• Wednesday | 11 November 2026
Texas Instruments Marks 70 Years in Europe, Expanding Semiconductor Innovation Across AI, Robotics and Automotive Markets

TI is celebrating 70 years of operations in Europe, underscoring its commitment to helping customers across the continent and around the world solve their most complex engineering challenges. From early automotive electronics to today's AI-driven infrastructure, TI has supported seven decades of technological advancement across Europe's key industries. Through partnerships with key Europe...

4 Nov 2026 | Wednesday | NEWS
Current Sensing As a Critical Safety Technology for AI Data Centers

As data center power levels scale from hundreds of kilowatts to multi-megawatt AI clusters, protecting the systems against electrical faults while maintaining uninterrupted operation has become a strategic priority for data center operators. This raises the requirements against electrical fault protection and for predictive maintenance. Against this background, current sensing is evolving from a m...

2 Nov 2026 | Monday | Feature
High NA EUV Lithography Benefits, Challenges, and the Path to Continued Scaling

As the semiconductor industry begins the 2nm manufacturing ramp and accelerates R&D toward the sub-2nm node, high numerical aperture (NA) extreme ultraviolet (EUV) lithography is emerging as a critical enabler of continued device scaling. By improving resolution and enhancing pattern fidelity, high NA EUV lithography is expected to play a central role in future semiconductor manufacturing. Her...

30 Oct 2026 | Friday | Feature
Infineon Invests €1.1 Billion in 300mm GaN Power Semiconductor Manufacturing in Austria

Infineon Technologies has announced an investment of around €1.1 billion at its Villach site in Austria to establish what it describes as the world's first high-volume manufacturing facility for gallium nitride (GaN) power semiconductors on 300mm wafers. High-volume production is scheduled to begin at the end of 2027, with investment continuing through 2034. The expansion will upgrade infras...

28 Oct 2026 | Wednesday | NEWS
EV Group Advances Co-Packaged Optics Manufacturing with Wafer Bonding and Nanoimprint Lithography

As demand for faster, more energy-efficient AI infrastructure grows, co-packaged optics (CPO) is creating new opportunities for Asia's semiconductor foundries, packaging providers and photonics manufacturers. However, scaling production requires advances in wafer bonding, materials integration and precision manufacturing. Semicon Leaders Asia speaks with Dr Bernd Dielacher, Director of Busine...

21 Oct 2026 | Wednesday | Interaction
Saxony and Arizona Strengthen Semiconductor Industry Cooperation

Saxony and the U.S. state of Arizona intend to further expand their ties in the semiconductor industry. Saxony Trade & Invest Corp. (WFS) and the Arizona Commerce Authority (ACA) used SEMICON West, the leading US trade fair for the semiconductor industry, which took place in San Francisco to foster closer links between companies and institutions from both semiconductor regions and to explore f...

20 Oct 2026 | Tuesday | NEWS
Trio-Tech Secures $4.45 Million Semiconductor Burn-In Equipment Contract in Europe

Trio-Tech International (NASDAQ: TRT), a comprehensive provider of semiconductor back-end solutions and a global value-added supplier of electronic equipment, announced it has secured a new three-year contract valued at approximately $4.45 million to provide burn-in testing equipment and ongoing technical and maintenance support to an existing European automotive semiconductor customer. The new a...

8 Oct 2026 | Thursday | NEWS
Cirrus Logic Acquires INVENTVM to Expand Mixed-Signal Power and Audio Chip Capabilities

Cirrus Logic, Inc. (NASDAQ: CRUS) announced that it has acquired INVENTVM, a fabless semiconductor company based in Pavia, Italy that specializes in mixed-signal power management and audio integrated circuits. INVENTVM brings deep engineering expertise, intellectual property, and an established presence in a region where Cirrus Logic intends to expand further. This acquisition enables Cirrus Logic...

8 Oct 2026 | Thursday | NEWS
Fraunhofer IAF Develops 420GHz Broadband MMIC for AI Datacentres and High-Resolution Radar

Fraunhofer Institute for Applied Solid State Physics IAF in Freiburg, Germany, has developed a new broadband distributed amplifier monolithic microwave integrated circuit (MMIC) designed for applications including data centres, precision measurement equipment and high-resolution radar sensors. The new amplifier is intended to meet the growing requirement for devices that can deliver very wide band...

29 Sep 2026 | Tuesday | NEWS
India Advances Semiconductor Ecosystem as SEMICON India 2026 Highlights Scale, Talent and Global Partnerships

India is moving towards the next phase of its semiconductor ambitions, with the second day of SEMICON India 2026 highlighting progress across chip design, manufacturing, advanced packaging, materials, research and development, supply chains and talent. Speaking during a fireside conversation, Ashwini Vaishnaw, Union Minister for Electronics & Information Technology, Railways, and Information ...

