• Monday | 27 October 2025
EMTAR Technologies Completes Silicon Validation of Next-Generation 6G NTN Chip Developed with TSMC

-EMTAR Technologies announced the successful silicon validation of its latest chip for 6G non-terrestrial networks (NTN). Developed in collaboration with TSMC as a direct account, the new platform enables highly integrated and intelligent connectivity solutions on a single chip, delivering exceptional sensitivity, energy efficiency, and ultra-low latency signal processing—key enablers for ...

27 Oct 2025 | Monday | NEWS
Avantor and p-Chip Partner to Develop Next-Generation Smart Consumables for Secure Digital Traceability

  Avantor, Inc. (NYSE: AVTR), a leading global provider of mission-critical products and services to customers in the life sciences and advanced technology industries, announced a collaboration agreement with p-Chip Corporation to co-develop a new generation of "Smart Consumables" by embedding p-Chip's innovative microtransponder technology into Avantor's laboratory and clinical consuma...

27 Oct 2025 | Monday | NEWS
TurinTech and Intel Partner to Bring On-Device AI Code Optimisation with Artemis Platform

TurinTech, a leader in AI-driven code optimization and validation, announced a collaboration with Intel to develop and deliver a fully offline, on-device version of Artemis, TurinTech’s AI engineering platform. The collaboration brings Artemis to Intel-powered systems, optimized for the latest Intel® Core™ Ultra processors. Designed to run entirely on-device, Artemis enables dev...

24 Oct 2025 | Friday | NEWS
NextSilicon Unveils Maverick-2 Processor Delivering Up to 10x GPU Performance with 60% Less Power

NextSilicon, a leader in next-generation computing solutions for AI and high-performance computing (HPC), disclosed architecture and performance details for Maverick-2, the next-generation processor enabling order-of-magnitude better compute for HPC and AI: Built on the Intelligent Compute Architecture, the dataflow-enabled hardware adapts to provide peak performance regardless of software br...

23 Oct 2025 | Thursday | NEWS
International Battery Metals Secures USD $2 Million Follow-On Investment from EV Metals

International Battery Metals Ltd.(“IBAT”) (TSXV: IBAT) & (OTCQB: IBATF), an advanced technology provider of modular direct lithium extraction (DLE) systems,  announced a non-brokered private placement financing, marking the second follow-on investment under the Company’s previously announced binding Letter of Intent (“LOI”) with EV Metals 7 LLC (“EV M...

23 Oct 2025 | Thursday | NEWS
Capstone Green Energy and Microgrids 4 AI Unveil 800 VDC Microturbine System to Power Next-Generation AI Infrastructure

Technology Advancements Align with the Industry’s Shift Toward 800 VDC Architectures Capstone Green Energy Holdings, Inc., and its subsidiaries (the "Company” or “Capstone”) (OTCQX: CGEH) a leading provider of clean, low-emission microturbine energy systems and clean technology solutions, and Microgrids 4 AI, Inc. (“MG4AI”), a developer of modular, ...

22 Oct 2025 | Wednesday | NEWS
Nexperia China Unit Maintains Normal Operations Despite Dutch Government Seizure of Parent Company

Nexperia’s China division announced that its operations remain fully functional and stable following the Dutch government’s recent seizure of its parent company in the Netherlands. The move, taken under national-security provisions, has drawn global attention to how deeply political oversight now extends into the semiconductor value chain. According to company officials, Nexperia&rs...

20 Oct 2025 | Monday | NEWS
Fibocom Launches 5G FWA Portfolio Powered by Qualcomm® X85 and X82 to Drive Intelligent Connectivity Across Homes, Enterprises, and Mobility

Fibocom, a leading global provider of wireless communication modules and AI solutions, announced the launch of its new 5G FWA (Fixed Wireless Access) portfolio powered by Qualcomm Technologies Inc.'s X85 and X82 Modem-RF Systems at NetworkX 2025. The lineup includes the high-performance 5G modules FG200/FG201, alongside customized device solutions for indoor CPE, outdoor ODU, and mobile hotspots...

17 Oct 2025 | Friday | NEWS
Malema Launches M-3100 Series Clamp-On Ultrasonic Flow Meter for High-Precision Semiconductor Applications

Malema™, part of PSG and Dover (NYSE: DOV) and a leading provider of flow meter technologies for use in industrial and semiconductor applications, today announced the global launch of the new Malema M-3100 Series Clamp-On Ultrasonic Flow Meter. Engineered for precise fluid velocity measurement in liquid-filled closed conduits, the M-3100 Series is a high-performance, non-invasive ultr...

16 Oct 2025 | Thursday | NEWS
MediaTek and NVIDIA Extend Partnership to Power a New Era of Personal AI Supercomputing

Continues MediaTek's long history of collaboration with NVIDIA to advance AI innovation from supercomputers to vehicles, IoT devices, data center solutions, and beyond  MediaTek has teamed with NVIDIA on the design of the GB10 Grace Blackwell Superchip in NVIDIA DGX Spark, a personal AI supercomputer that allows developers to prototype, fine-tune, and inference large AI models on the ...

