Semicon Leaders Asia | B2B Insights, Trends & News for the Semiconductor Industry

SemiQon and VTT Win EARTO Award for Cryogenic CMOS Chip Innovation Unlocking Quantum Computing and Space Potential

EARTO, the organisation of the European Research and Technology Organisations, awarded SemiQon and VTT first prize in the "Impact Expected" category on 14 October 2025 in Brussels for a pioneering cryogenic CMOS (complementary metal-oxide semiconductor) chip innovation. The solution enables the full capacity of advanced CMOS functionalities at cryogenic temperatures, thereby unlocking new possib...

16 Oct 2025 | Thursday | NEWS

Lightium, MPI, and Axiomatic_AI Partner to Develop World’s First Intelligent Autonomous Test Platform for Photonics

Lightium AG, MPI Corporation, and Axiomatic_AI Inc. have entered into a Memorandum of Understanding (MoU) to jointly develop the world's first Intelligent, Autonomous, and Integrated Test Solution (IAITS) for photonic devices. This strategic collaboration aims to revolutionize the testing and qualification processes of photonic integrated circuit (PIC) devices by uniting state-of-the-art artifi...

28 Sep 2025 | Sunday | NEWS

Carbice Brings Space-Proven Cooling Tech to Gaming PCs with Launch of Ice Pad

Carbice, a leader in next-generation carbon nanotube-based thermal interface materials (TIMs) and high-performance cooling expertise, is bringing its space-proven cooling tech to the desktop. Starting today, PC builders can select the Carbice® Ice Pad as a premium upgrade option when customizing systems from CyberPowerPC. Engineered with vertically aligned carbon nanotubes, the Ice Pad repl...

28 Sep 2025 | Sunday | NEWS

Lam Research Debuts VECTOR® TEOS 3D to Power Advanced Chip Packaging for AI and HPC

Lam Research Corp. unveiled VECTOR® TEOS 3D, a breakthrough deposition tool engineered specifically for the advanced packaging of next-generation chips required for artificial intelligence (AI) and high-performance computing (HPC) applications. TEOS 3D is purpose-built to solve critical challenges in 3D stacking and high-density heterogeneous integration. It provides ultra-thick, ...