| REX Shares Launches CHIP ETF to Capture Global AI Chipmaking Equipment Growth |
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REX Shares (“REX”), a leading innovator in alternative ETFs, announced the launch of the REX AI Chipmaking ETF (Ticker: CHIP), a thematic ETF built to own the equipment layer of the Artificial Intel... Read more
- 25 September 2026 NEWS
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| Toshiba Launches 3300V 800A SiC MOSFET Module for High-Efficiency Industrial Power Systems |
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Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has expanded its lineup with the launch of “IX800FXF2YMS4,” a dual SiC MOSFET module for industrial equipment, including ... Read more
- 25 September 2026 NEWS
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| Synopsys and TSMC Expand AI Chip Design Collaboration with Agentic AI and Advanced Packaging |
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Synopsys (Nasdaq: SNPS) announced innovations with TSMC that accelerate the development of next-generation AI, high-performance computing (HPC), and advanced semiconductor systems. Through AI-powered EDA f... Read more
- 25 September 2026 NEWS
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| EdgeCortix Unveils RAIDEN Chiplet Platform to Scale High-Performance Physical AI |
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Physical AI has a system problem. Machines that perceive, reason and act in the real world cannot scale by adding AI accelerators alone. Compute, memory capacity, memory bandwidth, connectivity, and software mu... Read more
- 25 September 2026 NEWS
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| Cadence and TSMC Expand AI and HPC Design Collaboration Across Advanced Nodes and 3D-IC |
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Cadence (Nasdaq: CDNS) announced an expanded partnership with TSMC to deliver advanced capabilities for AI and HPC designers. Cadence has achieved tool certification for TSMC’s advanced A14 process, demon... Read more
- 25 September 2026 NEWS
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