• Wednesday | 11 November 2026
Thermo Fisher Expands Semiconductor Lab Automation With Optis FIB-SEM Installations

  Automation: Optis FIB-SEM reduces operator-dependent sample preparation with automated, wafer-based workflows that give semiconductor manufacturers more consistent, traceable transmission electron microscopy (TEM) sample data. Precision: Critical for advanced logic and memory devices, Optis FIB-SEM supports ultra-high-precision final lamella thinning with AI-driven endpointing for high-...

11 Nov 2026 | Wednesday | NEWS
MaxLinear Launches Jeju MxL77904 Power Management IC for 1.6T Optical Modules in AI Data Centres

MaxLinear, Inc. (Nasdaq: MXL), a leader in high-speed connectivity, mixed-signal and power-management semiconductor solutions, introduced Jeju™ (MxL77904), a highly integrated, custom multiphase power management IC (PMIC) designed for maximum efficiency in DSP-based 1.6T pluggable optical modules used in AI infrastructure networks. Purpose-built for advanced 3nm and 4nm CMOS Optical PAM4 DS...

11 Nov 2026 | Wednesday | NEWS
Gooch & Housego Acquires IntraAction to Expand Acousto-Optic Technology and US Manufacturing Capacity

G&H (Gooch & Housego), a leading provider of advanced photonics solutions, announced its acquisition of IntraAction Corp., bringing together two established businesses with a long heritage in acousto-optic technology. “We are continuing to invest in acquisitions that accelerate G&H’s ability to bring enhanced value to our customers in strategic growth areas. The combined b...

9 Nov 2026 | Monday | NEWS
Sensitron Semiconductor Launches 270VDC Solid State Power Controllers for Aerospace and Defence Applications

Sensitron Semiconductor, a U.S.-based manufacturer of high-reliability power electronics,  announced the SPHM/SEHM Series, a family of programmable Solid State Power Controllers (SSPCs) for 270VDC power distribution. Built on a microcontroller-based, commercial off-the-shelf (COTS) architecture, the series replaces discrete circuit breakers, solid state relays and system monitors with one int...

9 Nov 2026 | Monday | NEWS
Aeva and Micro-Epsilon Partner to Integrate High-Precision Sensing Technology into Industrial Automation

Aeva® (Nasdaq: AEVA), a leader in next-generation sensing and perception systems, announced that Micro-Epsilon, a global leader in high-precision sensing and measurement solutions, plans to integrate Aeva’s Eve™ high-precision technology into its next-generation sensing solutions. Trusted by major companies across the world, Micro-Epsilon ships more than 100,000 precision sensors ...

4 Nov 2026 | Wednesday | NEWS
Entegris Acquires Advanced Abrasives and Partners with Element Six to Develop Diamond-Based Cooling Materials for AI Chips

Entegris, Inc. (Nasdaq: ENTG), a leading supplier of critical advanced materials and process solutions for the semiconductor and other high-technology industries, announced two important milestones in its strategic expansion into the market for silicon carbide (SiC) and diamond-enabled thermal management materials solutions for next-generation AI advanced packaging. “Growth in AI compute, f...

4 Nov 2026 | Wednesday | NEWS
Wolfspeed Launches Transparent Silicon Carbide for AR and Quantum Computing

US semiconductor manufacturer Wolfspeed has announced the commercial availability of its proprietary transparent silicon carbide (TSiC) technology, extending its materials portfolio into augmented reality (AR), quantum computing and advanced optical systems. Announced on 29 October 2026, the technology uses optical-grade silicon carbide substrates designed to minimise light absorption while maint...

3 Nov 2026 | Tuesday | NEWS
High NA EUV Lithography Benefits, Challenges, and the Path to Continued Scaling

As the semiconductor industry begins the 2nm manufacturing ramp and accelerates R&D toward the sub-2nm node, high numerical aperture (NA) extreme ultraviolet (EUV) lithography is emerging as a critical enabler of continued device scaling. By improving resolution and enhancing pattern fidelity, high NA EUV lithography is expected to play a central role in future semiconductor manufacturing. Her...

30 Oct 2026 | Friday | Feature
Intel to Acquire Classiq to Build Full-Stack Quantum Computing Platform

Intel has agreed to acquire Classiq, an Israel-based developer of quantum software, as part of a plan to build a full-stack quantum computing platform. The deal, announced on 26 October 2026, is expected to close in the first half of 2027, subject to regulatory approvals and customary closing conditions. Financial terms were not disclosed. Classiq has developed a quantum algorithm synthesis platf...

28 Oct 2026 | Wednesday | NEWS
How AlpSemi Is Reinventing Power Semiconductors for Solid-State Circuit Breakers

AlpSemi aims to transform this landscape by developing advanced power semiconductor devices specifically designed for solid-state circuit breakers (SSCBs). This approach addresses a key challenge: improving the efficiency, compactness and cost competitiveness of semiconductor-based protection. Founded in 2024 by Frédéric Dupont and Fabrice Letertre, both former executives at Soitec,...

