• Saturday | 18 April 2026
Iceotope Expands IP Portfolio Amid Rising Demand for AI Infrastructure Cooling

Iceotope, the global pioneer in precision liquid cooling for AI infrastructure, announced it reached a significant intellectual property (IP) milestone: more than 200 patents granted and pending. The achievement underscores the company's technology leadership in solving one of the AI industry's most pressing challenges: efficiently cooling increasingly powerful computing systems to maximise perfor...

17 Apr 2026 | Friday | NEWS
ACCM Introduces Breakthrough Materials to Solve AI Accelerator Packaging Constraints

Advanced Chip and Circuit Materials announces the commercial availability of Celeritas HM50 and Celeritas HM001, which eliminate the root causes of warpage, package bow, solder fatigue, and high-frequency signal loss in large-format AI accelerators and advanced chip packaging architectures. Celeritas HM50 is a negative CTE (-8 PPM/°C) material, and Celeritas HM001 is a near-zero CTE material. ...

17 Apr 2026 | Friday | NEWS
QuickLogic Expands Sales Network with Quantum Leap Solutions Partnership

QuickLogic Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) Hard IP, Strategic Radiation Hardened, Antifuse and ruggedised FPGAs, announced the appointment of Quantum Leap Solutions as an authorised sales representative. Quantum Leap Solutions will represent QuickLogic's portfolio of IP and chiplet-related offerings, expanding customer engagement across strategic markets. Qua...

17 Apr 2026 | Friday | NEWS
Artilux Unveils Hybrid Optoelectronic AI Architecture to Redefine Compute Efficiency

Artilux announced Inception™, an AI computing paradigm shift from conventional digital electronics to novel hybrid optoelectronics, delivering orders-of-magnitude improvements in both power and area efficiencies without relying on advanced CMOS process nodes and active cooling. As AI workloads continue to scale rapidly across cloud, edge, and on-device computing, traditional digital process...

17 Apr 2026 | Friday | NEWS
Silicon Box Expands Automotive Strategy with imec Chiplet Consortium Membership

Silicon Box, an industry leader in advanced semiconductor packaging solutions, announced that it has formally joined imec's Automotive Chiplet Program (ACP), a collaborative research initiative aimed at accelerating chiplet technology adoption required to drive the development of next-generation vehicles. Chiplet technology is recognised as a critical solution to address rising costs and bottlenec...

17 Apr 2026 | Friday | NEWS
Molex to Acquire Teramount to Accelerate Co-Packaged Optics Adoption

Molex, a global electronics leader and connectivity innovator, announced an agreement to acquire Teramount Ltd., an Israel-based developer of detachable fibre-to-chip connectivity solutions optimised for high-volume Co-Packaged Optics (CPO) and other silicon photonics applications. Teramount's TeraVERSE® platform, based on its universal photonic coupler and wafer-level self-aligning optics, pr...

17 Apr 2026 | Friday | NEWS
HYFIX Secures $15M Seed Funding to Build U.S.-Made Chips for Autonomous Systems

HYFIX Spatial Intelligence, Inc., a U.S.-based semiconductor company, announced a $15 million seed round to build and manufacture a new class of American-made chips designed to power high-precision drones and autonomous robots. The round was led by Craft Ventures, with participation from Catapult Ventures, Multicoin Capital, Finality Capital, and Sky Dayton, a prominent hard-tech investor. The ha...

16 Apr 2026 | Thursday | NEWS
Tageos and Pragmatic Semiconductor Expand Partnership with Sustainable NFC Inlay Solutions

Tageos, a global leader in RFID and BLE inlays, and Pragmatic Semiconductor, a pioneer in flexible semiconductor technology, announced the expansion of their long-term strategic partnership with the launch of Tageos' latest product portfolio based on Pragmatic's flexible and sustainable NFC Connect product line. The new Tageos EOS Lite and EOS Zero Lite lines deliver innovative antenna d...

16 Apr 2026 | Thursday | NEWS
Sivers Semiconductors and Jabil Partner to Develop 1.6T Optical Transceivers for AI Data Centres

Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, announced a collaboration with Jabil, a global engineering, supply chain, and manufacturing solutions provider. Through this collaboration, Jabil plans to develop a 1.6T linear receive optical (LRO) transceiver module using Sivers' high-performance Distributed Feedback (DFB) laser...

16 Apr 2026 | Thursday | NEWS
West-MEC Launches Nation’s First K–12 Semiconductor Cleanroom to Strengthen Workforce Pipeline

Western Maricopa Education Centre (West-MEC) officially celebrated the grand opening of its Advanced Manufacturing Cleanroom on April 13, marking a historic milestone as the nation's first K–12 CTE semiconductor cleanroom of its size. West-MEC extends a special thank you to Advanced Technologies Consultants (ATC), McCarthy Building Companies, and Grace Design Studios for their outstanding e...

