• Sunday | 27 September 2026
BYD’s Semiconductor Strategy Strengthens China’s Automotive Chip Self-Reliance

The global automotive industry is entering a new phase in which semiconductors are becoming as strategically important as batteries, motors and manufacturing scale. As vehicles evolve into software-defined, AI-enabled platforms, chips increasingly determine everything from power management and cockpit functions to advanced driver-assistance systems. At the same time, geopolitical tensions and tech...

8 Sep 2026 | Tuesday | NEWS
Hyosung Heavy Industries Expands US Power Infrastructure for AI Data Centres

The rapid expansion of artificial intelligence (AI) and data-centre infrastructure is creating a new set of challenges for electricity generation, transmission and distribution, particularly in the United States. Rising power consumption from AI workloads, combined with the need to modernise ageing grid infrastructure, is prompting significant investment in technologies capable of delivering more ...

8 Sep 2026 | Tuesday | NEWS
proteanTecs and MegaChips Partner to Enhance ASIC and LSI Silicon Visibility

ProteanTecs®, the leading provider of health and performance management solutions for advanced electronics, announced it is collaborating with MegaChips on the integration of ProteanTecs’ embedded monitoring technology into MegaChips’ next-generation ASIC and LSI digital systems. The joint work will focus on bringing deep silicon visibility across development, production and in-fi...

7 Sep 2026 | Monday | NEWS
Bruker BEST and Luvata Partner to Scale Superconductors for Fusion Energy

Bruker Energy & Supercon Technologies (BEST), a segment of Bruker Corporation (Nasdaq: BRKR), and Luvata Materials & Solutions, a Business Unit of Luvata Group (LUVATA), announced a strategic collaboration to support the rapidly growing demand for superconducting materials and technologies required by next-generation magnetic confinement fusion power demonstration plant projects ...

7 Sep 2026 | Monday | NEWS
Manz Asia and SUSS Partner to Advance Inkjet Solutions for Semiconductor Packaging

A leading manufacturer of advanced semiconductor packaging equipment, Manz Asia, announced a strategic collaboration with SUSS, a leading manufacturer of equipment and process solutions for the semiconductor industry, to jointly advance next-generation inkjet solutions for semiconductor manufacturing and advanced packaging applications. As semiconductor manufacturing moves toward higher integrati...

7 Sep 2026 | Monday | NEWS
Sivers Semiconductors Invests $30M to Expand InP Laser Manufacturing in Scotland

Sivers Semiconductors AB (STO: SIVE) announced a USD 30 million strategic investment to significantly expand its Indium Phosphide (InP) manufacturing facility in Glasgow, Scotland, as the company prepares for anticipated customer production ramps driven by growing AI datacenter and optical networking demand. Upon completion, the expanded facility is expected to support annual production of m...

4 Sep 2026 | Friday | NEWS
MulticoreWare Acquires Simulus Automation to Expand Semiconductor Design and Verification

MulticoreWare, Inc., a global technology company delivering AI software solutions, accelerated computing technologies, and advanced engineering services, announced the acquisition of Simulus Automation Pvt. Ltd., a semiconductor design and verification specialist serving customers developing SoCs, chipsets, and accelerator technologies. The industry is shifting toward hardware-software co-design....

4 Sep 2026 | Friday | NEWS
Baya Systems and AdoreSys Partner to Expand Chiplet and Data-Movement Solutions Across APAC

Baya Systems, an innovator in software-driven fabric and system IP solutions, and AdoreSys, a leading semiconductor design solutions provider, announced a strategic partnership to offer Baya’s WeaveIP™ fabric and WeaverPro™ software platform together with AdoreSys’ ASIC design, integration and implementation expertise as a unified solution for semiconductor and systems comp...

4 Sep 2026 | Friday | NEWS
SEEQC and Taiwan Strengthen Quantum Computing Supply Chain Collaboration

SEEQC, Inc. (“SEEQC” or the “Company”), a chip-based quantum computing company, announced the signing of a Memorandum of Understanding (“MOU”) with Taiwan’s Quantum Industry Technology Promotion Office to expand cooperation and exchange across quantum technology and the emerging global quantum supply chain. The MOU was signed by SEEQC Chief Technology Off...

4 Sep 2026 | Friday | NEWS
Mouser and Qorvo Advance Agile RF Solutions for Drones and Satellite Communications

Mouser Electronics, Inc., the New Product Introduction (NPI) leader™ empowering innovation, announces a new eBook in collaboration with Qorvo, exploring next-generation RF wireless designs for drones, satellite communications and industrial IoT. High-Performance RF Solutions for Agile New Markets addresses time-to-market pressures, coexistence issues, power-efficienc...

