• Tuesday | 12 May 2026
Mitate Zepto Technica, Inc. Partners in National AI Semiconductor Initiative to Advance Genome Analysis

Mitate Zepto Technica, Inc. (hereinafter "MZT"), based in Tokyo's Shibuya district, announced that it has joined the national research initiative "Next-Generation Edge AI Semiconductor Research and Development Program" promoted by the Japan Science and Technology Agency (JST). MZT participates as a designated social implementation and commercialisation partner for the research theme "Accelerating ...

21 Apr 2026 | Tuesday | NEWS
SK hynix Inc. Begins Mass Production of 192GB SOCAMM2 for AI Servers

SK hynix Inc. (or "the company", www.skhynix.com) announced that it has begun mass production of the 192GB SOCAMM2, a next-generation memory module standard based on the 1cnm process (sixth-generation of the 10-nanometer technology) LPDDR5X low-power DRAM. SOCAMM2[1] is a module that adapts low-power memory – previously used mainly in mobile products like smartphones - for server ...

21 Apr 2026 | Tuesday | NEWS
Global AMOLED Display Market Faces 7% Contraction in 2026, Says Omdia

AMOLED smartphone display shipments are expected to decline sharply in 2026 amid rising memory prices and increasing market uncertainty, according to Omdia’s latest OLED Display Market Tracker. A surge in memory prices since the second half of 2025 has significantly increased component costs for smartphones, putting pressure on pricing for new models in 2026. Chinese smartphone brands,...

21 Apr 2026 | Tuesday | NEWS
Cirrus Logic Expands Industrial Portfolio with New Imaging IC Family

Cirrus Logic (NASDAQ: CRUS) announced the launch of a new family of industrial imaging integrated circuits (ICs) designed for high-precision scanning systems. This expands Cirrus Logic’s industrial portfolio and delivers a high-performance, highly integrated analogue front-end solution for multi-function printers, scanners, and advanced industrial imaging platforms. Designed for applic...

20 Apr 2026 | Monday | NEWS
Toshiba Electronic Devices & Storage Corporation Launches SmartMCD Motor Control Device for Automotive Electrification

Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has begun shipping engineering samples of “TB9M030FG,” the latest addition to its “SmartMCD™”[1] series of motor control devices. The new device integrates a microcontroller (MCU) and a motor driver, and incorporates sensorless control technology for low‑speed operation of threeâ€...

20 Apr 2026 | Monday | NEWS
Teradyne Acquires TestInsight to Strengthen Semiconductor Test Capabilities

Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment (ATE) and advanced robotics, announced it has acquired TestInsight, a leading provider of semiconductor test development, validation, and conversion software widely used across the industry. TestInsight's advanced tools and expert team will be pivotal in accelerating the development of test solutions on Teradyne...

20 Apr 2026 | Monday | NEWS
Cadence Design Systems and Google Cloud Partner to Advance AI-Driven Chip Design

Cadence, an industry leader in AI-driven computational software for semiconductor and system design, announced a strategic collaboration with Google to optimise the Cadence® ChipStack™ AI Super Agent with Gemini on Google Cloud. This collaboration positions Cadence at the forefront of the shift toward agentic design automation, creating an agent-driven, scalable, cloud-native platfo...

20 Apr 2026 | Monday | NEWS
Nuvoton Technology Corporation Japan Advances High-Power Violet Laser Diodes for Semiconductor Packaging

Nuvoton Technology Corporation Japan (hereinafter "NTCJ") announced that it will start mass production of a "high-power violet laser diode (402 nm, 4.5 W)" that achieves industry-leading-class (*1) optical output in a 9.0 mm diameter CAN package (TO-9) in May. This product achieves 1.5 times the optical output compared to NTCJ's conventional product (*2) through its proprietary device structure an...

20 Apr 2026 | Monday | NEWS
Iceotope Expands IP Portfolio Amid Rising Demand for AI Infrastructure Cooling

Iceotope, the global pioneer in precision liquid cooling for AI infrastructure, announced it reached a significant intellectual property (IP) milestone: more than 200 patents granted and pending. The achievement underscores the company's technology leadership in solving one of the AI industry's most pressing challenges: efficiently cooling increasingly powerful computing systems to maximise perfor...

17 Apr 2026 | Friday | NEWS
ACCM Introduces Breakthrough Materials to Solve AI Accelerator Packaging Constraints

Advanced Chip and Circuit Materials announces the commercial availability of Celeritas HM50 and Celeritas HM001, which eliminate the root causes of warpage, package bow, solder fatigue, and high-frequency signal loss in large-format AI accelerators and advanced chip packaging architectures. Celeritas HM50 is a negative CTE (-8 PPM/°C) material, and Celeritas HM001 is a near-zero CTE material. ...

