• Monday | 27 October 2025
Reed Semiconductor Sues Monolithic Power Systems for Patent Infringement

Reed Semiconductor Corp., a global leader in the design, development, and manufacture of advanced semiconductor solutions, announced that it has filed a patent infringement lawsuit (Case No. 6:25-cv-00449) in the United States District Court for the Western District of Texas against Monolithic Power Systems, Inc. (MPS). The lawsuit alleges infringement of U.S. Patent No. 7,960,955, which covers ...

7 Oct 2025 | Tuesday | NEWS
SmartSoC Solutions and France’s Cortus Forge Strategic Partnership to Build India’s Secure Chip Ecosystem

SmartSoC Solutions Private Limited, an Indian semiconductor design and product engineering company, today announced a strategic partnership with Cortus S.A.S., a French semiconductor company renowned for its cutting-edge Intellectual Property (IP) solutions in secure identification technologies. This partnership aims to drive innovation and accelerate the development and manufacturing of SIM car...

6 Oct 2025 | Monday | NEWS
Taiwan Rejects U.S. Proposal for 50-50 Split in Global Chip Production

Taiwan has firmly rejected a proposal from the U.S. Trump administration suggesting a 50-50 split in global semiconductor production. The proposal, reportedly introduced by U.S. Commerce Secretary Howard Lutnick, aimed to balance chip manufacturing between the U.S. and Taiwan. However, Taiwan's Vice Premier Cheng Li-chiun clarified that this specific arrangement was "not discussed" during the re...

6 Oct 2025 | Monday | NEWS
OpenAI Partners with South Korea’s Tech Giants to Power the Next Generation of AI Infrastructure

OpenAI announced a series of strategic partnerships with South Korean technology leaders Samsung and SK Group to accelerate the development of Stargate, a landmark $500 billion initiative aimed at building next-generation infrastructure for artificial intelligence. The announcements followed a meeting in Seoul between OpenAI CEO Sam Altman, South Korean President Lee Jae Myung, and senior execu...

6 Oct 2025 | Monday | NEWS
Alchip’s 3DIC Validation Paves Way for 2nm–3nm Stacked Architectures

Alchip Technologies, the dedicated high-performance and AI computing ASIC leader, validated its 3DIC ecosystem readiness with results from its 3DIC test chip tape out. The results vaulted Alchip into a clear 3DIC technology leadership because it validated an entire, integrated 3DIC solution, as well as its various elements.  The test chip provided CPU/NPU core demonstration, UCIe and PCIe ...

6 Oct 2025 | Monday | NEWS
QuickLogic Wins eFPGA Hard IP Contract for 12 nm Data Center ASIC

QuickLogic Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) Hard IP, Strategic Radiation Hardened, Antifuse and ruggedized FPGAs, announced  that its eFPGA Hard IP was selected for a new high-performance Data Center ASIC design that will be fabricated on an industry-proven 12 nm process technology. IP delivery for this contract is scheduled for Q4 2025. "We are excited...

3 Oct 2025 | Friday | NEWS
L&T Technology Services Secures $100 Million Multi-Year Deal to Accelerate AI-Driven Innovation for Semiconductor Equipment Client

-L&T Technology Services Limited , a global leader in AI, Digital & ER&D Consulting Services,  announced a major milestone in its Sustainability segment with the signing of a $100 million multi-year agreement with a US-based industrial equipment manufacturer catering to the semiconductor value chain. Under the terms of the agreement, LTTS will support the clients’ initiat...

2 Oct 2025 | Thursday | NEWS
Sony Unveils IMX775: Industry’s Smallest 2.1 µm Pixel RGB-IR Image Sensor for In-Cabin Monitoring

Sony Semiconductor Solutions Corporation (Sony)  announced the upcoming release of the IMX775 CMOS RGB-IR image sensor with the industry's smallest[*1] pixel size of 2.1 µm, delivering both RGB and IR imaging on a single chip and a resolution of approximately 5 effective megapixels,[*2] designed for in-cabin monitoring cameras. *1  Among CMOS image sensor...

2 Oct 2025 | Thursday | NEWS
Kioxia and Sandisk Begin Operations at State-of-the-Art Fab2 3D Flash Memory Facility in Japan

-Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation (TOKYO: 285A) and Sandisk Corporation  announced the start of operation at the Fab2 (K2), a state-of-the-art semiconductor fabrication facility, at the Kitakami Plant in Iwate Prefecture, Japan. Fab2 has the capability to produce eighth-generation, 218-layer 3D flash memory, featuring the companies’ revolutionary CBA (CM...

1 Oct 2025 | Wednesday | NEWS
Mitsubishi Electric Develops Contactless Sensor for Continuous Monitoring of Vital Body Data

  Mitsubishi Electric Corporation  announced  that it has developed a new type of contactless body data sensor that can detect minute variations in heart rates, respiration, and other vital body indicators with high precision. It will enable the continuous and accurate daily measurement of such data in situations where the use of contact-type sensors, such as smartwatches, may be d...

