TekSiC Advances Europe’s First Domestic Semi-Insulating SiC Wafer Supply for Defence and Space

Swedish semiconductor materials company TekSiC has reached several important milestones in its efforts to establish Europe’s first commercially available domestic supply of semi-insulating silicon carbide (SI-SiC) wafers for space, defence and radio-frequency (RF) applications. The company is developing a European supply base for a material that is increasingly important in high-frequency a...

21 Aug 2026 | Friday | NEWS
BrainChip Launches Open-Source Akida Bundle for AI Workload Scheduling with IBM Symphony

BrainChip Holdings Ltd. (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), a global leader in ultra-low power, fully digital, event-based neuromorphic AI, has released the Symphony Community Akida Bundle, a free, open-source software bundle that lets developers run BrainChip Akida neuromorphic processors alongside their existing compute under a workload scheduler built on IBM Spectrum Symphony Community E...

21 Aug 2026 | Friday | NEWS
Qnity Electronics Installs KLA Surfscan SP7XP to Advance Semiconductor Materials Innovation

Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, announced the installation of a Surfscan® SP7XP unpatterned wafer defect inspection system from KLA as part of its ongoing investment in advanced semiconductor materials innovation. The system enhances Qnity's ability to develop and manufacture leading-...

21 Aug 2026 | Friday | NEWS
Toshiba Launches 80V eFuse IC for 48V Industrial Power Systems and Equipment

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has added “TCKE1401NM,” an 80V-rated electronic fuse (eFuse IC), to its lineup of eFuse ICs with multiple built-in power line protection functions. Shipments start today. The new product adopts the VQFN24D package, an industry-leading[1] small package for 80V-rated eFuse ICs, which contributes to improved safet...

21 Aug 2026 | Friday | NEWS
SEMICON India 2026: PM Modi to Inaugurate Global Semiconductor Industry Event in New Delhi

Prime Minister Narendra Modi will inaugurate SEMICON India 2026 at Yashobhoomi, the India International Convention and Expo Centre in New Delhi. The event will bring together stakeholders from across the global semiconductor ecosystem, including manufacturers, technology companies, equipment and materials suppliers, investors, researchers and policymakers. Organised by SEMI in collaboration with ...

21 Aug 2026 | Friday | NEWS
Hanmi Semiconductor Invests $94 Million in New Incheon Plant to Expand HBM and AI Chip Equipment Capacity

South Korean semiconductor equipment maker Hanmi Semiconductor is investing approximately KRW 130 billion (around US$94 million) to establish its eighth production facility in Incheon, marking the largest manufacturing investment in the company’s history. The expansion comes as demand for equipment used in artificial intelligence (AI) semiconductor and high-bandwidth memory (HBM) production ...

21 Aug 2026 | Friday | NEWS
proteanTecs Expands Chiplet Analytics Solutions for Advanced Multi-Die Packaging

proteanTecs®, the leading provider of deep data visibility for advanced electronics, unveiled a dedicated suite of health, power and performance management solutions for multi-die systems. Based on the company’s unique on-chip monitoring technology, semiconductor and system companies can now improve yield, reduce risk and protect investments in high-value systems-in-package. AI is ...

20 Aug 2026 | Thursday | NEWS
xETFs Launches Korea AI Semiconductor ETF to Target Samsung, SK Hynix and AI Chip Ecosystem

xETFs, a New York-based ETF issuer that makes differentiated investment opportunities accessible to investors, is launching the xETFs Korea AI Semiconductor ETF (KSMH). KSMH is an actively managed ETF designed to provide targeted exposure to Korea’s semiconductor industry, including the country’s industry-leading AI chipmakers, as well as other firms across the full Korean AI sem...

20 Aug 2026 | Thursday | NEWS
KAGA FEI Develops Bluetooth LE Modules to Simplify IoT Wireless Connectivity

KAGA FEI Co., Ltd., a global provider of advanced short-range wireless modules, announced the development of the ES4L15MA1 and EC4L15MA1 Bluetooth Low Energy modules with embedded software for wireless communication. These products are versions of KAGA FEI’s ES4L15BA1 and EC4L15BA1 wireless modules with embedded software, which use Nordic Semiconductor’s nRF54L15. Because the modules ...

20 Aug 2026 | Thursday | NEWS
Semtech Expands LoRa Plus Portfolio with New Production-Ready IoT Transceivers

Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductors powering AI data centre networking and intelligent, connected Internet of Things (“IoT”) devices worldwide, announced the expansion of its LoRa Plus family with the introduction of the LR2022 and LR2012 transceivers, both now available in production. The two new devices e...

20 Aug 2026 | Thursday | NEWS
Gradiant Expands US Water Infrastructure Push as AI and Semiconductor Demand Grows

Every microchip, data centre, and megawatt of AI capacity depends on water. Gradiant, the water layer of the AI economy, announced a series of milestones reinforcing its ability to solve that constraint across the United States: a new US leadership hire, three new offices, an innovation centre, and long-term services contracts, including one with a chip major. Gradiant named Dr Nish Vora as ...