17 Apr 2026 | Friday | NEWS
QuickLogic Expands Sales Network with Quantum Leap Solutions Partnership

QuickLogic Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) Hard IP, Strategic Radiation Hardened, Antifuse and ruggedised FPGAs, announced the appointment of Quantum Leap Solutions as an authorised sales representative. Quantum Leap Solutions will represent QuickLogic's portfolio of IP and chiplet-related offerings, expanding customer engagement across strategic markets. Qua...

17 Apr 2026 | Friday | NEWS
Silicon Box Expands Automotive Strategy with imec Chiplet Consortium Membership

Silicon Box, an industry leader in advanced semiconductor packaging solutions, announced that it has formally joined imec's Automotive Chiplet Program (ACP), a collaborative research initiative aimed at accelerating chiplet technology adoption required to drive the development of next-generation vehicles. Chiplet technology is recognised as a critical solution to address rising costs and bottlenec...

17 Apr 2026 | Friday | NEWS
Molex to Acquire Teramount to Accelerate Co-Packaged Optics Adoption

Molex, a global electronics leader and connectivity innovator, announced an agreement to acquire Teramount Ltd., an Israel-based developer of detachable fibre-to-chip connectivity solutions optimised for high-volume Co-Packaged Optics (CPO) and other silicon photonics applications. Teramount's TeraVERSE® platform, based on its universal photonic coupler and wafer-level self-aligning optics, pr...

17 Apr 2026 | Friday | NEWS
Sivers Semiconductors and Jabil Partner to Develop 1.6T Optical Transceivers for AI Data Centres

Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, announced a collaboration with Jabil, a global engineering, supply chain, and manufacturing solutions provider. Through this collaboration, Jabil plans to develop a 1.6T linear receive optical (LRO) transceiver module using Sivers' high-performance Distributed Feedback (DFB) laser...

16 Apr 2026 | Thursday | NEWS
West-MEC Launches Nation’s First K–12 Semiconductor Cleanroom to Strengthen Workforce Pipeline

Western Maricopa Education Centre (West-MEC) officially celebrated the grand opening of its Advanced Manufacturing Cleanroom on April 13, marking a historic milestone as the nation's first K–12 CTE semiconductor cleanroom of its size. West-MEC extends a special thank you to Advanced Technologies Consultants (ATC), McCarthy Building Companies, and Grace Design Studios for their outstanding e...

16 Apr 2026 | Thursday | NEWS
Celera Semiconductor Appoints Jeff Sexton as VP of Worldwide Sales

Celera Semiconductor, the leading analogue IC supplier using AI to slash the cost and time to develop and supply analogue ICs, announced the appointment of Jeff Sexton as vice president of Worldwide Sales. "We are very pleased to welcome Jeff to Celera to lead our global sales team," said Patrick Brockett, CEO of Celera Semiconductor. "Jeff is an accomplished leader with a proven track record of ...

16 Apr 2026 | Thursday | NEWS
Silanna UV Expands UVC LED Portfolio with New TO-39 Package for Advanced Sensing Applications

Silanna UV, a global innovator in ultraviolet semiconductor technology, announced the release of an additional package type: a TO-39 flat window package for its high-performance SF1 series (Far-UVC 235 nm) and SN3 series (Deep-UVC 255 nm) LEDs. This latest development expands the company's comprehensive metal–can UVC LED portfolio, delivering greater optical flexibility, compact integration,...

16 Apr 2026 | Thursday | NEWS
IonQ Secures DARPA Contract to Advance Networked Quantum Computing Architectures

IonQ (NYSE: IONQ), the world’s leading quantum technology company, announced that it has been awarded a contract in the Defence Advanced Research Projects Agency (DARPA)’s Heterogeneous Architectures for Quantum (HARQ) program. As a part of HARQ, IonQ plays a critical role in enabling a new class of networked quantum computers that combine distinct qubit types—such as trapped io...

15 Apr 2026 | Wednesday | NEWS
VLSI TSA 2026 Highlights Next Wave of AI, Quantum, and Semiconductor Innovation

The 2026 International Symposium on VLSI Technology, Systems and Applications (VLSI TSA), hosted by the Industrial Technology Research Institute (ITRI), is taking place in Hsinchu, Taiwan. Now in its 43rd year, the symposium remains a leading global forum for semiconductor innovation, bringing together over 800 experts from around the world. Discussions this year focus on generative AI infere...

15 Apr 2026 | Wednesday | NEWS
LZE and Karl Kruse Partner to Scale Commercialisation of Advanced Magnetic Sensors

The mission of LZE GmbH is to translate technologies from research into products and, as a fabless semiconductor company, to bring high‑performance integrated circuits and semiconductor solutions to market. This also applies to the unique FH3DXX family of 3D magnetic field sensors, which is based on the innovative HallinOne® technology developed by Fraunhofer IIS and has already been success...

15 Apr 2026 | Wednesday | NEWS

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