• Tuesday | 12 May 2026
Macnica ATD Europe Acquires Indesmatech to Expand Engineering-Led Semiconductor Presence Across Northern Europe

Macnica ATD Europe today announced the acquisition of Indesmatech, a pan-European technology and advisory company specialising in advanced semiconductor representation, design-in support and consulting, as well as point click buying services. The acquisition is a strategic move by Macnica ATD Europe to strengthen its commercial and engineering presence across Scandinavia and Northern Eu...

12 May 2026 | Tuesday | NEWS
Infineon Technologies AG Launches Global Startup Challenge to Accelerate Humanoid Robotics Innovation

Infineon's Startup Challenge brings together promising founder teams and young high-tech companies from across the globe to work jointly on a highly relevant topic: humanoid robotics. The Challenge is a structured innovation program designed to develop technological concepts into market-ready applications. It is part of Infineon's global Co–Innovation Program, in which Infineon drives innova...

12 May 2026 | Tuesday | NEWS
Ceva Secures Major Bluetooth HDT Design Win with Integrated RF Platform

Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, announced a major customer win for its Bluetooth® High Data Throughput (HDT) solution, including Ceva's internally developed RF technology, a significant commercial milestone validating the company's strategy to expand its wireless offering and deliver comprehensive, system-level solutions to it...

12 May 2026 | Tuesday | NEWS
SEMIFIVE and FotoNation Partner on Ultra-Low-Power Edge AI SoCs

FotoNation Ltd., a European-based Perception-Recognition company, and SEMIFIVE Inc., a leading global provider of custom AI semiconductor solutions, today announced a strategic collaboration agreement under which SEMIFIVE will lead turnkey development for TriSilica, FotoNation's ultra-low-power perceptual AI chip family. TriSilica is an ultra-low-power, compact-footprint perceptual AI silicon pla...

12 May 2026 | Tuesday | NEWS
MICROIP Positions Poland as Strategic Edge AI Hub at Europe-Taiwan Forum

 At the 2026 European Economic Congress (EEC 2026), MICROIP Chairman Dr James Yang participated in a high-level dialogue at the "Poland-Taiwan Economic Cooperation Forum." Joined by Ambassador Liu Yong-jian and HCG Vice Chairman Michael Chiu, Dr Yang advocated leveraging Taiwan's semiconductor prowess to propel Poland into a strategic hub for European Edge AI. Addressing the "Last Mile" of A...

12 May 2026 | Tuesday | NEWS
yieldWerx and WATS Partner to Unify Semiconductor and PCBA Test Analytics

Board-level and semiconductor test data are often analysed separately, limiting correlation across the product lifecycle. Linking PCB assembly (PCBA) test results, including in-circuit and functional test, with upstream wafer, sort, and final test data remains difficult, particularly in photonics, advanced packaging, and high-density integration environments. yieldWerx and WATS announce a partners...

11 May 2026 | Monday | NEWS
Nota AI and Mobilint Partner to Accelerate Commercialisation of Edge AI Solutions

Nota AI (CEO Myung-su Chae), a specialist in AI model compression and optimisation, announced that it has signed an agreement with Mobilint, a high-performance AI semiconductor (NPU) company, to supply AI optimisation technology and establish a strategic partnership. This agreement was pursued to combine Nota AI's proprietary AI model compression and optimisation software capabilities with M...

11 May 2026 | Monday | NEWS
SEMIFIVE and ICY Tech Achieve 8nm eMRAM Edge AI SoC Tape-Out with Samsung Foundry

SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, and ICY Tech, a Chinese AI semiconductor company, announced the successful tape-out of next-generation Edge AI SoC jointly developed utilising Samsung Foundry's 8nm (8LPU) embedded Magnetic Random Access Memory (eMRAM) technology. This marks a significant milestone toward the first commercial deployment of 8...

11 May 2026 | Monday | NEWS
TuringEra Expands Central Asia Push with AI Appliance Launches and Kazakhstan Partnerships

TuringEra, a global leader in edge AI computing chips and full-stack solutions, successfully concluded a series of high-level commercial activities in Almaty this week. In addition to unveiling its "Cloud-Edge-End" AI appliance portfolio at GITEX AI Kazakhstan 2026, the company solidified its Central Asian expansion through strategic dialogues with regional industrial leaders and stakeholders...

11 May 2026 | Monday | NEWS
Amtech Systems, Inc. Appoints Guy Shechter as President and COO to Drive AI Packaging Growth

Amtech Systems, Inc. ("Amtech") (NASDAQ: ASYS), a manufacturer of equipment and consumables enabling AI semiconductor device packaging and advanced substrate fabrication, announced the appointment of Mr Guy Shechter as the Company’s President and Chief Operating Officer, reporting to the Chief Executive Officer of the Company. “I am pleased to announce that Guy Shecter will be joining...