4 Sep 2026 | Friday | NEWS
Semiconductor Packaging Services Market to Reach US$118.59 Billion by 2035

The global semiconductor packaging services market is expected to expand significantly over the coming decade as rising demand for artificial intelligence (AI), high-performance computing (HPC), high-bandwidth memory (HBM) and chiplet-based architectures increases the need for sophisticated packaging and testing capabilities. According to DataM Intelligence, the market was valued at US$44.50 billi...

3 Sep 2026 | Thursday | NEWS
Wafer-Scale P-Type 2D Semiconductor Clears Key Hurdle for Next-Generation Chips

Researchers have made progress towards addressing one of the major challenges facing two-dimensional semiconductor technology: developing a stable, high-performance p-type material that can be produced across wafer-scale substrates. The advance could support the development of future complementary metal-oxide-semiconductor (CMOS) technologies as the semiconductor industry explores alternatives to ...

3 Sep 2026 | Thursday | NEWS
Andes Technology Cuts Chip Design and Verification Time with ChipAgents AI

ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced that Andes Technology, a leading supplier of RISC-V processor IP and a Founding Premier member of RISC-V International, has successfully deployed ChipAgents across multiple processor design and verification projects. In production deployments, Andes reduced a processor customisation task f...

3 Sep 2026 | Thursday | NEWS
Everspin and Teledyne HiRel Expand MRAM Solutions for Aerospace and Defence

Everspin Technologies, Inc. (NASDAQ: MRAM), the world’s leading developer and manufacturer of MRAM solutions, and Teledyne HiRel Semiconductors (Teledyne HiRel), a business unit of Teledyne Technologies Incorporated (NYSE: TDY) and a leading supplier of high-reliability semiconductor solutions, announced a strategic partnership to accelerate adoption of Everspin’s MRAM in aerospace, de...

3 Sep 2026 | Thursday | NEWS
Navitas Delivers 5th-Generation GaNFast Technology Through US Manufacturing Partnership

Navitas Semiconductor has announced the delivery of its latest fifth-generation GaNFast power semiconductor technology, manufactured in the United States through its strategic collaboration with GlobalFoundries. The development represents a step towards strengthening domestic production of gallium nitride (GaN) power devices as demand increases for more efficient power conversion across artificial...

3 Sep 2026 | Thursday | NEWS
Kulicke & Soffa Expands Advanced Packaging Solutions for AI and CPO

Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S", "we" or the "Company"), a global leader in semiconductor and electronics assembly solutions, continues to strengthen its position as a critical enabler of next-generation artificial intelligence (AI) infrastructure through its advanced packaging portfolio, inc...

2 Sep 2026 | Wednesday | NEWS
EV Group Advances CPO Manufacturing for AI Data Centres and HPC

EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, announced that it is actively engaged with customers and partners across the rapidly evolving co-packaged optics (CPO) ecosystem to support the needs of hyperscale data centers, AI infrastructure and high-performance computing (HPC) ap...

2 Sep 2026 | Wednesday | NEWS
GigaDevice Joins Zephyr Project to Expand GD32 MCU Open-Source Ecosystem

GigaDevice, a leading semiconductor company specialising in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, has officially joined the Zephyr® Project, one of the world’s leading open-source real-time operating systems (RTOS). Hosted by the Linux Foundation®, the Zephyr® Project welcomes GigaDevice as a Silver Member, making Gig...

2 Sep 2026 | Wednesday | NEWS
Teradyne Launches Three UltraFLEXplus Instruments for AI Semiconductor Testing

Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, announced the launch of three new instruments for its UltraFLEXplus platform, designed to meet the increasingly complex demands of AI and data center semiconductor testing. The UltraPin5000-EM, UltraPort-PCIe6, and UltraVS64-HP instruments are designed to deliver unmatched scalability, fle...

2 Sep 2026 | Wednesday | NEWS
Butterfly Network Partners with Merge Labs on Ultrasound-Based Brain-Computer Interfaces

Butterfly Network, Inc. ("Butterfly") (NYSE: BFLY), a pioneer and leader in semiconductor-based ultrasound, programmable cloud software and AI, and Merge Labs announced a multi-year licensing agreement through Butterfly Embedded™. The agreement gives Merge access to Butterfly’s Poseidon Family of Ultrasound-on-Chip™ technology for the development of ultrasound-base...

2 Sep 2026 | Wednesday | NEWS

Asia Pacific

Europe

United States of America