As AI, HPC, and 5G drive semiconductor innovation, advanced packaging has become the next strategic focus. Yole Group projects the market to exceed USD 50 billion by 2025, with fan-out panel-level packaging (FOPLP) growing more than 15% annually. E&R Engineering (TPE: 8027) will present its latest laser and plasma solutions at SEMICON Taiwan 2025, covering FOPLP, Through-Silicon Via (T...
Semiconductor and electronics supply chains are undergoing a major transformation, driven by the rapid growth of artificial intelligence (AI), changing market leadership, and global supply chain relocation, according to DIGITIMES. DIGITIMES vice president Eric Huang highlighted the shift in global industry power before and after the generative AI boom. In 2018, five technology companies ranked ...
iDEAL Semiconductor has announced the first of its 200 V family of SuperQ™-based MOSFETs has entered mass production, with four additional 200 V devices now sampling. SuperQ is the first major advance in silicon MOSFET technology in more than 25 years, breaking through long-standing limits in switching and conduction. It delivers a step-change in performance and efficiency while preservin...
Axcelis Technologies, Inc., a leading supplier of enabling ion implantation solutions for the semiconductor industry, has announced the launch of the Company's GSD Ovation™ ES high current ion implanter, targeted specifically for engineered substrates. Executive Vice President Dr. Greg Redinbo, commented, "We're excited to introduce the GSD Ovation ES. The GSD Ovation ES enable...
EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With...
d-Matrix® announced the expansion of its AI product portfolio with d-Matrix JetStream™, a custom I/O card designed from the ground up to deliver industry-leading, data center–scale AI inference. With millions of people now using AI services – and the rise of agentic AI, reasoning, and multi-modal interactive content – the industry's focus is quickly shifting fro...
ROHM Co., Ltd. has announced that its ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry's lowest operating circuit current (*1). This IC is optimized to be applied as a measurement-sensing amplifier in size-constrained applications such as handheld measurement instruments, wearable devices, and indoor motion detectors. Figures: Product features: https://cdn.kyod...
PI (Physik Instrumente), a global leader in precision motion control and nano-positioning technologies, offers its Nanopositioning & Micropositioning Essentials portfolio, delivering core components with reduced lead times and volume discounts tailored for OEMs in research, automation, and advanced manufacturing. This curated Essentials product line features high-precision building blo...
Valens Semiconductor announced that Samsung is supporting the MIPI A-PHY standard for high-speed sensor connectivity and is partnering with Valens Semiconductor to develop the next generation of MIPI A-PHY products, in response to strong market demand from global OEMs. Valens and Samsung have a long history of collaboration. Samsung was among the earlier investors in Valens, and the two co...
AP Memory, a leading global design company providing customized memory solutions, announced that its next-generation PSRAM—ApSRAMTM (Attached-pSRAM)—has successfully passed customer validation and is scheduled to begin mass production by the end of the year. ApSRAMTM is an advanced version of AP Memory's PSRAM (Pseudo Static Random Access Memory), featuring a new architecture optimiz...
Lam Research Corp. unveiled VECTOR® TEOS 3D, a breakthrough deposition tool engineered specifically for the advanced packaging of next-generation chips required for artificial intelligence (AI) and high-performance computing (HPC) applications. TEOS 3D is purpose-built to solve critical challenges in 3D stacking and high-density heterogeneous integration. It provides ultra-thick, ...
MPI Corporation, a global leader in advanced semiconductor test solutions, announced the release of a fully integrated 250 GHz broadband test solution for the new Keysight NA5305A/7A PNA-X Frequency Extender, that builds on its deep expertise in sub-terahertz probing and on-wafer measurements. The new system leverages MPI's TITAN™ RF Probes and probe station platform to de...
DB HiTek, a leading 8-inch specialty foundry, announced it is in the final stages of development of its 650V E-Mode GaN HEMT (Gallium Nitride High-Electron Mobility Transistor) process, a next-generation power semiconductor platform. The company is also to offer a dedicated GaN MPW (multi-project wafer) program at the end of October. Compared with traditional silicon-ba...
SK hynix Inc. (or "the company", www.skhynix.com) announced that it has completed development and finished preparation of HBM4*, a next generation memory product for ultra-high performance AI, mass production for the world's first time. SK hynix said that the company has successfully completed development and based on this technological achievement, the company has prepared HBM4 mass production t...
Lam Research Corp. a global leader in semiconductor fabrication equipment and services, and JSR Corporation, a leading technology company focused on materials innovation solutions and the parent company of Inpria Corporation, a metal oxide photoresist solution provider, today announced that Lam and JSR/Inpria have entered into a non-exclusive cross-licensing and collaboration...
OPROCESSOR INC, incorporated in Boston, Massachusetts in 2018 with research operations in Daejeon, South Korea, announced a breakthrough in VCSEL-based Photonic Interposer technology that overcomes the GPU–HBM interconnect bottleneck for next-generation AI and high-performance computing systems. The pioneering work was published in Photonics (MDPI, August 29, 2025) and will be presented a...
Grinn, a full-cycle technology company specializing in the design and development of advanced IoT and embedded solutions, has announced the launch of a strategic partnership with MediaTek which will help it to extend the implementation of advanced AI and IoT technologies based on its off-the-shelf embedded computing systems. The first fruit of the partnership is the creation of a family of ...
WiMi Hologram Cloud Inc., a leading global Hologram Augmented Reality ("AR") Technology provider, announced that they are exploring an innovative solution—Synergic Quantum Generative Network (SQGEN). The core of SQGEN lies in its parallel quantum learning framework. In SQGEN, the generator and discriminator components run simultaneously within a quantum computing environment, interacting t...
iDEAL Semiconductor confirms that its ultra-efficient SuperQ™ silicon power devices are now in production at Polar Semiconductor, a leading foundry specializing in high-voltage, power, and sensor technologies. SuperQ represents the first major innovation in silicon MOSFET architecture in over 25 years. Leveraging a patented asymmetrical RESURF structure, it significantly reduces conductio...
Qnity, DuPont Electronics, ("Qnity"), a premier technology solutions leader across the semiconductor value chain, hosted an Investor Day at the New York Stock Exchange. Video recordings of the presentation are now available to view via web replay on Qnity's Investor Relations site: https://ir.qnityelectronics.com/. This was Qnity's inaugural Investor Day, in advance of the intended separation f...