• Friday | 27 March 2026
Nordic Semiconductor Launches Entry-Level Bluetooth LE SoCs for Cost-Efficient Wireless Devices

Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, unveils its new entry-level, ultra-low-power Bluetooth® Low Energy (LE) Systems-on-Chip (SoCs) – the nRF54LS05A and nRF54LS05B. Both can serve as the main wireless SoC in single-chip systems, or operate as Bluetooth LE companion devices in multi-chip systems, benefiting from Nordic's market-leading B...

10 Mar 2026 | Tuesday | NEWS
GigaDevice Showcases Advanced Embedded Solutions at Embedded World 2026

GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, announced its participation at Embedded World 2026 (Hall 5, Booth 5-129), with the strong presence at the show demonstrating the company’s commitment to the global market and the strategic emphasis that it has placed on the EMEA region, r...

10 Mar 2026 | Tuesday | NEWS
Wolfspeed Launches Industry’s First Commercial 10 kV Silicon Carbide MOSFET

Wolfspeed, Inc., a global leader in silicon carbide (SiC) technology, announced the industry's first commercially available 10 kV SiC power MOSFET. This milestone marks a defining moment in the industry — unlocking architectural freedom, delivering unprecedented system durability, and advancing access to reliable and sustainable power for the world's most demanding applications. This groundb...

9 Mar 2026 | Monday | NEWS
Qualinx to Showcase 1 mW GNSS Chip and Developer Kit at Embedded World 2026

Qualinx, the European semiconductor company redefining ultra-low-power connectivity, announced plans to showcase its market-ready 1 mW QLX3Gx Series GNSS chip with its dynamic reconfigurable architecture, along with a Developer Evaluation Kit (EVK), at Embedded World 2026 from 10-12 March in Nuremberg. The QLX3Gx EVK enables OEMs to directly validate Qualinx’s power-to-performance ...

9 Mar 2026 | Monday | NEWS
Marvell Expands Coherent DSP Portfolio with Industry-First 1.6T ZR/ZR+ Data Center Interconnect

Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, announced the expansion of its multi-generational ZR/ZR+ and coherent DSP technology portfolio, introducing the industry’s first 1.6T ZR/ZR+ data center interconnect (DCI) pluggable and 2nm coherent DSPs featuring media access control security (MACsec) to securely scale AI data center conne...

9 Mar 2026 | Monday | NEWS
Mouser Electronics Executives Honored with Top Partner Awards by ODU

Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, proudly announces that Jaime Plank, Supplier Management Director, was named 2025 Strategic Partner of the Year by ODU, a valued partner and leading manufacturer of connectivity solutions. Additionally, April Kilman, Supplier Specialist, was named ODU's Supplier Manager of the ...

9 Mar 2026 | Monday | NEWS
BrainChip Expands Edge AI Reach Through Neuromorphyx Partnership

BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world leader in ultra-low power, fully digital, event-based neuromorphic AI, announced that Nex Novus d.o.o., Neuromorphyx™, has selected the Akida™ AKD1500 co-processor for evaluation and integration in its Vision NeuroNode™ edge-AI device. This strategic engagement and partnership agreement expands BrainChip&rsqu...

9 Mar 2026 | Monday | NEWS
Qnity Electronics, Inc. Acquires $61.5M Semiconductor Facility in Hsinchu Science Park

Qnity Electronics, Inc. (“Qnity”) (NYSE: Q) announced the acquisition of a new facility in Taiwan to accelerate capacity and support continued customer demand across the global semiconductor industry. The $61.5 million advanced semiconductor research and manufacturing facility marks a significant investment in Qnity’s growth to keep pace with customer demand. The new facility wi...

9 Mar 2026 | Monday | NEWS
FiberHome Showcases AI-Era Network Innovations at MWC 2026

With MWC 2026 taking place in Barcelona, FiberHome has stepped into the spotlight under the theme "Connecting the Bright Intelligent Future", highlighting three core strategic areas: optical-computing infrastructure, boundless intelligent network connectivity, and industrial intelligence elevation, and fully demonstrating its cutting-edge innovations and proven global delivery capabilities. Optic...

6 Mar 2026 | Friday | NEWS
Ambiq Micro Reveals Atomiq SoC with 300mV Ultra-Low-Power Mode on 12nm FinFET

Ambiq Micro, Inc. ("Ambiq®"), a leader in ultra-low-power semiconductor solutions for edge AI, revealed new technical details of its upcoming Atomiq™ SoC. Built on Ambiq's newly designed 12nm SPOT® platform using the TSMC N12e® process, Atomiq introduces a new Ultra-Low-Power (ULP) mode engineered to operate as low as 300mV— the lowest operating voltage in Ambiq's history. ...

