• Sunday | 20 September 2026
Tata Electronics and Gati Shakti Vishwavidyalaya Partner to Build Semiconductor Talent Pipeline

Tata Electronics and Gati Shakti Vishwavidyalaya (GSV) have signed a Memorandum of Understanding (MoU) to develop industry-ready talent for India’s expanding semiconductor manufacturing ecosystem. The partnership will focus on building specialised skills needed for semiconductor manufacturing facilities and supporting infrastructure. Tata Electronics and GSV will work with Tata Electronics&...

18 Sep 2026 | Friday | NEWS
India’s Semiconductor Ecosystem Poised for Rapid Growth as Industry Leaders Highlight Expansion

India’s semiconductor industry is entering a new phase of expansion, with industry leaders highlighting growing manufacturing capacity, supply-chain localisation, global partnerships and workforce development at SEMICON India 2026. Dr. Randhir Thakur, CEO and MD of Tata Electronics, said India has moved beyond the question of whether it can manufacture semiconductors and is now focused on ho...

18 Sep 2026 | Friday | NEWS
D-Robotics Raises $400 Million Series C to Scale AI Robotics Infrastructure

D-Robotics, a leading provider of robotics development infrastructure, announced the closing of a US$400 million Series C funding round. The round attracted strategic investment from a leading global internet company, alongside top-tier investment institutions, and continued follow-on investments from existing shareholders. The funding aims to enhance Sunrise™ Chip's product portfolio acros...

18 Sep 2026 | Friday | NEWS
Bloom Energy’s 800V DC Fuel Cells Could Cut AI Data Centre Costs by $5.5 Billion

Bloom Energy (NYSE: BE), a global leader in power solutions, released a special report, “The New Rules of AI Power,” showing that its unique 800V DC-native fuel cell solution can reduce non-compute capital expenditures for a 1 GW AI data centre by $3.6 billion, or 27%, and the five-year total cost of ownership by $5.5 billion, or 9%. The conventional power system architecture was buil...

18 Sep 2026 | Friday | NEWS
SEMICON India 2026 Opens as India Showcases Growing Semiconductor Ecosystem

India is showcasing the progress of its semiconductor industry as SEMICON India 2026 gets underway in New Delhi, bringing together global and Indian companies, policymakers, investors, researchers, start-ups and academic institutions. Prime Minister Narendra Modi inaugurated the fifth edition of the three-day conference and exhibition at Yashobhoomi, New Delhi, on 17 September. The event is being...

17 Sep 2026 | Thursday | NEWS
India Unveils ‘Semicon 2.0’ to Accelerate Semiconductor Ecosystem

India is moving into the next phase of its semiconductor development with the launch of ‘Semicon 2.0’, a programme focused on expanding the country’s capabilities across chip design, manufacturing, advanced packaging, research and development, and talent development. Speaking at SEMICON India 2026, Union Minister for Electronics and Information Technology Ashwini Vaishnaw said t...

17 Sep 2026 | Thursday | NEWS
SEMICON India 2026 to Bring Together Global Semiconductor Ecosystem in New Delhi

New Delhi is set to host SEMICON India 2026 from 17–19 September, with Prime Minister Narendra Modi scheduled to inaugurate the three-day conference and exhibition at Yashobhoomi on 17 September. Organised around the theme ‘Silicon to Systems: Building the Ecosystem’, the event will bring together global and Indian semiconductor companies, policymakers, investors, researchers, s...

17 Sep 2026 | Thursday | NEWS
AI Financing Drives Hedge Fund Positioning Shifts Across Semiconductor Stocks

AI remained a key theme for global hedge funds in August, as the financing of the AI infrastructure buildout increasingly shifted from equity toward debt-financed structures. As AI-related corporate debt issuance accelerated, companies relying more heavily on external financing for AI investment showed early signs of greater sensitivity than those funding growth through internal cash generation, a...

