• Thursday | 12 November 2026
WPG Americas Partners with Nuvoton to Expand Semiconductor Distribution in North America

WPG Americas Inc. (WPGA), a leading distributor of electronic components and supply chain services, announced a strategic partnership with Nuvoton Technology Corporation America (NTCA), a leading provider of microcontroller, audio, cloud security, battery monitoring, component, and visual sensing IC solutions. Through the partnership, WPGA will distribute Nuvoton's portfolio of high-performance, ...

15 Oct 2026 | Thursday | NEWS
10 Policy and Trade Moves That Redrew the Global Chip Map in 2026

KEY TAKEAWAYS Governments spent 2026 managing flows rather than stopping them: licences with conditions, tariffs with carve-outs, minerals rules backed by enforcement. Industrial policy moved beyond the fab into packaging, materials, equipment, design and talent, from New Delhi to Brussels to Seoul. For buyers, available capacity and accessible capacity are no longer the same thing. Complianc...

14 Oct 2026 | Wednesday | Analysis
Applied Materials Opens $5 Billion EPIC Center for Semiconductor R&D

$5 billion investment creates the world’s largest semiconductor equipment and process technology R&D facility Purpose-built to accelerate the path from breakthrough innovation to high-volume manufacturing of next-generation chipmaking technologies Leading chipmakers, systems companies, equipment partners and research universities have committed to develop inside EPIC ...

14 Oct 2026 | Wednesday | NEWS
LG Expands Chiller Production in US and South Korea for AI Data Centres

LG Electronics is expanding chiller production across three manufacturing facilities by establishing a new factory in the United States and expanding production at its existing facilities in Changwon and Pyeongtaek, South Korea. The new U.S. facility in Virginia will enable local chiller production and help LG respond quickly to growing chiller demand across North America. Through its “O...

13 Oct 2026 | Tuesday | NEWS
Kioxia Joins Applied Materials’ EPIC Center to Advance AI Memory

Companies will collaborate to develop advanced memory structures, chip stacking technologies and materials engineering innovations to increase AI memory performance KIOXIA joins Applied Materials’ growing EPIC Center ecosystem, which includes chipmakers, chip designers, equipment partners and universities Applied Materials, Inc. (Nasdaq: AMAT), the leader in materials engineering solut...

13 Oct 2026 | Tuesday | NEWS
Applied Materials, UCLA Partner on AI Chip R&D at EPIC Center

Applied Materials has added the UCLA Samueli School of Engineering as a research collaborator at its Equipment and Process Innovation and Commercialization, or EPIC, Center in Silicon Valley, expanding the company’s academic partnerships around next-generation semiconductor development. Researchers from UCLA will work alongside Applied Materials scientists and engineers to address semicondu...

12 Oct 2026 | Monday | NEWS
GlobalFoundries, TSMC Sign $2 Billion Deal for US AI Chip Packaging Supply

GlobalFoundries has signed a $2 billion manufacturing agreement with TSMC to establish US production of silicon interposers used in advanced semiconductor packaging. Under the agreement, GlobalFoundries will expand manufacturing capacity at its facility in Malta, New York, where it will produce silicon interposers for TSMC’s CoWoS advanced packaging ecosystem. The companies have agreed an i...

12 Oct 2026 | Monday | NEWS
Wolfspeed Secures Conditional $1.5 Billion US Commitment for Domestic SiC Production

Wolfspeed has received a conditional commitment for up to $1.5 billion in long-term financing from the US Department of War through its Office of Strategic Capital, as the company looks to strengthen domestic production of silicon carbide and other wide-bandgap semiconductor technologies. The proposed financing carries a 30-year term and is intended to support the development and manufacture of s...

9 Oct 2026 | Friday | NEWS
The 10 Stories That Defined Semiconductors in 2026 So Far, and What the Market Got Wrong

Semiconductor headlines in 2026 have been unusually large. AI accelerator demand kept climbing. Memory prices surged. Washington rewrote parts of its China chip policy. Beijing's domestic AI hardware push gathered pace. India committed another ₹1,27,500 crore to semiconductors through Semicon 2.0, and Japan kept putting public and private capital behind Rapidus. The market numbers make the exci...

9 Oct 2026 | Friday | Analysis
EMD Electronics Opens New Wisconsin R&D Facility to Advance Semiconductor Materials

Part of $200 million multi-year investment strengthening the company's U.S. Electronics footprint, enabling further growth for the industry New 38,000-square-foot Sheboygan Falls, Wisconsin facility expands R&D capabilities for advanced materials critical to next-generation chip manufacturing Dedicated synthesis, scale-up, and technology transfer capabilities are designed to shorten the ...