6 Mar 2026 | Friday | NEWS
Everspin Technologies Qualifies 64Mb xSPI STT-MRAM for High-Reliability Applications

Everspin Technologies, Inc. (NASDAQ: MRAM), the world’s leading developer and manufacturer of magnetoresistive random access memory (MRAM) persistent memory solutions, announced continued progress across its high-reliability (HR) PERSYST xSPI STT-MRAM portfolio, including the completion of full production qualification for its 64Mb MRAM and the expansion of the family to a new 256M...

6 Mar 2026 | Friday | NEWS
Pickering Interfaces Launches Free Test System Architect Tool for Signal Path Design

Pickering Interfaces, the leading supplier of modular signal switching and simulation solutions for use in electronic test and verification, has announced Test System Architect, a free online graphical toolset designed to simplify signal path design for electronic test systems, allowing engineers to design, configure, and visualise complete test architectures before deployment. “Picker...

6 Mar 2026 | Friday | NEWS
Rambus Inc. Launches Industry-Leading HBM4E Memory Controller IP for AI Accelerators

Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, announced the industry’s leading HBM4E Memory Controller IP, extending its market leadership in HBM IP. This new solution delivers breakthrough performance with advanced reliability features, enabling designers to address the demanding memory bandwidth requirements of next-gen...

6 Mar 2026 | Friday | NEWS
Panmnesia and Openchip Sign AI Infrastructure Collaboration MOU at Mobile World Congress 2026

Panmnesia, a provider of advanced link solutions, announced that it has signed a Memorandum of Understanding (MOU) with Openchip, a European AI accelerator design company, at MWC26 in Barcelona. The agreement focuses on technical collaboration related to AI/HPC infrastructure. The agreement marks a step toward technical collaboration aimed at enhancing performance, scalability, and resource effic...

6 Mar 2026 | Friday | NEWS
Noble Machines Inc. Emerges from Stealth with First Industrial Robot Deployment to Fortune Global 500 Customer

Noble Machines Inc., formerly Under Control Robotics, announced its emergence from stealth with its first deployment of industrial general-purpose robots shipped to a Fortune Global 500 customer within 18 months of the company's launch. Founded in 2024 by a team of engineers from Apple, SpaceX, NASA, and Caltech, Noble Machines operates on the belief that AI must prove itself in real industrial op...

5 Mar 2026 | Thursday | NEWS
Indie Semiconductor Launches $150M Convertible Notes Offering

indie Semiconductor, Inc. (“indie,” “we,” or “our”) (NASDAQ: INDI), an automotive solutions innovator, announced that it plans to offer, subject to market and other conditions, $150.0 million aggregate principal amount of its Convertible Senior Notes due 2031 (the “notes”) through a private offering (the “offering”) to persons reasonably ...

5 Mar 2026 | Thursday | NEWS
Semtech Corporation Acquires HieFo Corporation to Strengthen AI Optical Connectivity Portfolio

Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, announced the acquisition of HieFo Corporation (HieFo), a California-based private manufacturer of high-efficiency Indium Phosphide (InP) optoelectronic devices for optical transceivers used across data center interconnects (DCI) ...

5 Mar 2026 | Thursday | NEWS
Indie Semiconductor, Inc. Prices $150 Million Convertible Senior Notes Offering Due 2031

indie Semiconductor, Inc. (“indie,” “we,” or “our”) (NASDAQ: INDI), an automotive solutions innovator,  announced the pricing of its offering of $150.0 million aggregate principal amount of its 4.00% Convertible Senior Notes due 2031 (the “notes”) through a private offering (the “offering”) to persons reasonably believed to be qualif...

5 Mar 2026 | Thursday | NEWS
BBTech Co., Ltd. Partners with ARKITEKT EQUITY to Expand Global Semiconductor Infrastructure

BBTech Co., Ltd. ("BBTech"), a Korean provider of semiconductor hook-up and high-purity flow system engineering solutions, and ARKITEKT EQUITY ("ARKITEKT"), a technology-focused private equity firm, announced a strategic partnership to support the expansion of semiconductor infrastructure across key global markets. Founded in South Korea, BBTech has established itself as a mission-critical infras...

5 Mar 2026 | Thursday | NEWS
QuickLogic Corporation Reports Q4 2025 Results, Expands U.S. SRH FPGA Program to $89M

QuickLogic Corporation (NASDAQ: QUIK) ("QuickLogic" or the "Company"), a developer of embedded FPGA (eFPGA) IP, ruggedized FPGAs, and Endpoint AI solutions, announced its financial results for the fiscal fourth quarter that ended December 28, 2025. Recent Highlights Expanded U.S. Strategic Radiation Hardened (SRH) FPGA government program, increasing total contract ceiling to approximately...

5 Mar 2026 | Thursday | NEWS

Asia Pacific

Europe

United States of America