26 Oct 2026 | Monday | Feature
Helion Secures Agreement for Up to $175 Million in US CHIPS Funding for Fusion Semiconductor Development

Funds will support next-generation semiconductor research and development in Everett, Washington, enabling substantial power module manufacturing capability in Washington State. The project will also support research and development for domestic next-generation semiconductor tooling. Helion, a Washington-based fusion energy company, announced it has signed a letter of intent with the U.S. De...

26 Oct 2026 | Monday | NEWS
Intelligence per Microjoule: Why the Next Era of AI Will Be Decided at the Edge

For most of the past three years, the semiconductor industry has measured AI progress in one direction. Models have grown larger, clusters have grown denser, and accelerators have been paired with more high-bandwidth memory with each generation. That build-out has been remarkable, and it will continue. As we look toward 2027, though, the constraints shaping our industry are becoming as important a...

23 Oct 2026 | Friday | Feature
SUSS Expands into Wafer Cleaning with GreenTec Solutions and 2027 Manufacturing Roadmap

As advanced packaging and semiconductor manufacturing become increasingly complex, demand for efficient, sustainable wafer-cleaning technologies is growing. SUSS is entering this market with GreenTec Solutions, expanding its photomask cleaning expertise into wafer-level applications. Semicon Leaders Asia speaks with Yuta Nagai, Senior Vice President, Photomask Solutions at SUSS, about the company'...

22 Oct 2026 | Thursday | Interaction
Rocket One Partners with Virginia Commonwealth University to Develop Energy-Efficient Magnetic Computing Devices

Rocket One Inc. ("Rocket One" or the "Company") announced a sponsored research agreement with Virginia Commonwealth University ("VCU") to develop and demonstrate magnetic computing devices targeting a critical challenge in artificial intelligence: delivering greater computational capability while reducing energy consumption. The agreement establishes a one-year fabrication and testing progra...

21 Oct 2026 | Wednesday | NEWS
The AI Chip Supply Chain in 2026: 10 Pinch Points, Ranked by How Long They Will Last

SEMICON LEADERS ASIA ANALYSIS | OCTOBER 2026 Key takeaways HBM is the most severe shortage of 2026, but not the most durable. Record memory capex should bring meaningful relief by 2028, even if supply does not fully normalise in 2027. Wafers, CoWoS-class packaging and liquid cooling are cyclical constraints. Committed capacity with visible start dates should ease them from the second half of ...

21 Oct 2026 | Wednesday | NEWS
Saxony and Arizona Strengthen Semiconductor Industry Cooperation

Saxony and the U.S. state of Arizona intend to further expand their ties in the semiconductor industry. Saxony Trade & Invest Corp. (WFS) and the Arizona Commerce Authority (ACA) used SEMICON West, the leading US trade fair for the semiconductor industry, which took place in San Francisco to foster closer links between companies and institutions from both semiconductor regions and to explore f...

20 Oct 2026 | Tuesday | NEWS
GlobalFoundries Selected for $21 Billion US-Japan Semiconductor Fab Initiative

GlobalFoundries (Nasdaq: GFS) (GF) today announced it has been selected as the technology provider and operator for two new semiconductor manufacturing facilities (“fabs”) at its Malta, New York, site under a U.S.-Japan initiative providing up to $21 billion in funding. Enabled by President Donald J. Trump's trade and investment agreement with Japan, the initiative will accelerate trus...

19 Oct 2026 | Monday | NEWS
Global X Launches Asia Semiconductor ETF Covering Key Regional Chip Markets

-Global X Management Company LLC (“Global X”), the New York-based provider of exchange-traded funds (ETFs), announced the launch of the Global X Asia Semiconductor ETF (ticker ACHP). ACHP (“the Fund”) seeks to invest in companies that are positioned to benefit from the growth and advancement of the Asian semiconductor ecosystem. This includes companies involved in semicond...

16 Oct 2026 | Friday | NEWS
ChipAgents and NVIDIA Launch Benchmark for End-to-End Chip Design Automation

ChipAgents developed Build-A-Chip-Bench with NVIDIA to evaluate AI agents across the end-to-end digital IC design flow, from specification through physical implementation and verified Graphic Design System (GDS). Unlike point benchmarks focused primarily on RTL generation or verification, Build-A-Chip-Bench tests whether agents can meet functional, timing, power, area, and physical-verification...

16 Oct 2026 | Friday | NEWS
Great Lakes Semiconductor Launches First Great American ChipForge Project

Great Lakes Semiconductor (GLS) announced the first project on its Great American ChipForge™ platform, launched under the company's Innovation Funnel™ initiative. The project draws on multiple GLS design centers, ChipForgeTM modular wafer fabrication, and FINPAT™ packaging and test, demonstrating the company's distributed, end-to-end integration capabilit...

15 Oct 2026 | Thursday | NEWS

Asia Pacific

Europe

United States of America