1 Oct 2025 | Wednesday | NEWS
MemryX Expands into Saudi Arabia to Drive AI and Semiconductor Innovation

MemryX, a leading U.S.-based semiconductor innovator specializing in AI acceleration, announced a significant expansion of its presence in the Kingdom of Saudi Arabia. Building on its strategic partnership with NEOM and recent membership in the National Semiconductor Hub, MemryX is accelerating investments in the Kingdom through hiring, training, partnerships, and local innovation initiatives. ...

1 Oct 2025 | Wednesday | NEWS
Fourier Cooling Introduces Modular, High-Density Liquid-Cooled Data Centers for AI and HPC Workloads

Fourier Cooling Solutions ("Fourier"), a next-generation company dedicated to AI and HPC data center infrastructure, announced its official launch. Fourier introduces a portfolio of prefabricated, containerized data center solutions engineered to scale in step with the rapid evolution of GPUs, CPUs, and high-computing servers, meeting the accelerating demands of artificial intelligence (AI) and ...

1 Oct 2025 | Wednesday | NEWS
Hyundai Mobis Leads First Private-Sector Automotive Semiconductor Forum in Korea

Aiming to strengthen the private-sector-led domestic automotive semiconductor ecosystem, expanding interdisciplinary cooperation across foundries, fabless companies, packaging companies, and more The company hosted the inaugural Auto Semicon Korea with the goal to localize automotive semiconductors and create a self-sustaining domestic value chain and business opportuniti...

1 Oct 2025 | Wednesday | NEWS
ShunYun Technology and NewPhotonics Forge Strategic OSAT Partnership to Accelerate High-Volume PIC Manufacturing

ShunYun Technology Ltd (SYT), a world-class manufacturer of optical transceivers, and NewPhotonics, a leading designer of highly integrated photonic integrated circuit (PIC) chips for data center optical interconnect, today announced a strategic OSAT partnership for volume manufacturing of the NewPhotonics NPG product line. Ethernet pluggable optics are forecasted to scale to >100 million by...

1 Oct 2025 | Wednesday | NEWS
NEPCON ASIA 2025 Set to Ignite Innovation in Electronics Manufacturing at Shenzhen World Expo

Taking place from October 28 to 30, 2025 at the Shenzhen World Exhibition & Convention Center (Bao'an), NEPCON ASIA is the premier platform to discover the latest technologies and market trends, connect with new suppliers and products, and explore potential partnerships and distribution opportunities. Featuring an ever-expanding showcase of automation equipment and technologies, the ...

28 Sep 2025 | Sunday | NEWS
Microelectronics UK Exhibition Launches at Excel London to Unite Industry Leaders and Innovators

Senior engineers, company leaders, investors, researchers and students of microelectronics are to have a new opportunity to meet, discover and learn with the launch of the Microelectronics UK exhibition, to be held on 24-25 September 2025 at the Excel London. The event, the first in the UK to bring together the entire microelectronics value chain, will feature zones and content for semiconducto...

28 Sep 2025 | Sunday | NEWS
SK keyfoundry and LB Semicon Co-Develop High-Reliability Direct RDL Technology for Automotive and Next-Gen Semiconductor Packaging

SK keyfoundry, an 8-inch pure-play foundry in Korea, announced that it has successfully co-developed core technology and completed reliability testing of Direct RDL (Redistribution Layer) – a core semiconductor packaging technology based on 8-inch wafers – in collaboration with LB Semicon. This achievement marks a significant step forward in advancing next-generation semiconductor pa...

28 Sep 2025 | Sunday | NEWS
FICG Accelerates AI Factory Connectivity with Advanced Optical Transceiver Packaging

As artificial intelligence continues to reshape the global economy, fiber optic connections have emerged as a key enabler of the scale and speed AI factories require. A little-known but critical component — optical transceivers — is at the core, and FIC Global Inc. (TWSE: 3701; FICG), a leading expert in packaging and installing semiconductors on optical modules, is drawing...

28 Sep 2025 | Sunday | NEWS
FICG Accelerates AI Factory Connectivity with Advanced Optical Transceiver Packaging

As artificial intelligence continues to reshape the global economy, fiber optic connections have emerged as a key enabler of the scale and speed AI factories require. A little-known but critical component — optical transceivers — is at the core, and FIC Global Inc. (TWSE: 3701; FICG), a leading expert in packaging and installing semiconductors on optical modules, is drawing...

28 Sep 2025 | Sunday | NEWS
InPsytech Tapes Out UCIE 2.0-Compliant Design on TSMC's SoIC F2F Technology

InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced that it has successfully taped out its advanced design for TSMC's Face-to-Face (F2F) SoIC technology, fully compliant with the UCIE 2.0 (Universal Chiplet Interconnect Express) standard. This milestone marks a significant achievement in enabling high-speed interconnects for heterogene...

28 Sep 2025 | Sunday | NEWS

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