• Sunday | 20 September 2026
ACES and Movandi Partner to Advance 5G and 6G Wireless Infrastructure in Saudi Arabia

Advanced Communications and Electronic Systems Company (ACES) and Movandi, the semiconductor and systems connectivity company powering intelligent wireless infrastructure, announced a strategic partnership, formalised through a Memorandum of Understanding (MoU) during LEAP 2026 in Riyadh, to advance the development, validation and commercialisation of next-generation 5G and future 6G wireless...

1 Sep 2026 | Tuesday | NEWS
MemryX Powers Edge AI Safety System at Express LUCK Smart Factory

MemryX Inc., a provider of high-efficiency AI acceleration technology, announced that Express LUCK has deployed a MemryX-powered edge AI system within its manufacturing operations. The system supports real-time safety compliance on active production lines as part of Express LUCK's broader smart factory strategy. Express LUCK is a major global television and consumer electronics manufacturer produ...

1 Sep 2026 | Tuesday | NEWS
CollPlant to Acquire LightSolver in Move into Photonic AI Computing

CollPlant Biotechnologies Ltd. (Nasdaq: CLGN) announced that it has signed a definitive agreement to acquire LightSolver Ltd. ("LightSolver"), an Israeli deep-tech company pioneering a fundamentally new computing architecture based on lasers. The acquisition is expected to close this week. CollPlant is acquiring LightSolver utilising an equity-centric consideration structure c...

1 Sep 2026 | Tuesday | NEWS
GigaDevice Expands EMEA and Asia Distribution with Rutronik Partnership

GigaDevice, a leading semiconductor company specialising in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, announced a new strategic franchise partnership with Rutronik Elektronische Bauelemente GmbH, one of Europe’s leading broadline distributors of electronic components. The agreement covers EMEA and Southeast Asia, including India, and prov...

1 Sep 2026 | Tuesday | NEWS
Lasertec and Japanese Semiconductor Stocks Gain as AI Chip Demand Accelerates

Japan’s semiconductor industry is gaining renewed investor attention as rising demand for artificial intelligence infrastructure creates opportunities for companies supplying equipment and technologies to the chip sector. Among the companies highlighted in a recent market screen are Lasertec and two other Japanese businesses identified for their growth potential and significant insider owner...

31 Aug 2026 | Monday | NEWS
Needham Sees Strong Mature-Node Semiconductor Demand as Industry Upcycle Broadens

Needham’s latest semiconductor equipment tracker points to continued strength across mature-node manufacturing, with improving global chip sales and firm memory pricing supporting the broader semiconductor cycle. The 33rd Semicap Tracker, which incorporates July equipment import data from South Korea, Taiwan and China, as well as semiconductor sales through June and memory spot prices throug...

31 Aug 2026 | Monday | NEWS
SK hynix Breaks Ground on $4 Billion US HBM Production Hub in Indiana

  SK hynix Inc. is opening a new future for AI cooperation between the United States and South Korea by establishing the first next-generation High Bandwidth Memory (HBM) production hub in the US. SK hynix announced that it held a groundbreaking ceremony for an advanced packaging[1] production facility for AI memory on the 27th (local time) at the Holloway Gymnasium, Pur...

31 Aug 2026 | Monday | NEWS
Ezurio Launches Compact Wi-Fi 6/6E Connected MCU Modules for IoT Devices

Ezurio, a global leader in wireless connectivity and Premium Partner for Infineon Technologies, announces that the Veda IF912 and IF913 series connected MCU modules are now in stock and available for purchase through its global distribution network. Powered by Infineon's AIROC™ CYW55912 and CYW55913 chipsets, the Veda series is a breakthrough, low-power high, high-performance solution that c...

31 Aug 2026 | Monday | NEWS
NEPCON ASIA 2026 to Showcase AI, Advanced Packaging and Smart Manufacturing in Shenzhen

Driven by booming AI‑led innovation, advanced packaging evolution and global supply‑chain realignment, the electronics manufacturing industry is undergoing profound transformation, with Asia accounting for more than 58% of worldwide electronics production output. As Asia's premier PCBA and smart‑manufacturing event rooted in Shenzhen — China's core electronics‑manufact...

31 Aug 2026 | Monday | NEWS
Diodes Completes $250 Million ElevATE Semiconductor Acquisition to Expand ATE Portfolio

Diodes Incorporated (Diodes) (Nasdaq: DIOD) announced the successful completion of its acquisition of ElevATE Semiconductor, Inc. ("ElevATE"), a leading provider of high-performance integrated circuits for the Automated Test Equipment (ATE) market, in an all-cash transaction for $250 million. ElevATE is a fabless semiconductor company based in San Diego, California that specialises in the develop...

