Japanese electronic design automation (EDA) software company Zuken has joined TSMC's Open Innovation Platform (OIP) EDA Alliance, expanding its collaboration with the world's largest contract chipmaker to support the development of next-generation semiconductor devices.

As a member of the alliance, Zuken will enhance its integrated circuit packaging and printed circuit board (PCB) design solutions for multi-die and chiplet-based devices built using TSMC's advanced semiconductor manufacturing processes and packaging technologies.

TSMC's OIP EDA Alliance brings together software developers and technology partners to provide validated design flows that enable semiconductor companies to adopt the foundry's latest manufacturing processes more efficiently. The ecosystem is designed to help customers accelerate product development while improving performance, power efficiency, silicon area utilisation and time to market.

The partnership comes as demand continues to grow for advanced semiconductor technologies used in artificial intelligence, high-performance computing and automotive applications. Chipmakers are increasingly adopting chiplet architectures and heterogeneous integration to improve system performance, scalability and design flexibility, creating greater demand for sophisticated design tools.

Through its participation in the alliance, Zuken aims to strengthen support for customers developing advanced semiconductor packages by integrating its design software more closely with TSMC's manufacturing ecosystem. The collaboration is expected to simplify the design of increasingly complex multi-chip systems while improving design accuracy and engineering productivity.

The move also reinforces the industry's growing emphasis on ecosystem collaboration, with foundries, electronic design automation providers and packaging specialists working together to accelerate semiconductor innovation. As advanced packaging becomes a key differentiator for next-generation chips, closer integration between design software and manufacturing technologies is expected to play an increasingly important role in enabling faster product development and more efficient semiconductor design workflows.