• Monday | 27 October 2025
Renesas Expands RA8 Series with 1 GHz Cortex-M85 MCUs for AI, Industrial and Graphics-Driven Applications

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, introduced the RA8M2 and RA8D2 microcontroller (MCU) groups. Based on a 1 GHz Arm® Cortex®-M85 processor with an optional 250 MHz Arm®Cortex®-M33 processor, the new MCUs are the latest Renesas offerings to deliver an unmatched 7300 Coremarks of raw compute performance, the industry...

23 Oct 2025 | Thursday | NEWS
Rigaku Establishes Rigaku Technology Taiwan to Strengthen Regional Innovation and Customer Support Across Semiconductors, Materials, and Life Sciences

Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”) hereby announces the establishment of Rigaku Technology Taiwan Co., Ltd. (hereinafter “RTTW”), a new group company in Taiwan, in 2025. A facility within RTTW, Rigaku Technology Center Taiwan (hereinafter RTC-TW), began full-scale operation in October 2025. RTTW will assum...

22 Oct 2025 | Wednesday | NEWS
Global 300mm Fab Equipment Investments to Reach $374 Billion by 2028, Driven by AI and Regional Self-Sufficiency

SEMICON West -- Global 300mm fab equipment spending is expected to reach $374 billion from 2026 to 2028, SEMI reported  in its latest 300mm Fab Outlook. This robust investment reflects fab regionalization and surging AI chip demand for data centers and edge devices, while underscoring the growing commitment to semiconductor self-sufficiency across key regions through localized ind...

9 Oct 2025 | Thursday | Reports
Mitsubishi Electric Unveils Advanced Silicon Carbide Power Semiconductor Facility in Kumamoto

Mitsubishi Electric Corporation  celebrated the completion of its new cutting-edge facility for producing power semiconductors at its Kikuchi Plant in Kumamoto Prefecture. The six-story, 42,000-square-meter facility is slated to begin operations in November 2025, with mass production expected in 2027. The facility will focus on manufacturing silicon carbide (SiC) power semiconductors, whic...

7 Oct 2025 | Tuesday | NEWS
3M Joins JOINT3 Consortium to Advance Next-Generation Semiconductor Packaging

3M has joined the next-generation semiconductor packaging consortium JOINT3, an effort to bring together global leaders in semiconductor materials, equipment and design.  JOINT3 is a co-creation evaluation platform established by Japan-based Resonac Corporation with the aim of accelerating the development of tools optimized for panel-level organic interposers, the thin layers made from org...

2 Oct 2025 | Thursday | NEWS
Sony Unveils IMX775: Industry’s Smallest 2.1 µm Pixel RGB-IR Image Sensor for In-Cabin Monitoring

Sony Semiconductor Solutions Corporation (Sony)  announced the upcoming release of the IMX775 CMOS RGB-IR image sensor with the industry's smallest[*1] pixel size of 2.1 µm, delivering both RGB and IR imaging on a single chip and a resolution of approximately 5 effective megapixels,[*2] designed for in-cabin monitoring cameras. *1  Among CMOS image sensor...

2 Oct 2025 | Thursday | NEWS
Kioxia and Sandisk Begin Operations at State-of-the-Art Fab2 3D Flash Memory Facility in Japan

-Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation (TOKYO: 285A) and Sandisk Corporation  announced the start of operation at the Fab2 (K2), a state-of-the-art semiconductor fabrication facility, at the Kitakami Plant in Iwate Prefecture, Japan. Fab2 has the capability to produce eighth-generation, 218-layer 3D flash memory, featuring the companies’ revolutionary CBA (CM...

1 Oct 2025 | Wednesday | NEWS
Mitsubishi Electric Develops Contactless Sensor for Continuous Monitoring of Vital Body Data

  Mitsubishi Electric Corporation  announced  that it has developed a new type of contactless body data sensor that can detect minute variations in heart rates, respiration, and other vital body indicators with high precision. It will enable the continuous and accurate daily measurement of such data in situations where the use of contact-type sensors, such as smartwatches, may be d...

1 Oct 2025 | Wednesday | NEWS
Socionext Advances 3DIC Innovation with TSMC SoIC-X Tape-Out for AI and HPC Applications

Socionext, the Solution SoC company, announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of complete solutions for consumer, AI, and HPC data center applications that include chiplets, 2.5D, 3D, and 5.5D packaging. Socionext empowers customers with a proven development process and unmatched expertise delivering high-performance, high-quality sol...

28 Sep 2025 | Sunday | NEWS
ROHM Unveils World’s Lowest Power Ultra-Compact CMOS Op Amp for Space-Constrained Sensing Applications

ROHM Co., Ltd. has announced that its ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry's lowest operating circuit current (*1). This IC is optimized to be applied as a measurement-sensing amplifier in size-constrained applications such as handheld measurement instruments, wearable devices, and indoor motion detectors. Figures: Product features: https://cdn.kyod...

27 Sep 2025 | Saturday | NEWS
Lam Research and JSR/Inpria Form Strategic Collaboration to Accelerate Next-Gen Semiconductor Patterning

Lam Research Corp. a global leader in semiconductor fabrication equipment and services, and JSR Corporation, a leading technology company focused on materials innovation solutions and the parent company of Inpria Corporation, a metal oxide photoresist solution provider, today announced that Lam and JSR/Inpria have entered into a non-exclusive cross-licensing and collaboration...

27 Sep 2025 | Saturday | NEWS

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