• Wednesday | 10 June 2026
Keysight Technologies, Inc. Introduces AI-Ready RF Design Workflow Platform to Capture Engineering Expertise

Keysight Technologies, Inc. (NYSE: KEYS) announced a new capability within its RF Circuit Simulation Professional software, which enables engineers to capture their design process on an executable whiteboard. It replicates the engineer’s decision process, capturing simulations, optimisations, decision trees, and design parameters built on prior analyses. Each step generates editable Pyt...

1 Jun 2026 | Monday | NEWS
Qnity Electronics, Inc. Wins 2025 ASE Best Supplier Award for Advanced Packaging Materials

Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, announced it received the 2025 ASE Best Supplier Award from ASE Technology Holding Co., Ltd., one of the world’s largest outsourced semiconductor assembly and test providers (OSATs), headquartered in Taiwan, for its silicone-based materials. An honor besto...

1 Jun 2026 | Monday | NEWS
FuriosaAI and Broadcom Partner on Next-Generation AI Accelerator for Hyperscale Inference

FuriosaAI, a builder of high-performance inference silicon, announced a strategic partnership with Broadcom (NASDAQ: AVGO) to develop its third-generation AI accelerator. This collaboration evolves Furiosa’s Tensor Contraction Processor (TCP) architecture into a scale-up inference platform engineered for serving frontier agentic systems at a massive scale in a global hyperscale environment. ...

1 Jun 2026 | Monday | NEWS
RFMW Signs Global Distribution Agreement with RFHIC

RFMW, a Division of Exponential Technology Group, Inc., a premier distributor of RF, microwave, and power components, announced a global distribution agreement with RFHIC, a compound semiconductor company specialising in high-power GaN-based RF and microwave solutions for wireless infrastructure, radar, and RF energy applications. Under the agreement, RFMW will provide global technical sales supp...

1 Jun 2026 | Monday | NEWS
GigaDevice Secures Multi-Product Automotive Design Wins with Brazil’s Tury

GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, announced a broad multi-product design wins and strategic collaboration with Tury, a leading automotive electronics manufacturer in Brazil. This milestone underscores GigaDevice’s accelerating expansion into the Latin American automotive...

1 Jun 2026 | Monday | NEWS
TDK Ventures Inc. Invests in C2i Semiconductors to Boost AI Data Centre Power Efficiency

TDK Corporation (TSE:6762) announced that TDK Ventures Inc. has invested in C2i Semiconductors, a pioneer in software-defined Voltage Regulator (VR) platforms. The investment is part of C2i’s $16.7 million Series A funding round, which includes participation from Peak XV Partners and other prominent semiconductor industry leaders. Solving the “Last-Inch” power challenge As AI w...

1 Jun 2026 | Monday | NEWS
Diodes Incorporated Launches Integrated Automotive USB Type-C PD3.1 Controller for High-Power Vehicle Charging Systems

Diodes Incorporated (Diodes) (Nasdaq: DIOD) announces the APK43070Q, a highly integrated, automotive-compliant* synchronous buck controller in combination with a USB Type-C® PD3.1 source controller. This level of integration reduces the number of external components, lowers BOM cost, and simplifies the design of high-power USB Type-C charging ports. Typical applications include singl...

29 May 2026 | Friday | NEWS
Polar Semiconductor, LLC and Nexperia B.V. Partner to Expand US Power MOSFET Manufacturing Capacity

Polar Semiconductor, LLC and Nexperia B.V. announced a strategic collaboration to manufacture next‑generation power MOSFET devices at Polar Semiconductor’s U.S.-- based wafer foundry. The partnership supports an expanded power MOSFET portfolio while strengthening supply for customers worldwide. By combining Polar’s deep expertise in power semiconductor manufacturing and ongoing capa...

29 May 2026 | Friday | NEWS
Aeonsemi Begins Production Shipments of Next-Generation ChronoPHY Ethernet Transceiver for AI Edge Infrastructure

Aeonsemi (www.aeonsemi.com), an innovator of mixed-signal and DSP connectivity ICs, today announced production shipments of AS22010, the second generation of its ChronoPHY™ multi-rate 10GBASE-T Ethernet transceiver family. The AS22010 reduces typical per-port power by 40% compared to the previous generation while simultaneously improving link stability, electromagnetic interference (EMI) imm...

29 May 2026 | Friday | NEWS
MaxLinear, Inc. and GCT Semiconductor Holding, Inc. Partner to Develop Integrated 5G Fixed Wireless and Converged Gateway Platforms

MaxLinear, Inc. (Nasdaq: MXL), a leading provider of radio frequency (RF) and mixed-signal integrated circuits for datacenter connectivity, data network, and carrier access infrastructure, and GCT Semiconductor Holding, Inc. (“GCT”) (NYSE: GCTS), a leading designer and supplier of 5G semiconductor solutions enabling advanced wireless connectivity, announced a strategic partne...