16 Oct 2025 | Thursday | NEWS
Canaan and Aurora AZ Launch Pilot Project Converting Flared Natural Gas into Low-Cost Power for High-Density Computing

Strategic initiative to convert flared natural gas into low-cost power for high-density computing Scalable low-cost natural gas power model designed to strengthen mining economics Annual reduction of approximately 12,000–14,000 metric tons of CO₂-equivalent emissions expected - Canaan Inc. (NASDAQ: CAN) ("Canaan" or the "Company"), an innovator in crypto mining, announced the lau...

14 Oct 2025 | Tuesday | NEWS
InPsytech Showcases 3nm UCIe 3.0 Technology at OCP Global Summit 2025

 InPsytech, a subsidiary of Egis Technology (6462.TWO) specializing in high-speed interface intellectual property (IP) development, announced  that it will participate in the Open Compute Project (OCP) Global Summit 2025, to be held in San Jose, California, from October 13–16, 2025. At the event, InPsytech will showcase its latest 3nm UCIe high-speed interface technology dem...

14 Oct 2025 | Tuesday | NEWS
DAS Environmental Experts Group Opens Glendale Innovation & Support Center to Support U.S. Semiconductor Industry

DAS Environmental Experts Group, a leading global provider of environmental technologies for waste gas and water treatment, has officially opened its new Innovation & Support Center (ISC) in Glendale, Arizona. Initiated and built by DAS US, the Group's American branch, the center represents a significant milestone in the company's North American growth strategy. It strengthens the organizati...

10 Oct 2025 | Friday | NEWS
Semtech Launches Next-Generation 5G AirLink® Routers with Network Slicing for Mission-Critical Public Safety Operations

New Generation of Purpose-Built Routers With 5G Network Slicing Support Enables Dedicated Connectivity Lanes for Mission-Critical First Responder Operations Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, today announced the availability of the AirLink® XR80 and XR9...

8 Oct 2025 | Wednesday | NEWS
L&T Technology Services Secures $100 Million Multi-Year Deal to Accelerate AI-Driven Innovation for Semiconductor Equipment Client

-L&T Technology Services Limited , a global leader in AI, Digital & ER&D Consulting Services,  announced a major milestone in its Sustainability segment with the signing of a $100 million multi-year agreement with a US-based industrial equipment manufacturer catering to the semiconductor value chain. Under the terms of the agreement, LTTS will support the clients’ initiat...

2 Oct 2025 | Thursday | NEWS
QuantumScape and Corning Partner to Develop Ceramic Separator Manufacturing for Solid-State Batteries

-QuantumScape Corporation (NYSE: QS), a global leader in next-generation solid-state lithium-metal battery technology, and Corning Incorporated (NYSE:GLW), one of the world’s leading innovators in glass, ceramics, and materials science,  announced an agreement to jointly develop ceramic separator manufacturing capabilities for QS solid-state batteries. The companies will work together...

1 Oct 2025 | Wednesday | NEWS
InPsytech Tapes Out UCIE 2.0-Compliant Design on TSMC's SoIC F2F Technology

InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced that it has successfully taped out its advanced design for TSMC's Face-to-Face (F2F) SoIC technology, fully compliant with the UCIE 2.0 (Universal Chiplet Interconnect Express) standard. This milestone marks a significant achievement in enabling high-speed interconnects for heterogene...

28 Sep 2025 | Sunday | NEWS
SiMa.ai Launches Modalix™ MLSoC to Power Physical AI at the Edge Under 10 Watts

Modalix™, a second-generation Machine Learning System on a Chip (MLSoC™) purpose built to lead the Physical AI industry, delivers industry-leading performance and accuracy without sacrificing power—supporting LLMs, transformers, CNNs, and GenAI workloads under 10 watts. Its flexible, Arm-based architecture with a native GenAI stack enables real-time perception, decision-making,...

28 Sep 2025 | Sunday | NEWS
LG Innotek Unveils Next-Generation Digital Key Solution for Smarter, Safer Vehicle Access

LG Innotek recently held an event to unveil its newly developed 'Next-generation Digital Key Solution' for the first time to the media. The 'Next-generation Digital Key Solution' is a flagship product of LG Innotek's automotive connectivity business, a key pillar of its automotive components business, along with 5G communication modules and automotive AP modules. The digital key is touted as a...

28 Sep 2025 | Sunday | NEWS
Acer Unveils Veriton GN100 — Ultra Compact AI Workstation with Server Level Performance

Acer introduced the Veriton GN100 AI Mini Workstation, a compact yet powerful computer designed to run large AI models locally, minimizing dependence on cloud services and helping reduce associated costs. The device is built on the NVIDIA® GB10 Grace Blackwell Superchip, delivering up to 1 PFLOPS of FP4 AI performance. This powerhouse combines next-generation CUDA® cores, fifth-gen Tens...

28 Sep 2025 | Sunday | NEWS

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