub for equipment validation and talent training programs to support customers implementing geographically-distributed production and smart centralized management. At this one-stop platform site featuring hands-on training as well as production verifi...
As demand accelerates for intelligent, video-centric devices across consumer and industrial markets, ALi Corporation and Ceva, Inc. announced a strategic licensing partnership to integrate Ceva's advanced NeuPro-Nano and NeuPro-M Neural Processing Units (NPUs) into ALi's next-generation Video Display Sub-System (VDSS) platform. This collaboration combines ALi's expertise in multimedia SoCs ...
As AI, HPC, and 5G drive semiconductor innovation, advanced packaging has become the next strategic focus. Yole Group projects the market to exceed USD 50 billion by 2025, with fan-out panel-level packaging (FOPLP) growing more than 15% annually. E&R Engineering (TPE: 8027) will present its latest laser and plasma solutions at SEMICON Taiwan 2025, covering FOPLP, Through-Silicon Via (T...
Semiconductor and electronics supply chains are undergoing a major transformation, driven by the rapid growth of artificial intelligence (AI), changing market leadership, and global supply chain relocation, according to DIGITIMES. DIGITIMES vice president Eric Huang highlighted the shift in global industry power before and after the generative AI boom. In 2018, five technology companies ranked ...
AP Memory, a leading global design company providing customized memory solutions, announced that its next-generation PSRAM—ApSRAMTM (Attached-pSRAM)—has successfully passed customer validation and is scheduled to begin mass production by the end of the year. ApSRAMTM is an advanced version of AP Memory's PSRAM (Pseudo Static Random Access Memory), featuring a new architecture optimiz...
MPI Corporation, a global leader in advanced semiconductor test solutions, announced the release of a fully integrated 250 GHz broadband test solution for the new Keysight NA5305A/7A PNA-X Frequency Extender, that builds on its deep expertise in sub-terahertz probing and on-wafer measurements. The new system leverages MPI's TITAN™ RF Probes and probe station platform to de...
MediaTek, the world's leading innovator of smartphone SoCs, announced the launch of its most advanced mobile platform yet: The MediaTek Dimensity 9500. Setting new standards in on-device AI, console-class gaming, and power efficiency, the MediaTek Dimensity 9500 is engineered to super-charge the next wave of flagship 5G smartphones. The MediaTek Dimensity 9500 adopts a third-generation All Big Co...