16 Apr 2026 | Thursday | NEWS
Celera Semiconductor Appoints Jeff Sexton as VP of Worldwide Sales

Celera Semiconductor, the leading analogue IC supplier using AI to slash the cost and time to develop and supply analogue ICs, announced the appointment of Jeff Sexton as vice president of Worldwide Sales. "We are very pleased to welcome Jeff to Celera to lead our global sales team," said Patrick Brockett, CEO of Celera Semiconductor. "Jeff is an accomplished leader with a proven track record of ...

16 Apr 2026 | Thursday | NEWS
Silanna UV Expands UVC LED Portfolio with New TO-39 Package for Advanced Sensing Applications

Silanna UV, a global innovator in ultraviolet semiconductor technology, announced the release of an additional package type: a TO-39 flat window package for its high-performance SF1 series (Far-UVC 235 nm) and SN3 series (Deep-UVC 255 nm) LEDs. This latest development expands the company's comprehensive metal–can UVC LED portfolio, delivering greater optical flexibility, compact integration,...

16 Apr 2026 | Thursday | NEWS
IonQ Secures DARPA Contract to Advance Networked Quantum Computing Architectures

IonQ (NYSE: IONQ), the world’s leading quantum technology company, announced that it has been awarded a contract in the Defence Advanced Research Projects Agency (DARPA)’s Heterogeneous Architectures for Quantum (HARQ) program. As a part of HARQ, IonQ plays a critical role in enabling a new class of networked quantum computers that combine distinct qubit types—such as trapped io...

15 Apr 2026 | Wednesday | NEWS
Camtek Expands AI Capabilities with Acquisition of Visual Layer

Camtek Ltd. (Nasdaq: CAMT) (TASE: CAMT), a leading developer and manufacturer of inspection and metrology equipment for the semiconductor industry, announced that it has signed a definitive agreement to acquire Visual Layer, a Tel Aviv-based AI company specialising in visual analytics. Visual Layer was founded by Danny Bickson, PhD and Amir Alush, PhD and is backed by leading Silicon Valley ...

15 Apr 2026 | Wednesday | NEWS
VLSI TSA 2026 Highlights Next Wave of AI, Quantum, and Semiconductor Innovation

The 2026 International Symposium on VLSI Technology, Systems and Applications (VLSI TSA), hosted by the Industrial Technology Research Institute (ITRI), is taking place in Hsinchu, Taiwan. Now in its 43rd year, the symposium remains a leading global forum for semiconductor innovation, bringing together over 800 experts from around the world. Discussions this year focus on generative AI infere...

15 Apr 2026 | Wednesday | NEWS
LZE and Karl Kruse Partner to Scale Commercialisation of Advanced Magnetic Sensors

The mission of LZE GmbH is to translate technologies from research into products and, as a fabless semiconductor company, to bring high‑performance integrated circuits and semiconductor solutions to market. This also applies to the unique FH3DXX family of 3D magnetic field sensors, which is based on the innovative HallinOne® technology developed by Fraunhofer IIS and has already been success...

15 Apr 2026 | Wednesday | NEWS
Faraday Expands 28nm IP Portfolio to Accelerate Endpoint AI and AIoT SoC Development

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider,  announced its IP solutions on UMC’s 28nm platform with SST-ESF4 eNVM, designed to enable next-generation MCU and AIoT SoCs targeting endpoint AI applications. The comprehensive IP solution integrates SST eFlash controller and BIST, together with silicon-proven analogue and high-speed interface P...

15 Apr 2026 | Wednesday | NEWS
AOS Expands Global Manufacturing with India OSAT Facility Launch

Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, marks a historic expansion of its global manufacturing footprint with the official inauguration of Kaynes Semicon’s state-of-the-art OSAT facility in Sanand, Gujarat. At...

15 Apr 2026 | Wednesday | NEWS
Mouser Electronics Named Americas Distributor of the Year by Harwin

Mouser Electronics, Inc., the authorised global distributor with the newest electronic components and industrial automation products, announces that it has been awarded the Americas Distributor of the Year Award from Harwin, a world leader in the manufacture of interconnect components. Harwin cited Mouser's continued sales and customer growth for the fiscal year (April 2025 to March 2026), co...

14 Apr 2026 | Tuesday | NEWS
Supermicro Expands Edge AI Portfolio with AMD EPYC 4005-Powered Platforms

Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, announced a family of compact, high-efficiency platforms powered by AMD EPYC™ 4005 series processors. The edge-optimised systems are designed to accelerate AI inferencing and general-purpose workloads in space and power-constrained environments, including retail, manufacturing...

14 Apr 2026 | Tuesday | NEWS

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