29 May 2026 | Friday | NEWS
Fortress Investment Group Acquires Patent Licensing Specialist IPValue Management Group

Fortress Investment Group announced the acquisition of IPValue Management Group (“IPValue”), one of the world’s leading intellectual property (“IP”) licensing companies. Funds managed by Fortress Investment Group affiliates (“Fortress”) led a group of investors that acquired the company. “Coming off our strongest year to date, we view Fortress as un...

29 May 2026 | Friday | NEWS
Gigaphoton Inc. Expands Kyushu Operations to Strengthen Semiconductor Customer Support and Engineer Training

Gigaphoton Inc. (Head Office: Oyama, Tochigi; President and CEO: Tatsuo Enami), a manufacturer of light sources for semiconductor lithography, announced that it has installed training lasers at its Kyushu office, with operations commencing in June 2026, further strengthening its customer support capabilities. The recent growth in the semiconductor industry, driven by increasing AI demand, is...

29 May 2026 | Friday | NEWS
AISIN Corporation Selects Green Hills Software for Next-Generation AI Driver Monitoring and Alcohol Detection Platform

Automotive Engineering Exposition Green Hills Software, the worldwide leader in embedded safety and security, announces that AISIN Corporation (AISIN) has chosen Green Hills Software as the trusted software foundation for its next-generation Driver Monitoring System (DMS) with Alcohol Detection System (DADS). Today, AISIN is developing their systems with Green Hills products integrated with k...

28 May 2026 | Thursday | NEWS
Altera Partners with US Defense Innovation Unit on Next-Generation Optical Networking for Space Communications

Altera, the industry’s largest pure-play FPGA solutions provider, announced it is working with the Defense Innovation Unit (DIU) to advance the development of a highly reconfigurable coherent Free Space Optics (FSO) modem prototype for the Resilient Adaptive Zero-latency Optical Relay for Broadband All-domain Communications (RAZORBAC) program. The effort builds upon prior Space-Based Adaptiv...

28 May 2026 | Thursday | NEWS
Viewtrix Technology Debuts on Hong Kong Stock Exchange with HK$10.9 Billion Valuation

Viewtrix Technology, a portfolio company of Qiming Venture Partners and a leading display chip design enterprise in China, successfully listed on the Hong Kong Stock Exchange, marking Qiming Venture Partners' sixth IPO since the beginning of the year. Viewtrix Technology (03310.HK) offered its shares at a price of HK$20.81 per share and opened at HK$25.48 per share with a market capitalisation of ...

28 May 2026 | Thursday | NEWS
Entegris, Inc. and JSR Corporation Sign EUV Materials Cross-Licensing Deal to Strengthen Next-Generation Semiconductor Manufacturing

Entegris, Inc. (Nasdaq: ENTG), a global leader in advanced materials and purity solutions for the semiconductor industry, and JSR Corporation, a materials innovation leader and the parent company of Inpria Corporation, announced entry into a non-exclusive cross-licensing agreement aimed at helping the semiconductor industry advance extreme ultraviolet (EUV) lithography for next-generation chip man...

28 May 2026 | Thursday | NEWS
Huawei Proposes ‘Tau Scaling Law’ as Post-Moore’s Framework for Future Semiconductor Development

IEEE International Symposium on Circuits and Systems (ISCAS) in Shanghai, He Tingbo, President of HUAWEI's Semiconductor Business Department, presented the Tau (τ) Scaling Law, a proposed successor to Moore's Law for guiding semiconductor development. This law proposes replacing geometric scaling with time (τ) scaling as a new guiding principle for the evolution of both semiconductors and...

28 May 2026 | Thursday | NEWS
SEMI Foundation Launches First Regional Workforce Hubs to Strengthen US Semiconductor Talent Pipeline

The SEMI Foundation, serving as the Hub Operator for the National Network for Microelectronics Education (NNME), announced the launch of the first four Regional Nodes of the NNME, marking a major national milestone in the effort to build America's microelectronics and semiconductor workforce at unprecedented scale. Funded by the U.S. National Science Foundation Directorate for Tech...

28 May 2026 | Thursday | NEWS
Wiwynn Showcases Rack-Scale AI Infrastructure and Next-Generation Data Centre Technologies at Computex 2026

Wiwynn (6669), an innovative cloud IT infrastructure provider for data centres, today announced to showcase its vision of next-generation data centre designs at Computex 2026 (Booth #J0106, TaiNEX1). The exhibition spans cutting-edge rack-scale AI servers, developed with Wistron, breakthrough cooling technologies, optical scale-up designs, and high-voltage DC (HVDC) power delivery architectures. ...

27 May 2026 | Wednesday | NEWS
Advanced Semiconductor Engineering, Inc. Unveils Industry-First Automated Panel-Level Packaging Line for AI and HPC Applications

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) and a leading provider of semiconductor assembly and test services, announced the development of an industry-first automated 310mm × 310mm panel-level packaging production line, advancing its leadership in next-generation advanced packaging technologies. This milestone expand...

27 May 2026 | Wednesday | NEWS

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