• Monday | 27 October 2025
eInfochips and NXP Semiconductors Forge Multi-Year Collaboration to Accelerate Software-Defined Vehicle Development

eInfochips, an Arrow Electronics company, and a leading provider of product engineering services, and NXP® Semiconductors, the trusted partner for innovative solutions in the automotive market, today announced a multi-year collaboration focused on software distribution and customer services. eInfochips will supply standard and premium software packages and tools for NXP's S32 family of micr...

27 Oct 2025 | Monday | NEWS
Samsung Ordered to Pay $524 Million in Patent Infringement Verdicts Backed by Miller Fair Henry

Global technology giant Samsung has been found to owe a combined $524 million in damages following two separate patent infringement verdicts handed down by federal court juries in the Eastern District of Texas. The landmark verdicts were secured for the plaintiffs with the support of attorneys from Longview-based law firm Miller Fair Henry, who collaborated with lead trial counsel in local tria...

17 Oct 2025 | Friday | NEWS
Smartkem, Inc. Signs LOI with Jericho Energy Ventures to Build U.S. AI Infrastructure Using Organic Semiconductor Technology

Smartkem, Inc. (Nasdaq: SMTK), ("Smartkem"), a company developing a new class of organic semiconductor technology, announced that it has signed a non-binding Letter of Intent ("LOI") with Jericho Energy Ventures Inc. (TSX-V: JEV, OTC: JROOF) ("Jericho" or "JEV"), an energy innovation company, for a proposed all-stock business combination (the "Proposed Transaction"). If completed, the Proposed T...

10 Oct 2025 | Friday | NEWS
Reed Semiconductor Sues Monolithic Power Systems for Patent Infringement

Reed Semiconductor Corp., a global leader in the design, development, and manufacture of advanced semiconductor solutions, announced that it has filed a patent infringement lawsuit (Case No. 6:25-cv-00449) in the United States District Court for the Western District of Texas against Monolithic Power Systems, Inc. (MPS). The lawsuit alleges infringement of U.S. Patent No. 7,960,955, which covers ...

7 Oct 2025 | Tuesday | NEWS
Fourier Cooling Introduces Modular, High-Density Liquid-Cooled Data Centers for AI and HPC Workloads

Fourier Cooling Solutions ("Fourier"), a next-generation company dedicated to AI and HPC data center infrastructure, announced its official launch. Fourier introduces a portfolio of prefabricated, containerized data center solutions engineered to scale in step with the rapid evolution of GPUs, CPUs, and high-computing servers, meeting the accelerating demands of artificial intelligence (AI) and ...

1 Oct 2025 | Wednesday | NEWS
Tekscend Photomask Installs Europe's First SLX1 Laser Writer to Boost Regional Chip Manufacturing

Tekscend Photomask (formerly Toppan Photomask), the world's largest merchant photomask supplier for the semiconductor industry, has installed a state-of-the-art photomask laser writing system, the SLX1, at its Corbeil, France facility. This marks the first European deployment of the SLX1 system, manufactured by Swedish technology leader, Mycronic AB.  The new system represents a strat...

28 Sep 2025 | Sunday | NEWS
Baya Systems Honored with 2025 Global Technology Innovation Leadership Recognition by Frost & Sullivan

Frost & Sullivan is pleased to announce that Baya Systems has been recognized with the 2025 Global Technology Innovation Leadership Recognition in the semiconductor IP interconnect solutions industry for its outstanding achievements in product innovation, strategic execution, and customer impact. This recognition highlights Baya Systems' consistent leadership in driving measurable ...

28 Sep 2025 | Sunday | NEWS
Open Compute Project Advances Silicon Diversity with New Universal D2D Transaction and Link-Layer Spec Covering UCIe

The Open Compute Project Foundation (OCP), the nonprofit organization bringing hyperscale innovations to all, announces it has taken important steps in enabling silicon diversity for high-performance AI and HPC Clusters with the release of a new Universal D2D Transaction and Link-Layer specification that now also covers UCIe. This universal link layer will be an important part of the e...

28 Sep 2025 | Sunday | NEWS
Cyient Semiconductors and GlobalFoundries Forge Strategic Channel Partnership to Accelerate Custom Silicon Innovation

Cyient Semiconductors Private Limited, a fast-growing custom silicon company, announced a strategic Channel Partner Agreement with GlobalFoundries (GF), one of the world's leading pure-play semiconductor foundries. Under the agreement, Cyient Semiconductors becomes an authorized reseller of GF's semiconductor manufacturing services and technologies. This collaboration is a significant step towa...

28 Sep 2025 | Sunday | NEWS
Marvell Unveils Industry’s First 2nm 64 Gbps Bi-Directional D2D Interconnect for Next-Gen XPUs

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced the industry's first 2nm 64 Gbps bi-directional die-to-die (D2D) interconnect, enabling chip designers to significantly boost the bandwidth and performance of next-generation XPUs while reducing power and silicon area. Delivering 32 Gbps of simultaneous two-way connectivity over a single wire, the interf...

28 Sep 2025 | Sunday | NEWS
Morse Micro and Browan Communications Partner to Accelerate Global Adoption of Wi-Fi HaLow for IoT 2.0

The Things Conference – Morse Micro, the world's leading provider of Wi-Fi HaLow silicon solutions, announced a new technology partnership with Browan Communications to accelerate the adoption of Wi-Fi HaLow™ worldwide. Together, the companies will grow the Wi-Fi HaLow ecosystem and bring the next generation of Internet of Things (IoT) products to market at scale. With a focus on t...

27 Sep 2025 | Saturday | NEWS
Marvell to Showcase Cutting-Edge Interconnect Solutions for AI Data Centers at ECOC 2025

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced it will showcase its extensive, industry-leading interconnect portfolio for scale-up and scale-out data center AI deployments at the European Conference on Optical Communication (ECOC), September 28 to October 2 in Copenhagen, Denmark. The rapid evolution of generative AI technologies and larg...

27 Sep 2025 | Saturday | NEWS

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