20 Aug 2026 | Thursday | NEWS
LitePoint and STMicroelectronics Validate Next-Generation UWB Chipset for IEEE 802.15.4ab

LitePoint, a leading provider of communication test solutions, announced the successful validation of physical layer (PHY) performance for STMicroelectronics’ ST64UWB chip family using LitePoint's next-generation UWB test system, IQgig-UWB+™. The joint effort confirmed that ST's silicon meets the rigorous requirements of the IEEE 802.15.4ab draft specification, giving UWB develope...

20 Aug 2026 | Thursday | NEWS
SRC Launches SPARC Consortium with $13 Million Research Portfolio for Advanced Semiconductor Technologies

Semiconductor Research Corporation (SRC) is announcing the launch of the Semiconductor and Packaging Advanced Research Consortium (SPARC), its newest industry-driven collaborative research program designed to accelerate breakthrough research in semiconductor technologies critical to the future of the global microelectronics ecosystem. SPARC represents their newest project-based research program, ...

19 Aug 2026 | Wednesday | NEWS
Avicena Begins Shipping 1Tbps LightBundle Evaluation Kits for Next-Generation AI Infrastructure

Avicena, the pioneer in microLED-based optical interconnects, announced that it has begun shipping 1 Tbps LightBundle™ evaluation kits (eKits) to customers and partners developing next-generation AI infrastructure. The shipment milestone follows the introduction and demonstration of the LightBundle eKit in March 2026 at the Optical Fibre Conference (OFC26) and advances the platform from init...

19 Aug 2026 | Wednesday | NEWS
Ramaco Resources and Bedrock Semiconductor Explore Domestic Gallium Supply for GaN Chips

Ramaco Resources, Inc. (NASDAQ: METC, METCB) ("Ramaco" or the "Company") announced that it has executed a non-binding memorandum of understanding ("MOU") with Bedrock Semiconductor Inc. ("Bedrock"). The MOU confirms potential strategic relationships involving critical minerals from Ramaco's exploratory Brook Mine rare earth and critical-mineral project in Wyoming (the "Brook Mine"). Bedrock ...

19 Aug 2026 | Wednesday | NEWS
Prodigy Technovations Launches Industry-First UFS 5.0 Protocol Exerciser and Analyser for AI

Prodigy Technovations Pvt. Ltd, a leader in protocol analysis solutions, proudly announces the successful testing and launch of the PGY-UFS5-EX-PA. This groundbreaking tool is the industry's first UFS 5.0 protocol exerciser and analyser designed to accelerate the development of next-generation flash memory interfaces required for the burgeoning AI-driven ecosystem. Supporting MIPI M-PHY...

19 Aug 2026 | Wednesday | NEWS
CesiumAstro Acquires Jariet Technologies to Strengthen In-House RF Semiconductor Capabilities

CesiumAstro Inc., a global leader in advanced space communications and intelligence, surveillance, and reconnaissance (ISR) systems, has announced the acquisition of Jariet Technologies, a leading mmWave RF System-on-Chip (RF-SoC) semiconductor company specialising in leading integrated solutions for SATCOM, electronic warfare (EW), and radar systems. This advances CesiumAstro’s strate...

19 Aug 2026 | Wednesday | NEWS
UMass Amherst Engineers Develop Hardware-Software Approach to Make Edge AI More Efficient

Researchers at the University of Massachusetts Amherst are working on a hardware-software co-design approach aimed at making artificial intelligence more efficient on edge devices. The research addresses a key challenge in edge computing: delivering advanced AI capabilities while operating within strict limits on power, memory and processing resources. Edge devices increasingly need to process AI...

19 Aug 2026 | Wednesday | NEWS
Taiwan Semiconductor Firms Expand Silicon Capacitor Push as AI Chip Demand Rises

Taiwan’s semiconductor industry is stepping up efforts to develop silicon capacitor technologies, as the rapid growth of artificial intelligence (AI) and high-performance computing (HPC) increases demand for more efficient power management within advanced chip packages. The shift is being driven by the increasing power consumption of high-performance processors. As AI accelerators become mo...

18 Aug 2026 | Tuesday | NEWS
Wyoming Invests $3.15 Million in Lattice Semiconductor as Institutional Interest Grows

The State of Wyoming has taken a new position in Lattice Semiconductor, purchasing 20,626 shares of the semiconductor company during the second quarter of 2026. The investment was valued at approximately $3.15 million, according to a recent regulatory disclosure. The investment represents around 0.3% of Wyoming’s overall investment portfolio, making Lattice its 24th-largest holding. The mov...

18 Aug 2026 | Tuesday | NEWS