• Sunday | 20 September 2026
Marelli and Microchip Advance Open-Standard ASA Motion Link for Software-Defined Vehicles

Marelli, a global automotive supplier, and Microchip Technology (NASDAQ: MCHP), a broadline supplier of semiconductors committed to making innovative design easier through total system solutions, announced a new solution that enables graphics and video content generated by a vehicle's central computer to be streamed directly to automotive displays using ASA Motion Link (ASA-ML), an open stand...

7 Sep 2026 | Monday | NEWS
Sivers Semiconductors Invests $30M to Expand InP Laser Manufacturing in Scotland

Sivers Semiconductors AB (STO: SIVE) announced a USD 30 million strategic investment to significantly expand its Indium Phosphide (InP) manufacturing facility in Glasgow, Scotland, as the company prepares for anticipated customer production ramps driven by growing AI datacenter and optical networking demand. Upon completion, the expanded facility is expected to support annual production of m...

4 Sep 2026 | Friday | NEWS
MulticoreWare Acquires Simulus Automation to Expand Semiconductor Design and Verification

MulticoreWare, Inc., a global technology company delivering AI software solutions, accelerated computing technologies, and advanced engineering services, announced the acquisition of Simulus Automation Pvt. Ltd., a semiconductor design and verification specialist serving customers developing SoCs, chipsets, and accelerator technologies. The industry is shifting toward hardware-software co-design....

4 Sep 2026 | Friday | NEWS
SEMI and Silicon Catalyst Partner to Accelerate Global Semiconductor Startup Innovation

SEMI, the global industry association connecting the electronics design and manufacturing supply chain, and Silicon Catalyst, the world's only accelerator focused exclusively on semiconductor innovation, announced a global strategic partnership designed to accelerate innovation and strengthen connections between semiconductor hardware startups, investors, manufacturers, and technology leaders worl...

4 Sep 2026 | Friday | NEWS
Baya Systems and AdoreSys Partner to Expand Chiplet and Data-Movement Solutions Across APAC

Baya Systems, an innovator in software-driven fabric and system IP solutions, and AdoreSys, a leading semiconductor design solutions provider, announced a strategic partnership to offer Baya’s WeaveIP™ fabric and WeaverPro™ software platform together with AdoreSys’ ASIC design, integration and implementation expertise as a unified solution for semiconductor and systems comp...

4 Sep 2026 | Friday | NEWS
SEEQC and Taiwan Strengthen Quantum Computing Supply Chain Collaboration

SEEQC, Inc. (“SEEQC” or the “Company”), a chip-based quantum computing company, announced the signing of a Memorandum of Understanding (“MOU”) with Taiwan’s Quantum Industry Technology Promotion Office to expand cooperation and exchange across quantum technology and the emerging global quantum supply chain. The MOU was signed by SEEQC Chief Technology Off...

4 Sep 2026 | Friday | NEWS
Mouser and Qorvo Advance Agile RF Solutions for Drones and Satellite Communications

Mouser Electronics, Inc., the New Product Introduction (NPI) leader™ empowering innovation, announces a new eBook in collaboration with Qorvo, exploring next-generation RF wireless designs for drones, satellite communications and industrial IoT. High-Performance RF Solutions for Agile New Markets addresses time-to-market pressures, coexistence issues, power-efficienc...

4 Sep 2026 | Friday | NEWS
Semiconductor Packaging Services Market to Reach US$118.59 Billion by 2035

The global semiconductor packaging services market is expected to expand significantly over the coming decade as rising demand for artificial intelligence (AI), high-performance computing (HPC), high-bandwidth memory (HBM) and chiplet-based architectures increases the need for sophisticated packaging and testing capabilities. According to DataM Intelligence, the market was valued at US$44.50 billi...

3 Sep 2026 | Thursday | NEWS
Wafer-Scale P-Type 2D Semiconductor Clears Key Hurdle for Next-Generation Chips

Researchers have made progress towards addressing one of the major challenges facing two-dimensional semiconductor technology: developing a stable, high-performance p-type material that can be produced across wafer-scale substrates. The advance could support the development of future complementary metal-oxide-semiconductor (CMOS) technologies as the semiconductor industry explores alternatives to ...

3 Sep 2026 | Thursday | NEWS
Andes Technology Cuts Chip Design and Verification Time with ChipAgents AI

ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced that Andes Technology, a leading supplier of RISC-V processor IP and a Founding Premier member of RISC-V International, has successfully deployed ChipAgents across multiple processor design and verification projects. In production deployments, Andes reduced a processor customisation task f...

