• Monday | 27 October 2025
Tekscend Photomask Installs Europe's First SLX1 Laser Writer to Boost Regional Chip Manufacturing

Tekscend Photomask (formerly Toppan Photomask), the world's largest merchant photomask supplier for the semiconductor industry, has installed a state-of-the-art photomask laser writing system, the SLX1, at its Corbeil, France facility. This marks the first European deployment of the SLX1 system, manufactured by Swedish technology leader, Mycronic AB.  The new system represents a strat...

28 Sep 2025 | Sunday | NEWS
Baya Systems Honored with 2025 Global Technology Innovation Leadership Recognition by Frost & Sullivan

Frost & Sullivan is pleased to announce that Baya Systems has been recognized with the 2025 Global Technology Innovation Leadership Recognition in the semiconductor IP interconnect solutions industry for its outstanding achievements in product innovation, strategic execution, and customer impact. This recognition highlights Baya Systems' consistent leadership in driving measurable ...

28 Sep 2025 | Sunday | NEWS
Delta Opens Smart Manufacturing Innovation Center in Taiwan, Launches Joint Cyber-Physical Classroom with NVIDIA

Delta, a global leader in power management and smart green solutions, inaugurated in Taiwan its Smart Manufacturing Innovation Center, a strategic hub for equipment validation and talent training programs to support customers implementing geographically-distributed production and smart centralized management. At this one-stop platform site featuring hands-on training as well as production verifi...

28 Sep 2025 | Sunday | NEWS
Ceva Named #1 Wireless Connectivity IP Vendor by IPnest, Holding 68% Market Share

Reinforcing the company's pivotal role in enabling the intelligent, connected world, Ceva, Inc., the leading licensor of silicon and software IP for the Smart Edge, announced it has once again been named the #1 vendor in Wireless Connectivity IP by IPnest in its latest 2025 Design IP Report. Ceva grew its wireless connectivity IP market share to 68% in 2024 - more than 10 times la...

28 Sep 2025 | Sunday | NEWS
SuperX Launches XN9160-B200 AI Server Powered by NVIDIA Blackwell B200 GPUs

Super X AI Technology Limited (Nasdaq: SUPX) ("Company" or "SuperX") announced the launch of its latest flagship product — the SuperX XN9160-B200 AI Server. Powered by NVIDIA's Blackwell architecture GPU (B200), this next-generation AI server is engineered to meet the rising demand for scalable, high-performance computing in AI training, machine learning (ML), and high-performance com...

28 Sep 2025 | Sunday | NEWS
iDEAL Semiconductor Partners with Richardson Electronics to Expand Reach of Breakthrough SuperQ Power MOSFETs

iDEAL Semiconductor, a fabless power semiconductor company focused on delivering breakthrough efficiencies, has announced it will partner with Power and RF  specialist, Richardson Electronics. Under the agreement, iDEAL will gain access to Richardson Electronics' design teams and sales specialists to expand the reach of its ultra-efficient, high-performance power MOSFETs, which are based o...

28 Sep 2025 | Sunday | NEWS
Open Compute Project Advances Silicon Diversity with New Universal D2D Transaction and Link-Layer Spec Covering UCIe

The Open Compute Project Foundation (OCP), the nonprofit organization bringing hyperscale innovations to all, announces it has taken important steps in enabling silicon diversity for high-performance AI and HPC Clusters with the release of a new Universal D2D Transaction and Link-Layer specification that now also covers UCIe. This universal link layer will be an important part of the e...

28 Sep 2025 | Sunday | NEWS
Quantum Computing Inc. Secures Landmark NIST Contract and Major Fortune 500 Order for Advanced Photonic Integrated Circuits

Quantum Computing Inc. ("QCi" or the "Company"), an innovative, integrated photonics and quantum optics technology company, announced it has been awarded a contract by the National Institute of Standards and Technology (NIST), part of the U.S. Department of Commerce, for the design and fabrication of thin-film lithium niobate (TFLN) photonic integrated circuits (PICs). In addition, the Comp...

28 Sep 2025 | Sunday | NEWS
NEO Semiconductor Unveils World’s First Extreme High Bandwidth Memory (X-HBM) Architecture for Next-Gen AI Chips

NEO Semiconductor, a leading developer of breakthrough memory technologies, introduced the world's first Extreme High Bandwidth Memory (X-HBM) architecture for AI chips. Built to meet the growing demands of generative AI and high-performance computing, X-HBM delivers unmatched performance with a 32K-bit data bus and potentially 512 Gbit per die, dramatically surpassing the limitations of tra...

28 Sep 2025 | Sunday | NEWS
Ceva Surpasses 20 Billion Devices Shipped, Ushering in the Next Era of Smart Edge AI

In a world increasingly shaped by intelligent devices that connect, sense, and perceive our surroundings, Ceva, Inc., the leading licensor of silicon and software IP for the Smart Edge, today announced it has surpassed 20 billion Ceva-powered devices shipped globally. This milestone not only cements Ceva's legacy as a foundational technology provider of the mobile and IoT eras, but sets the...

