EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With...
Valens Semiconductor announced that Samsung is supporting the MIPI A-PHY standard for high-speed sensor connectivity and is partnering with Valens Semiconductor to develop the next generation of MIPI A-PHY products, in response to strong market demand from global OEMs. Valens and Samsung have a long history of collaboration. Samsung was among the earlier investors in Valens, and the two co...
ZYT (ZHUOYU Technology) made its European debut at the IAA Mobility 2025 in Munich, Germany, officially unveiling its European strategy to the global audience. ZYT Establishes German Branch in Braunschweig, Accelerating Localization Efforts in Europe Europe, as the birthplace and innovation hub of the automotive industry, represents a pivotal market in ZYT's global strategy. Taking Germa...
Grinn, a full-cycle technology company specializing in the design and development of advanced IoT and embedded solutions, has announced the launch of a strategic partnership with MediaTek which will help it to extend the implementation of advanced AI and IoT technologies based on its off-the-shelf embedded computing systems. The first fruit of the partnership is the creation of a family of ...
Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced it will showcase its extensive, industry-leading interconnect portfolio for scale-up and scale-out data center AI deployments at the European Conference on Optical Communication (ECOC), September 28 to October 2 in Copenhagen, Denmark. The rapid evolution of generative AI technologies and larg...