Toshiba Launches 3300V 800A SiC MOSFET Module for High-Efficiency Industrial Power Systems

25 September 2026 | NEWS

The new IX800FXF2YMS4 combines third-generation SiC technology, 300kA²s surge capability and a 175°C channel temperature rating to support reliable and compact railway, renewable energy and power conversion systems.

Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has expanded its lineup with the launch of “IX800FXF2YMS4,” a dual SiC MOSFET module for industrial equipment, including railway vehicles, renewable energy power generation systems and power conversion systems. The new module features Toshiba’s third-generation silicon carbide (SiC) MOSFET chips, a drain-source voltage rating of 3300V and a drain current (DC) rating of 800A. Its specifications state an I2t limit value in the diode section, an indicator of surge current capability.

Manufacturers of industrial equipment, including railway traction inverters and converters, renewable energy power generation systems, and industrial motor control equipment, must constantly meet increasing demands for higher efficiency, smaller size and improved reliability. In these systems, large surge currents that can flow through power semiconductor modules in abnormal conditions must be countered by a sufficient surge current capability.

IX800FXF2YMS4 has an optimised SiC chip design and delivers an I2t characteristic of 300kA2s[1], an indicator of the diode section’s surge current capability under abnormal conditions.

The module has a drain-source on-voltage (sense) (VDS(on)sense) of 1.4V (typ.)[2], which helps reduce conduction losses. Its turn-on switching loss (Eon) of 185mJ (typ.)[3] and turn-off switching loss (Eoff) of 175mJ (typ.)[3] help reduce switching losses. These characteristics contribute to improved equipment reliability and efficiency, and to smaller cooling systems.

The new product adopts the iXPLV™ package[4], which offers excellent mounting compatibility. It uses silver sintering bonding technology to improve the heat resistance and reliability of bonded sections with SiC chips, achieving the 175°C channel temperature rating required for industrial equipment.

This new addition to Toshiba’s lineup brings the number of SiC MOSFET modules in the iXPLV™ package to four, broadening the range of available product options.

Toshiba will continue to expand its lineup of SiC MOSFET modules for industrial equipment and provide a wider range of product options that meet diverse equipment specifications and applications. The company will also contribute to more reliable, efficient and compact industrial equipment.

Applications

Industrial equipment

  • Railway traction inverters and converters
  • Renewable energy power generation systems
  • Power conversion systems (solid-state transformers (SST)[5]; uninterruptible power supplies (UPS); energy storage systems (ESS), etc.)
  • Industrial motor control equipment, etc.

Features

  • Specifies I2t limit value (Diode) rating: I2t=300kA2s
  • Low drain-source on-voltage (sense): VDS(on)sense=1.4V (typ.)
  • Low switching loss: Eon=185mJ (typ.), Eoff=175mJ (typ.)
  • Channel temperature rating: Tch=175°C
  • Adopts the iXPLVTM package.