28 Sep 2025 | Sunday | NEWS
Cyient Semiconductors and GlobalFoundries Forge Strategic Channel Partnership to Accelerate Custom Silicon Innovation

Cyient Semiconductors Private Limited, a fast-growing custom silicon company, announced a strategic Channel Partner Agreement with GlobalFoundries (GF), one of the world's leading pure-play semiconductor foundries. Under the agreement, Cyient Semiconductors becomes an authorized reseller of GF's semiconductor manufacturing services and technologies. This collaboration is a significant step towa...

28 Sep 2025 | Sunday | NEWS
Nobody 2" to Hit Premium Screens with Pixelworks' TrueCut Motion for Unmatched Action Clarity

Pixelworks, Inc., announced that Universal Pictures' Nobody 2will be presented with TrueCut Motion™ technology on selected premium screens worldwide.  Under the direction of the filmmakers, the Pixelworks motion grading team utilized advanced TrueCut Motion technology to bring stunning motion clarity to the new chapter from the bare-knuckle action-thriller, Nobody, which opened at num...

28 Sep 2025 | Sunday | NEWS
SiMa.ai Launches Modalix™ MLSoC to Power Physical AI at the Edge Under 10 Watts

Modalix™, a second-generation Machine Learning System on a Chip (MLSoC™) purpose built to lead the Physical AI industry, delivers industry-leading performance and accuracy without sacrificing power—supporting LLMs, transformers, CNNs, and GenAI workloads under 10 watts. Its flexible, Arm-based architecture with a native GenAI stack enables real-time perception, decision-making,...

28 Sep 2025 | Sunday | NEWS
Pixelworks X7 Gen 2 Powers Visual Excellence in Newly Launched realme P4 5G and P4 Pro 5G Smartphones

Pixelworks, Inc., a leading provider of visual processing solutions, announced that the newly launched realme P4 5G and P4 Pro 5G smartphones incorporate Pixelworks' X7 Gen 2 visual processor. The realme P4 series smartphones are the first models in the P series to integrate a dedicated visual processor solution aimed at setting a new benchmark for mid-range international market segment. Powered...

28 Sep 2025 | Sunday | NEWS
SK hynix Begins Mass Production of World’s First 321-Layer 2Tb QLC NAND Flash

SK hynix Inc. (or 'the company', www.skhynix.com) announced that it has completed development of its 321-layer 2Tb QLC NAND flash product and has begun mass production. This achievement marks the world's first implementation of more than 300 layers using QLC technology, setting a new benchmark in NAND density. The company plans to release the product in the first half of next year foll...

28 Sep 2025 | Sunday | NEWS
Sony Showcases Real-World Edge AI Traffic Solutions at ITS World Congress 2025

ITS WORLD (Booth #1605) – Sony Semiconductor Solutions announced its participation at the upcoming ITS World Congress, where it will highlight two groundbreaking municipal deployments of its advanced edge AI sensing technologies a road safety initiative in Lakewood, Colorado, and a comprehensive traffic management pilot with the City of San José, California. These real-world e...

28 Sep 2025 | Sunday | NEWS
OpenLight Closes $34M Series A to Accelerate Photonic Chip Innovation for AI-Driven Data Centers

OpenLight, a leader in custom Photonic Application-Specific Integrated Circuit (PASIC) chip design and manufacturing based on heterogeneous integration, today announced the close of its oversubscribed $34MSeries A. The round is co-led by Xora Innovation and Capricorn Investment Group. Other participants include Mayfield; Juniper Networks, now part of HPE; Lam Capital, the corporate venture ...

28 Sep 2025 | Sunday | NEWS
Marvell Unveils Industry’s First 2nm 64 Gbps Bi-Directional D2D Interconnect for Next-Gen XPUs

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced the industry's first 2nm 64 Gbps bi-directional die-to-die (D2D) interconnect, enabling chip designers to significantly boost the bandwidth and performance of next-generation XPUs while reducing power and silicon area. Delivering 32 Gbps of simultaneous two-way connectivity over a single wire, the interf...

28 Sep 2025 | Sunday | NEWS
Aion Silicon Joins Intel Foundry’s Value Chain Alliance to Deliver Full-Stack Custom SoC Solutions

Aion Silicon (formerly Sondrel), a leading ASIC and SoC architecture partner, announced its membership in the Intel Foundry Accelerator Value Chain Alliance (VCA). As a VCA partner, Aion Silicon expands its existing turnkey service offerings to deliver full-stack custom silicon—from architecture through packaged silicon—across multiple market segments and geographies. This new allia...

28 Sep 2025 | Sunday | NEWS
Socionext Advances 3DIC Innovation with TSMC SoIC-X Tape-Out for AI and HPC Applications

Socionext, the Solution SoC company, announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of complete solutions for consumer, AI, and HPC data center applications that include chiplets, 2.5D, 3D, and 5.5D packaging. Socionext empowers customers with a proven development process and unmatched expertise delivering high-performance, high-quality sol...

28 Sep 2025 | Sunday | NEWS

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