• Wednesday | 17 June 2026
AISIN Corporation Selects Green Hills Software for Next-Generation AI Driver Monitoring and Alcohol Detection Platform

Automotive Engineering Exposition Green Hills Software, the worldwide leader in embedded safety and security, announces that AISIN Corporation (AISIN) has chosen Green Hills Software as the trusted software foundation for its next-generation Driver Monitoring System (DMS) with Alcohol Detection System (DADS). Today, AISIN is developing their systems with Green Hills products integrated with k...

28 May 2026 | Thursday | NEWS
Altera Partners with US Defense Innovation Unit on Next-Generation Optical Networking for Space Communications

Altera, the industry’s largest pure-play FPGA solutions provider, announced it is working with the Defense Innovation Unit (DIU) to advance the development of a highly reconfigurable coherent Free Space Optics (FSO) modem prototype for the Resilient Adaptive Zero-latency Optical Relay for Broadband All-domain Communications (RAZORBAC) program. The effort builds upon prior Space-Based Adaptiv...

28 May 2026 | Thursday | NEWS
Viewtrix Technology Debuts on Hong Kong Stock Exchange with HK$10.9 Billion Valuation

Viewtrix Technology, a portfolio company of Qiming Venture Partners and a leading display chip design enterprise in China, successfully listed on the Hong Kong Stock Exchange, marking Qiming Venture Partners' sixth IPO since the beginning of the year. Viewtrix Technology (03310.HK) offered its shares at a price of HK$20.81 per share and opened at HK$25.48 per share with a market capitalisation of ...

28 May 2026 | Thursday | NEWS
Entegris, Inc. and JSR Corporation Sign EUV Materials Cross-Licensing Deal to Strengthen Next-Generation Semiconductor Manufacturing

Entegris, Inc. (Nasdaq: ENTG), a global leader in advanced materials and purity solutions for the semiconductor industry, and JSR Corporation, a materials innovation leader and the parent company of Inpria Corporation, announced entry into a non-exclusive cross-licensing agreement aimed at helping the semiconductor industry advance extreme ultraviolet (EUV) lithography for next-generation chip man...

28 May 2026 | Thursday | NEWS
Huawei Proposes ‘Tau Scaling Law’ as Post-Moore’s Framework for Future Semiconductor Development

IEEE International Symposium on Circuits and Systems (ISCAS) in Shanghai, He Tingbo, President of HUAWEI's Semiconductor Business Department, presented the Tau (τ) Scaling Law, a proposed successor to Moore's Law for guiding semiconductor development. This law proposes replacing geometric scaling with time (τ) scaling as a new guiding principle for the evolution of both semiconductors and...

28 May 2026 | Thursday | NEWS
SEMI Foundation Launches First Regional Workforce Hubs to Strengthen US Semiconductor Talent Pipeline

The SEMI Foundation, serving as the Hub Operator for the National Network for Microelectronics Education (NNME), announced the launch of the first four Regional Nodes of the NNME, marking a major national milestone in the effort to build America's microelectronics and semiconductor workforce at unprecedented scale. Funded by the U.S. National Science Foundation Directorate for Tech...

28 May 2026 | Thursday | NEWS
Wiwynn Showcases Rack-Scale AI Infrastructure and Next-Generation Data Centre Technologies at Computex 2026

Wiwynn (6669), an innovative cloud IT infrastructure provider for data centres, today announced to showcase its vision of next-generation data centre designs at Computex 2026 (Booth #J0106, TaiNEX1). The exhibition spans cutting-edge rack-scale AI servers, developed with Wistron, breakthrough cooling technologies, optical scale-up designs, and high-voltage DC (HVDC) power delivery architectures. ...

27 May 2026 | Wednesday | NEWS
Advanced Semiconductor Engineering, Inc. Unveils Industry-First Automated Panel-Level Packaging Line for AI and HPC Applications

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) and a leading provider of semiconductor assembly and test services, announced the development of an industry-first automated 310mm × 310mm panel-level packaging production line, advancing its leadership in next-generation advanced packaging technologies. This milestone expand...

27 May 2026 | Wednesday | NEWS
Magnachip Semiconductor Corporation Targets AI Data Centre Growth with Advanced MV MOSFET Portfolio at PCIM Europe 2026

Magnachip Semiconductor Corporation (NYSE: MX, “Magnachip”), a designer and manufacturer of power semiconductor solutions, announced that it will showcase its Medium-Voltage (MV) MOSFET portfolio for AI server and data centre power systems at PCIM Europe 2026, in Nuremberg, Germany. At Hall 6, Booth 337, Magnachip will exhibit its MV MOSFET solutions for server and data center power s...

27 May 2026 | Wednesday | NEWS
SK hynix Inc. Unveils iHBM Cooling Technology for Next-Generation AI Memory Systems

SK hynix Inc. (or "the company", www.skhynix.com) announced the launch of the iHBM solution that embeds integrated cooling elements(ICEs)[1] within the high-bandwidth memory(HBM) package for next-generation HBM products.  [1] ICE(Integrated Cooling Elements): A cooling element made of electrically non-conductive, thermally conductive silicon-based material, designed to dissipa...