19 Sep 2026 | Saturday | NEWS
Seoul Semiconductor Secures India Patent Injunction, Strengthening Global IP Position

Seoul Semiconductor Co., Ltd. (KOSDAQ: 046890, hereinafter 'Seoul') and its affiliate Seoul Viosys Co., Ltd. (KOSDAQ: 092190), global opto-semiconductor technology companies, have obtained a permanent injunction enjoining infringement of Seoul’s opto-semiconductor patents in India, following similar injunction rulings in Europe and the United States. The Delhi High Court exten...

13 Aug 2026 | Thursday | NEWS
Micross to Acquire AEMtec to Expand Advanced Semiconductor Packaging and European Operations

Micross Components, Inc. ("Micross" or the "Company"), a leading provider of high-reliability microelectronic product and service solutions for aerospace, defence, space, medical and industrial applications and a portfolio company of Behrman Capital, announced that it has entered into a definitive agreement to acquire AEMtec GmbH ("AEMtec"). AEMtec is a leading provider of complex micro- and optoe...

29 Jul 2026 | Wednesday | NEWS
Gradiant Completes Water Infrastructure for €5 Billion Semiconductor Fab in Germany

Gradiant, a global leader in advanced water and wastewater solutions, announced the successful completion of its work for a major new semiconductor manufacturing facility in Dresden, strengthening Europe’s capacity to produce the technologies powering an increasingly digital and electrified world. Representing an investment of approximately €5 billion, the new facility is one of German...

23 Jul 2026 | Thursday | NEWS
KoMiCo Invests CZK 914 Million in Czech Semiconductor Facility to Support TSMC's ESMC and Europe's Chip Expansion

South Korean semiconductor services company KoMiCo Co., Ltd. is strengthening its presence in Europe with the construction of a new semiconductor parts cleaning and coating facility in the Czech Republic, a move aimed at supporting the region's expanding semiconductor manufacturing sector. The company is investing approximately CZK 914.3 million (around KRW 65 billion) in the project, which will ...

3 Jul 2026 | Friday | NEWS
Allegro DVT Supports European CHASSIS Programme with Video IP for Automotive Chiplet Platform

Allegro DVT announced its contribution to the European CHASSIS program's implementation of the Automotive Base Die chiplet. The 5nm chiplet is set to revolutionize the automotive semiconductor landscape, laying the foundation for the open and standardized chiplet ecosystem that will enable the next generation of software-defined vehicles. The Automotive Base Die acts as the central...

1 Jul 2026 | Wednesday | NEWS
Parker Madison Uses AI to Create Brand Identity for Europe's First Advanced Semiconductor Packaging Venture

Facing a tight deadline for the French government's Choose France investment summit, Parker Madison used its proprietary AI brand diagnostic tool, LucidifyPro, to align three global executive teams and deliver both a name and a logo in just six weeks. The long-standing brand strategy firm developed the successful new identity for Tessalia Technology SAS, the first advanced...

30 Jun 2026 | Tuesday | NEWS
Qualinx and EUSPA Bring Galileo OSNMA Authentication to Ultra-Low-Power GNSS Devices

Qualinx, the European semiconductor company redefining ultra-low-power connectivity at the connected edge, announced the completion of full Galileo OSNMA (Open Service Navigation Message Authentication) support on its QLX3Gx Series ultra-low-power GNSS receiver. Developed with the support of EUSPA, the EU Agency for the Space Programme, the integration makes the QLX3Gx the firs...

25 Jun 2026 | Thursday | NEWS
European Semiconductor Firms Prioritise End-to-End Partners as AI and Supply Chain Demands Intensify, ISG Finds

Semiconductor enterprises in Europe are seeking partners that can deliver integrated capabilities across the semiconductor lifecycle as they pursue greater resilience, efficiency and regional alignment, according to a new research report published by Information Services Group (ISG) (Nasdaq: III), a global AI-centred technology research and advisory firm. The 2026 ISG Provider Lens®...

25 Jun 2026 | Thursday | NEWS
Rapidus and Fondazione Chips-IT Forge Partnership to Strengthen Japan-Italy Semiconductor Collaboration

Rapidus Corporation announced that it signed a Memorandum of Understanding (MoU) with the Fondazione Chips-IT, an Italian private-law foundation dedicated to semiconductor circuit design. The Fondazione Chips-IT plays a central role in Italy's semiconductor ecosystem and collaborates with world-leading international research institutions and industry. In January of this year, the prime ...

17 Jun 2026 | Wednesday | NEWS
GlobalFoundries and Qualinx Complete Europe's First End-to-End Sovereign Chip Manufacturing Project

GlobalFoundries (GF) and Qualinx announced the successful completion of the first fully European-based, end-to-end semiconductor manufacturing flow at GlobalFoundries’ Dresden fab on its FDX technology. The milestone demonstrates that security-critical chips for aerospace, defense and critical infrastructure can be designed, manufactured and delivered entirely within Europe. ...

12 Jun 2026 | Friday | NEWS

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