• Friday | 06 November 2026
Alchip’s AI Chip Growth and 3D Integration Plans Keep Analysts Focused

Taiwan-based Alchip Technologies continues to attract attention from market analysts as demand for custom artificial intelligence processors increases investment in advanced semiconductor design and three-dimensional chip integration. A valuation assessment published on 30 October 2026 by Simply Wall St maintained its estimated fair value for Alchip, despite adjustments to assumptions covering re...

3 Nov 2026 | Tuesday | NEWS
Powerchip Plans 10% to 20% Wafer Foundry Price Hikes in 2027

Taiwan-based Powerchip Semiconductor Manufacturing Corporation (PSMC) plans to raise mature-node wafer foundry prices by 10% to 20% in 2027, as demand from artificial intelligence infrastructure, automotive electronics and memory customers continues to put pressure on available production capacity. The company disclosed the pricing plans during its third-quarter earnings conference on 21 October ...

3 Nov 2026 | Tuesday | NEWS
Marvell to Acquire Lumentum in US$115 Billion All-Stock Deal to Expand AI Optical Connectivity

Combines two of the fastest-growing enablers of AI, bringing together complementary electrical and optical technologies to address increasingly complex connectivity requirements across next-generation AI infrastructure Expected to create a broad full-stack connectivity portfolio that is intended to enable end-to-end extreme co-design, high-volume production of fully-optimized, pre-validated opt...

3 Nov 2026 | Tuesday | NEWS
TANAKA, MEP Establish RM70 Million Precious Metal Refinery in Malaysia

Japan-based TANAKA Precious Metal Technologies has announced plans to establish a precious metal refining joint venture with Malaysian resource recovery company MEP Enviro Technology Sdn. Bhd., expanding local recycling and materials processing capabilities for the semiconductor and electronics industries. The new company, TANAKA MEP REFINERY SDN. BHD., will operate from Batu Kawan Industrial Par...

2 Nov 2026 | Monday | NEWS
Taiwan Chip Industry Backs Nuclear Power Restart Review Amid Rising Electricity Demand

Taiwan's semiconductor industry has renewed its support for examining the restart of nuclear power plants, as growing demand for advanced chips raises concerns about the island's long-term electricity supply. The Taiwan Semiconductor Industry Association (TSIA) confirmed its position at its annual meeting in Hsinchu on 29 October 2026, where its board agreed to back the government's review of nuc...

2 Nov 2026 | Monday | NEWS
KLC Corporation Introduces Thermal Testing Solutions for AI Chips, Advanced Packaging and Electric Vehicles

Taiwan King Lung Chin PTC Co., Ltd. (KLC Corporation), a Taiwan-based thermal management solutions manufacturer, highlighted its Thermal Test Vehicle (TTV) solutions for chip-wafer layout design, planning & verification, AI, and high-performance computing (HPC), alongside high-voltage coolant heaters for electric vehicles (EVs). As AI infrastructure and high-performance computing systems driv...

2 Nov 2026 | Monday | NEWS
Nordic Semiconductor Demonstrates Bluetooth High Data Throughput Technology for Faster Low-Power Wireless Connectivity

Nordic Semiconductor (OSE: NOD), a global leader in low-power wireless connectivity solutions, proves the upcoming Bluetooth® High Data Throughput (HDT) feature in silicon through its video demonstration. Nordic, who has an established reputation as a leader in Bluetooth technology, is one of the first vendors to showcase support for Bluetooth HDT. With support for longer packe...

2 Nov 2026 | Monday | NEWS
Ceva Unveils Next-Generation NeuPro NPU Portfolio with 2X AI Throughput and 50% Better Energy Efficiency

Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP that powers the Smart Edge, unveiled its next-generation NeuPro™ NPU portfolio, featuring expanded capabilities and delivering up to 2X higher AI throughput per mm² and a 50% improvement in energy efficiency versus the first generation. Built on a common architecture and unified software stack, the new portfolio...

2 Nov 2026 | Monday | NEWS
Current Sensing As a Critical Safety Technology for AI Data Centers

As data center power levels scale from hundreds of kilowatts to multi-megawatt AI clusters, protecting the systems against electrical faults while maintaining uninterrupted operation has become a strategic priority for data center operators. This raises the requirements against electrical fault protection and for predictive maintenance. Against this background, current sensing is evolving from a m...

2 Nov 2026 | Monday | Feature
ON Semiconductor Falls 5%, NXP Drops 4% on Automotive Chip Demand Concerns

Shares in major automotive semiconductor suppliers came under pressure on 28 October 2026, after NXP Semiconductors issued a fourth-quarter revenue outlook slightly below market expectations, prompting investors to reassess demand prospects across the automotive chip sector. ON Semiconductor (onsemi) recorded the largest decline among the companies tracked in the report, falling approximately 5% ...