11 May 2026 | Monday | NEWS
Health Impact Alliance Partners with Infineon Technologies AG to Advance Connected Senior Care Solutions

The Health Impact Alliance (HIA) announced it has partnered with Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a world leader in semiconductor solutions, to develop advanced connectivity solutions for the rapidly growing senior care market. This collaboration leverages Infineon’s cutting-edge semiconductor technology to create a comprehensive ecosystem of connected healthcare devices. ...

11 May 2026 | Monday | NEWS
Charlene Wan of Ambiq Micro on Advancing Data-Efficient Edge AI with compressionKIT™

In this interview with Semicon Leaders Asia, Charlene Wan, VP of Corporate Marketing & IR at Ambiq Micro, highlights how compressionKIT™ is extending ultra-low-power AI beyond inference to fundamentally rethink how data is captured, stored, and utilised at the edge. By enabling intelligent AI-based compression for continuous sensor streams, the platform helps developers reduce transmissi...

8 May 2026 | Friday | Interaction
Renesas Electronics Corporation Acquires Irida Labs to Expand Edge AI Portfolio

Renesas Electronics Corporation (TSE:6723, “Renesas”), a premier supplier of advanced semiconductor solutions, announced that a subsidiary of Renesas has completed the acquisition of Irida Labs, a Greece-based company specialising in embedded software for AI-powered visual perception systems. The acquisition strengthens Renesas’ edge AI embedded processing offerings, a key secula...

8 May 2026 | Friday | NEWS
Named Global e-Commerce Partner of the Year by Diotec Semiconductor

Mouser Electronics, Inc., the authorised global distributor with the newest electronic components and industrial automation products, announces that it has been named the Global e-Commerce Partner of the Year for 2025 by Diotec Semiconductor, a leading manufacturer of diodes, transistors, MOSFETs, and voltage regulators for automotive, commercial, and industrial-grade applications. The award ...

8 May 2026 | Friday | NEWS
Liftr Insights Launches Predictive AI Scorecard for Hedge Funds and Semiconductor Markets

Liftr Insights announces the release of the Liftr® Indicator Scorecard™, a next-generation market intelligence index. This unique tool will fundamentally change how hedge funds and financial services firms identify, evaluate, and act on emerging signals across semiconductors, cloud providers, and AI infrastructure. The Indicator Scorecard introduces a scoring-based framew...

8 May 2026 | Friday | NEWS
SPARK Microsystems Wins Semiconductor Innovation Award for LE-UWB Transceiver

SPARK Microsystems, a Canadian fabless semiconductor company specialising in next-generation short-range wireless communications, announced that its SR1120 LE-UWB™ wireless transceiver has been honoured as a recipient of the Product Innovation Award in conjunction with the Semiconductor Achievement Awards hosted by Canada's Semiconductor Council (CSC). Presented last night at the&...

8 May 2026 | Friday | NEWS
The Race To Ultra Low Power AI Begins With POLYN Technology’s NASP Breakthrough

In this interview with Semicon Leaders Asia, Eugene Zetserov highlights how POLYN’s NASP technology is redefining edge intelligence by embedding AI directly into sensor-level silicon, eliminating the need for conventional digital processing overhead. By enabling ultra-low power consumption and microsecond-level response times, it unlocks new possibilities for alwa...

7 May 2026 | Thursday | Interaction
Gemtek Technology Company Ltd Launches 1.6T AiPhoton OSFP Transceiver for AI Data Centres

Gemtek Technology Company Ltd, a global leader in advanced networking solutions, announced the AiPhoton 1.6T OSFP transceiver. Built in collaboration with NewPhotonics®, a pioneer in photonic integrated circuits, the module features the NPG10204 DR8 PIC transmitter-on-chip. This latest PIC-based pluggable enables simplified manufacturing of photonic ICs delivering advanced DSP functionality in...

7 May 2026 | Thursday | NEWS
Uviquity Unveils World’s First 229 nm Chip-Scale Deep-UV Laser

Uviquity, a deep-tech company developing integrated photonics for ultraviolet wavelengths, announced its first product: a chip-scale laser operating at 229 nm. This laser is the first in the world at this wavelength produced from a single semiconductor chip, delivering collimated, narrow-linewidth, spectrally pure output suitable for demanding analytical and inspection applications. Uviquity will ...

7 May 2026 | Thursday | NEWS
Johnson Controls Unveils Air-Cooled Chiller Guide for AI Data Centres

Johnson Controls (NYSE: JCI), a global leader in thermal management, mission-critical building systems, energy efficiency, and decarbonization, is expanding its AI Factory Reference Design Guides with the launch of its second guide, focused on air-cooled chillers. Building on the company's water‑cooled chiller guide released in February, this latest blueprint marks the next s...

7 May 2026 | Thursday | NEWS

Asia Pacific

Europe

United States of America