31 Aug 2026 | Monday | NEWS
Movandi Launches Ultra-Low-Power Frequency Synthesiser ICs for 5G, AI Data Centres and Robotics

Movandi, the semiconductor and systems connectivity company powering intelligent wireless infrastructure, announced the MV3564 and MV3514 frequency synthesisers, two new pin- and feature-compatible devices designed for wireless communications, AI data centres, and physical AI applications. Leveraging TSMC’s 40nm radio frequency (RF) CMOS process, the devices deliver 75 fs total jitter at jus...

28 Aug 2026 | Friday | NEWS
Aeonsemi Launches Ultra-Compact ArcadiumNano Silicon Oscillators for Automotive and Robotics

Aeonsemi, an innovator of mixed-signal and DSP connectivity ICs, announced the ArcadiumNano™ family of silicon oscillators, bringing the company’s field-proven Arcadium™ DSP timing technology to ultra-compact packages for automotive, robotics, industrial and other space-constrained applications. ArcadiumNano™ supports any output frequency from 10 kHz to 125 MHz and pac...

28 Aug 2026 | Friday | NEWS
Kioxia Starts Fab3 Construction in Japan to Expand 3D Flash Memory Capacity

Kioxia Corporation, a world leader in memory solutions, announced that it has commenced site preparation and related work for the construction of Fab3, a new state-of-the-art manufacturing facility at the Kitakami Plant in Iwate Prefecture, Japan, to expand production capacity for its advanced three-dimensional flash memory, BiCS FLASH™. Fab3 will be constructed on land south of Fab2, with o...

28 Aug 2026 | Friday | NEWS
Qnity Unveils Advanced Packaging Materials Platform to Support AI Chip Growth

Qnity Electronics has introduced an integrated materials and process technology platform aimed at addressing the manufacturing demands of next-generation 2.5D and 3D semiconductor packaging. The platform is designed to support advanced applications including chiplet-based architectures, high-bandwidth memory (HBM) and emerging substrate technologies, as growing AI workloads drive demand for hi...

28 Aug 2026 | Friday | NEWS
LG Chem Targets AI Semiconductor Growth with Advanced Packaging Materials at SEMICON Taiwan 2026

LG Chem is set to showcase a broad portfolio of advanced packaging and power semiconductor materials for AI applications at SEMICON Taiwan 2026, as the South Korean chemical company seeks to strengthen partnerships with semiconductor manufacturers, OSAT providers and substrate companies. The exhibition will take place from 2–4 September at the Taipei Nangang Exhibition Centre. At the event,...

28 Aug 2026 | Friday | NEWS
Keysight Helps AttoTude Cut AI Chip Design Cycles by More Than 50%

Keysight Technologies has announced that AttoTude, a developer of advanced ASICs for AI and hyperscale data-centre applications, has expanded its use of Keysight’s electronic design automation (EDA) software across its complete IC design workflow. The collaboration has enabled AttoTude to reduce its chip design cycles by more than 50% and achieve first-pass silicon success across advanced RF...

28 Aug 2026 | Friday | NEWS
Achronix Launches 32Gbps JESD204C IP for High-Speed AI and Data Acquisition Applications

Achronix Semiconductor Corporation, the leader in data acceleration FPGAs, announced the availability of its high-performance JESD204C IP core for the Speedster®7t FPGA family. Designed to connect advanced analogue-to-digital converters (ADCs) and digital-to-analogue converters (DACs) to programmable logic, each core supports data rates of up to 32 Gbps per lane and up to eight lanes per link,...

27 Aug 2026 | Thursday | NEWS
GCT Semiconductor Partners on Next-Generation UAV Connectivity and Defence Technologies

GCT Semiconductor Holding, Inc. (“GCT”) (NYSE: GCTS), a leading designer and supplier of 5G semiconductors powering the AI data pipeline with wireless connectivity, announced a strategic partnership and license agreement with a leading infrastructure provider for utilities and IoT to accelerate the development of next-generation UAV control and communication technologies. As part ...

27 Aug 2026 | Thursday | NEWS
Agentrys Raises $24.5 Million to Advance AI-Powered Chip Design Automation

Agentrys, a startup focused on automating and continuously improving chip design, announced that it has raised $24.5 million in funding. The total comprises an oversubscribed $19.1 million seed round led by Etna Labs, following a $5.4 million pre-seed round led by MediaTek, the company’s first strategic backer. The new funding will go toward recruiting, agent-native tooling, and expanding cu...

27 Aug 2026 | Thursday | NEWS
E&R Engineering Showcases Laser and Plasma Solutions for AI and Advanced Packaging at SEMICON Taiwan 2026

E&R Engineering Corp. (Taipei Exchange: 8027), a specialist in semiconductor laser and plasma processing equipment, will showcase its latest technologies at SEMICON Taiwan 2026. Highlights will include high-precision laser drilling for Fiber Array Units (FAUs), Glass Core and Through-Glass Via (TGV) processing, Glass Carrier applications, and the PHB-600A laser processing system and R-300...

27 Aug 2026 | Thursday | NEWS

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