30 Oct 2026 | Friday | NEWS
Ceva Unveils Next-Generation NeuPro NPU Portfolio with 2X AI Throughput and 50% Higher Energy Efficiency

Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP that powers the Smart Edge, unveiled its next-generation NeuPro™ NPU portfolio, featuring expanded capabilities and delivering up to 2X higher AI throughput per mm² and a 50% improvement in energy efficiency versus the first generation. Built on a common architecture and unified software stack, the new portfolio...

30 Oct 2026 | Friday | NEWS
FuriosaAI Raises US$620 Million in Series D Funding to Expand AI Inference Chip Production

FuriosaAI, an AI semiconductor company building sustainable, high-performance inference compute for data centers, announced the completion of its $620 million (KRW 820 billion) Series D round, bringing its post-money valuation to approximately $2.9 billion. The financing marks a major milestone as FuriosaAI scales global commercial deployments of its RNGD AI inference accelerator. FuriosaAI will ...

30 Oct 2026 | Friday | NEWS
Seoul Viosys Begins Mass Production of Rare-Earth-Free White Micro LEDs Using WICOP 3 Technology

For three decades, white LEDs have depended on rare earth materials such as yttrium aluminum garnet (YAG) layered onto a blue LED chip (Figure 1). Seoul Viosys Co., Ltd. (KOSDAQ: 092190) announced that it has broken that dependence. It has developed and begun mass producing a chip that emits white light without rare earths. The chip can be as small as 10 micrometers (µm). Seoul Viosys and i...

30 Oct 2026 | Friday | NEWS
AXT’s Tongmei Secures Up to US$545 Million in Private Equity Financing to Expand Indium Phosphide Wafer Production

AXT, Inc. (NasdaqGS: AXTI), a leading manufacturer of compound semiconductor substrates announced that its majority-owned subsidiary, Beijing Tongmei Xtal Technology Co., Ltd. (“Tongmei”), has entered into definitive agreements for a private equity financing to fund further expansion of its manufacturing capacity for indium phosphide semiconductor substrates, expansion of its principal...

30 Oct 2026 | Friday | NEWS
High NA EUV Lithography Benefits, Challenges, and the Path to Continued Scaling

As the semiconductor industry begins the 2nm manufacturing ramp and accelerates R&D toward the sub-2nm node, high numerical aperture (NA) extreme ultraviolet (EUV) lithography is emerging as a critical enabler of continued device scaling. By improving resolution and enhancing pattern fidelity, high NA EUV lithography is expected to play a central role in future semiconductor manufacturing. Her...

30 Oct 2026 | Friday | Feature
ChipAgents Expands AI-Powered Platform Across Digital and Analog Chip Design with NVIDIA Collaboration

ChipAgents is expanding its agentic AI platform across digital and analog chip design, bringing traditionally fragmented workflows onto a common AI-native foundation. The platform is powered by IC-star, the chip neural engine that combines persistent design knowledge, advanced reasoning and orchestration, dynamic model routing and physics-aware models. ChipAgents’ full-stack approach bui...

29 Oct 2026 | Thursday | NEWS
Sony Introduces 50MP LYTIA 720 Smartphone Image Sensor with Improved Low-Light Performance and 4K HDR Video

Sony Semiconductor Solutions Corporation (Sony) announced the upcoming release of the LYTIA 720, an approximately 50-effective megapixel*1 image sensor for mobile applications that delivers industry-leading*2 low-light performance and supports 4K 60 fps HDR video recording. Designed for use on the main camera of mobile devices, the new sensor inherits technologies developed for Sony's LYTIA high-...

29 Oct 2026 | Thursday | NEWS
ChipNexus Launches NEX Analog Agent to Automate Semiconductor Design and Verification

ChipNexus™, a developer of agentic AI software for semiconductor and hardware design, announced the availability of the NEX™ Analog Agent, which brings analog design capabilities to NEX™, its multi-agent engineering platform. The Analog Agent works directly with Cadence Virtuoso, Spectre simulation and Siemens Calibre physical verification, using the EDA licenses and process desi...

29 Oct 2026 | Thursday | NEWS
Phison Electronics Wins Two Micron Supplier Awards for Semiconductor Performance and Quality

Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, is honored to announce that it was presented with Outstanding Supplier Performance Awards in the Semiconductor category and the Best in Quality – Assembly and Test category at the Micron Supplier Day 2026. The event, held in Boise, Idaho, United States was attended by top-level management of Micron ...

29 Oct 2026 | Thursday | NEWS
Movandi Launches 60GHz Wireless Connectivity Platform Delivering Over 5Gbps for Edge AI and 5G Networks

Movandi, the semiconductor and systems innovator powering next-generation wireless communications, announced its new 60GHz connectivity platform, powered by the MV6055 60GHz transceiver, to address the growing bandwidth and latency requirements across multiple markets including physical AI, fixed wireless access (FWA), integrated sensing and communications (ISAC), and network backhaul. The platfor...

29 Oct 2026 | Thursday | NEWS

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