27 May 2026 | Wednesday | NEWS
GlobalPlatform Launches Open-Source “Pavona” Silicon Platform with Embedded Post-Quantum Cryptography Stack

GlobalPlatform launched Pavona, an open-source silicon distribution that delivers production-quality, certification-ready IP components and reference top-level designs — including the first openly available post-quantum cryptography (PQC) stack for embedded silicon. The distribution includes two successfully taped-out reference designs—a standalone chip root of trust and an integrated ...

27 May 2026 | Wednesday | NEWS
Toshiba Electronic Devices & Storage Corporation Launches TXZ+™ Entry-Class M4H Microcontrollers for Consumer and Industrial System Control

Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has announced the TXZ+™ Family Entry‑Class M4H Group, standard microcontrollers[1] featuring an Arm® Cortex®‑M4 core with a floating-point unit (FPU). The new microcontrollers are designed for application in small‑scale system control of consumer products, such as air conditioners a...

27 May 2026 | Wednesday | NEWS
Texas Tech University Secures $4.5 Million Texas CHIPS Funding to Advance Next-Generation Semiconductor Research

Researchers at Texas Tech University have secured approximately $4.5 million in funding from the Texas Semiconductor Innovation Fund to advance the development of wide- and ultrawide-bandgap semiconductor technologies for high-power electronics, defence applications and next-generation communications systems. The three-year project, titled Research and Development of Wide/Ultraw...

26 May 2026 | Tuesday | NEWS
Semiconductor Industry Association Applauds CHIPS R&D Quantum Computing Awards to Strengthen U.S. Semiconductor Leadership

The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending several research awards announced by the CHIPS Research and Development Office (CRDO) to advance quantum computing technology. The award recipients include SIA member companies IBM and GlobalFoundries. “Research is the engine of American semiconductor in...

26 May 2026 | Tuesday | NEWS
JEOL Ltd. Launches “LazEdge” SEM System for High-Speed Semiconductor and Materials Analysis

JEOL Ltd. (President & CEO: Izumi Oi) has developed the “LazEdge”, an SEM system equipped with a laser processing system, and has begun sales.Cross-section preparation instruments such as the focused ion beam system (FIB system) are widely used in science and technology fields across research institutes, universities, and industries. In recent years, demand is increasing for a syst...

26 May 2026 | Tuesday | NEWS
Cyient Semiconductors Secures USD 30 Million Financing to Expand Power Semiconductor and Custom Silicon Platform

Cyient Semiconductors announced a strategic financing transaction with funds managed by EAAA India Alternatives Ltd ("Edelweiss") and affiliated co-investors. The transaction includes an equity investment of approximately USD 10 Mn (INR 100 Crores) at a post-money equity valuation of USD ~500 Mn (INR 4600 Crores), alongside structured debt capital, enabling the company to strengthen its capital s...

26 May 2026 | Tuesday | NEWS
King Yuan Electronics Corp Invests S$100 Million in Singapore Semiconductor Testing Facility

Taiwanese semiconductor testing company King Yuan Electronics Corp (KYEC) is investing S$100 million in a new semiconductor testing facility in Singapore as part of its broader international expansion strategy. The project is expected to create more than 300 jobs across engineering, operations and management roles, strengthening Singapore’s position within the global semicond...

25 May 2026 | Monday | NEWS
Micron Technology Warns Global AI-Driven Memory Chip Shortage Could Extend Beyond 2026

Micron Technology has cautioned that the global memory chip shortage is likely to persist beyond 2026 as demand from the artificial intelligence sector continues to outstrip available supply. The company highlighted strong growth in AI data centres and high-performance computing as major drivers behind rising demand for advanced DRAM and NAND memory products. Micron chief executiv...

25 May 2026 | Monday | NEWS
Hedge Funds Maintain Strong Semiconductor Exposure as AI Infrastructure Investment Accelerates

Hedge funds are continuing to benefit from the strong rise in semiconductor shares as momentum behind artificial intelligence investments gathers pace. Growing demand for AI infrastructure, including advanced chips, memory devices and data-centre technology, has fuelled substantial gains across global technology markets. Recent market activity suggests that while some hedge fu...

25 May 2026 | Monday | NEWS
Adam J Morgan of NoMIS Power on Advancing High-Voltage SiC Technologies for Next-Generation HVDC Infrastructure

In this interview with Semicon Leaders Asia, Adam J Morgan, Co-founder, CEO, & Technical Lead for Packaging Design at NoMIS Power, highlights how the company is positioning its high-voltage SiC portfolio at the centre of next-generation HVDC and grid modernisation initiatives. Through participation in the ARPA-E DC-GRIDS programme and collaboration with leading industry and researc...

25 May 2026 | Monday | Interaction

Asia Pacific

Europe

United States of America