3 Sep 2026 | Thursday | NEWS
Everspin and Teledyne HiRel Expand MRAM Solutions for Aerospace and Defence

Everspin Technologies, Inc. (NASDAQ: MRAM), the world’s leading developer and manufacturer of MRAM solutions, and Teledyne HiRel Semiconductors (Teledyne HiRel), a business unit of Teledyne Technologies Incorporated (NYSE: TDY) and a leading supplier of high-reliability semiconductor solutions, announced a strategic partnership to accelerate adoption of Everspin’s MRAM in aerospace, de...

3 Sep 2026 | Thursday | NEWS
Navitas Delivers 5th-Generation GaNFast Technology Through US Manufacturing Partnership

Navitas Semiconductor has announced the delivery of its latest fifth-generation GaNFast power semiconductor technology, manufactured in the United States through its strategic collaboration with GlobalFoundries. The development represents a step towards strengthening domestic production of gallium nitride (GaN) power devices as demand increases for more efficient power conversion across artificial...

3 Sep 2026 | Thursday | NEWS
Penn State and Battalion Launch $6M Research Programme for Advanced Semiconductors and High-Temperature Materials

Penn State and Battalion Advanced Technology Ltd ("Battalion") have entered into two research agreements worth up to $6 million to develop advanced semiconductor platforms and high-temperature materials that aim to enable next-generation energy, transportation, aerospace and industrial systems while also providing critical capabilities for national security. Led by researchers at Penn State's Mat...

3 Sep 2026 | Thursday | NEWS
Kulicke & Soffa Expands Advanced Packaging Solutions for AI and CPO

Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S", "we" or the "Company"), a global leader in semiconductor and electronics assembly solutions, continues to strengthen its position as a critical enabler of next-generation artificial intelligence (AI) infrastructure through its advanced packaging portfolio, inc...

2 Sep 2026 | Wednesday | NEWS
GigaDevice Joins Zephyr Project to Expand GD32 MCU Open-Source Ecosystem

GigaDevice, a leading semiconductor company specialising in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, has officially joined the Zephyr® Project, one of the world’s leading open-source real-time operating systems (RTOS). Hosted by the Linux Foundation®, the Zephyr® Project welcomes GigaDevice as a Silver Member, making Gig...

2 Sep 2026 | Wednesday | NEWS
Teradyne Launches Three UltraFLEXplus Instruments for AI Semiconductor Testing

Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, announced the launch of three new instruments for its UltraFLEXplus platform, designed to meet the increasingly complex demands of AI and data center semiconductor testing. The UltraPin5000-EM, UltraPort-PCIe6, and UltraVS64-HP instruments are designed to deliver unmatched scalability, fle...

2 Sep 2026 | Wednesday | NEWS
Butterfly Network Partners with Merge Labs on Ultrasound-Based Brain-Computer Interfaces

Butterfly Network, Inc. ("Butterfly") (NYSE: BFLY), a pioneer and leader in semiconductor-based ultrasound, programmable cloud software and AI, and Merge Labs announced a multi-year licensing agreement through Butterfly Embedded™. The agreement gives Merge access to Butterfly’s Poseidon Family of Ultrasound-on-Chip™ technology for the development of ultrasound-base...

2 Sep 2026 | Wednesday | NEWS
THine Electronics Unveils DSP-Free Optical Chipset for PCIe 6/7 AI Servers

THine Electronics, Inc. (Tokyo Stock Exchange:6769, “THine”), a global leader in high-speed interface technologies, announced the introduction of two new optical semiconductor products featuring its proprietary ZERO EYE SKEW® technology. By eliminating digital signal processors(DSPs) with innovative proprietary circuit technology, these solutions deliver ultra-low latency, red...

2 Sep 2026 | Wednesday | NEWS
BTU Expands Reflow Technology with Advanced Formic Acid Capability

BTU International has introduced a new Formic Acid Reflow capability across several of its reflow oven platforms, targeting the growing requirements of advanced semiconductor packaging, power electronics and high-reliability electronic assemblies. The technology enables fluxless soldering while providing tighter process control, improved solder joint quality and the potential to reduce operating c...

1 Sep 2026 | Tuesday | NEWS
Qnity Launches Stackplane CMP Slurries for Advanced Semiconductor Packaging

Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, has further expanded its offerings for advanced packaging with the introduction of the Stackplane™ family of slurries for chemical mechanical planarization (CMP). Stackplane™ slurries support the industry's move toward shrink and stack, where continued t...

1 Sep 2026 | Tuesday | NEWS

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