8 Oct 2026 | Thursday | NEWS
Qnity Launches Kalrez 7080 Sealing Solution for High-Temperature Semiconductor Processes

Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, introduced Kalrez® 7080 perfluoroelastomer parts, a high-performance sealing solution engineered for semiconductor processes operating at temperatures up to 330°C. Designed to support increasingly demanding thermal environments, the new solution strengthens Q...

7 Oct 2026 | Wednesday | NEWS
MICROIP and AQLS Expand North American Opportunities in Edge AI, Drones and Custom Silicon

MICROIP Inc. (TPEx: 7796) and its group company, AQLS Inc., generated strong commercial traction across defense, healthcare and energy sectors during Taiwan Expo USA 2026 in Dallas. The group engaged with over 100 North American and international organizations, while U.S. state and local government officials explored local operations. Following MICROIP's recent APAC automotive wins and a 20 millio...

6 Oct 2026 | Tuesday | NEWS
MIPS and Xcelsa Labs Partner to Speed Custom Silicon Development with AI Design Optimisation

Accelerating the path to custom silicon: MIPS processor IP and Xcelsa’s Apex platform help customers move from software and workload requirements to formally verified, differentiated silicon faster. Optimizing hardware for demanding workloads: The collaboration combines MIPS’ software-first, workload-focused platforms with AI-driven design optimization to improve performance, powe...

30 Sep 2026 | Wednesday | NEWS
Efinix Launches Sapphire RV64 SoC for Embedded Linux and Edge AI Applications

Efinix® Inc., the FPGA company accelerating edge AI innovation, announced the Sapphire™ RV64 SoC, a 64-bit RISC-V processor core that expands the company's Sapphire SoC suite and gives embedded designers a high performance, configurable processor platform in a small, low power footprint. Built on the RISC-V Instruction Set Architecture (ISA), Sapphire RV64 is designed for customers whose...

30 Sep 2026 | Wednesday | NEWS
SEMIFIVE Signs $52 Million AI Inference Accelerator Development Contract in North America

SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, announced that it has signed a contract worth approximately KRW 70.3 billion (USD 52 million) with a U.S.-based AI fabless company to develop a next-generation AI inference accelerator. The project marks SEMIFIVE's first "Spec Hand-off" engagement in the North American market. The contract alone represents more than ...

30 Sep 2026 | Wednesday | NEWS
SUNON Showcases Liquid Cooling Solutions for AI Datacentres

As AI computing continues to advance at an unprecedented pace, rising chip power densities and increasing thermal loads in data centers are creating new challenges for thermal management. Liquid cooling is rapidly becoming a critical technology for supporting the next generation of AI infrastructure. At the 2026 OCP Global Summit, SUNON will showcase its latest liquid cooling innovations under th...

30 Sep 2026 | Wednesday | NEWS
POLYN Advances VibroSense TMS Chip for Real-Time Tyre-Road Friction Detection

POLYN Technology, developer of innovative application-specific neuromorphic analogue signal-processing (NASP™) chips, announced a major milestone in the rollout of its VibroSense TMS solution, which tests have already shown enhances vehicle safety through improved braking. The VibroSense TMS engineering chip, the integrated circuit for tire-road friction detection, is being delivered for as...

29 Sep 2026 | Tuesday | NEWS
ACCM Expands US Manufacturing Capacity for Celeritas Materials Supporting AI Hardware

Advanced Chip and Circuit Materials, Inc. (ACCM) announced a major expansion of its US manufacturing capacity for the Celeritas® family of advanced dielectric materials, covering the four segments of AI hardware where material supply and performance currently constrain system design: ultra-high-speed skew-free materials, low- and negative-expansion laminates for large accelerator boards, IC su...

28 Sep 2026 | Monday | NEWS
GSME and Teradyne Partner to Accelerate Semiconductor Test and Production Readiness

GS Microelectronics U.S., Inc. (GSME), a fast-growing semiconductor solutions provider, and Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, announced a multi‑year strategic partnership to establish a state‑of‑the‑art semiconductor test and evaluation center designed to accelerate customer time‑to‑market. The collaboration integra...

24 Sep 2026 | Thursday | NEWS
STARTRADER Launches 24/7 CFDs Referencing CXMT and Unitree Robotics

STARTRADER announced the launch of two new 24/7 CFD instruments: CXMTUSD (CXMT Corporation) and UNITREEUSD (Unitree Robotics), available Monday through Sunday, 00:00–24:00 (GMT+3 platform time), subject to scheduled maintenance windows. Both instruments are USD-denominated CFDs referencing Shanghai-listed companies. The AI story has focused largely on software, while the hardware behind it ...

23 Sep 2026 | Wednesday | NEWS

Asia Pacific

Europe

United States of America