18 Sep 2026 | Friday | NEWS
Anderon Secures $1 Billion CHIPS Award to Advance Quantum Wafer Manufacturing

Anderon LLC ("Anderon"), an IBM (NYSE: IBM) company, announced the finalisation of a $1 billion award under the CHIPS and Science Act with the U.S. Department of Commerce (the "Department"). The award will accelerate Anderon's R&D efforts to advance the nation's quantum wafer manufacturing capabilities. Announced in May under a letter of intent between the Department and IBM, Anderon operates...

17 Sep 2026 | Thursday | NEWS
Air Products Invests $250 Million in Arizona to Support US Semiconductor Expansion

Air Products (NYSE: APD) announced it has signed a long-term agreement with one of the leading semiconductor manufacturers to supply high-purity industrial gases and related infrastructure to support the customer's plant and production expansion plans in the United States (U.S.). This is the second semiconductor manufacturing supply win Air Products has recently announced, with a combined inv...

17 Sep 2026 | Thursday | NEWS
MIPI Alliance Forms Kinematics Working Group to Standardise Radar and Lidar Data

The MIPI Alliance, an international organisation that develops specifications that standardise wired interfaces for mobile and other connected ecosystems, announced the formation of a Kinematics Working Group focused on the development of a specification to standardise the format of kinematic sensor data streams transported over the broadly implemented MIPI CSI-2 camera and imaging interface. Kin...

17 Sep 2026 | Thursday | NEWS
Cadence and Analog Devices Develop Next-Generation SHARC-FX DSP for Automotive Audio

Cadence (Nasdaq: CDNS) announced that its Tensilica IP Group and Analogue Devices, Inc. (ADI) worked together to develop the latest generation of SHARC® automotive audio processors, further strengthening ADI’s industry-leading position in premium in-vehicle audio solutions. The joint effort brings Cadence’s highly optimised Tensilica DSP architecture into the next-generation ADSP p...

17 Sep 2026 | Thursday | NEWS
TeRAM Emerges from Stealth with $37 Million to Develop 3D SRAM for AI Datacentres

TeRAM emerged from stealth with $37 million in equity financing from early-stage investors to tackle the memory wall facing AI deployment. The company is developing custom 3D SRAM for frontier AI applications, initially in data centers. As AI models scale beyond two trillion parameters, new memory technology is needed to increase capacity and throughput while reducing power consumption. TeRAM is v...

18 Sep 2026 | Friday | NEWS
Aeonsemi Advances Ultra-Compact Timing Solutions for Automotive, Robotics and Physical AI

Semicon Leaders Asia speaks with Foeking Wu, Clock Product Line Manager at Aeonsemi, about the company’s ArcadiumNano™ silicon oscillator family and how ultra-low power, flexible frequency coverage and compact packaging are enabling next-generation intelligent systems. Q. Aeonsemi is bringing its proven Arcadium™ timing technology into the new ArcadiumNano™ family. What ma...

16 Sep 2026 | Wednesday | Interaction
Valens Semiconductor Appoints Semtech COO Asaf Silberstein to Board of Directors

Valens Semiconductor (NYSE: VLN), a leading provider of high-performance connectivity chipsets, announced the appointment of Asaf Silberstein, Executive Vice President and Chief Operating Officer of Semtech Corporation, to its Board of Directors. Silberstein brings more than two decades of leadership experience in the semiconductor industry, with extensive expertise in global operations, business...

16 Sep 2026 | Wednesday | NEWS
EUCLYD Secures More Than €200 Million Series A to Advance AI Infrastructure

EUCLYD has signed a Series A financing round of more than €200 million, the company announced. The round is co-led by Samsung, Somerset Capital Partners, Scaleup Europe Fund, which is managed by EQT, and Innovation Industries, with participation from EIFO, the Export and Investment Fund of Denmark, imec. xpand, Brabant Development Agency (BOM), and Quadri. Peter Wennink, former President...

16 Sep 2026 | Wednesday | NEWS
MediaTek Launches Dimensity 9600 Pro with 2nm Process and Agentic AI

MediaTek, the world's number one provider of mobile chipsets, announced the launch of the Dimensity 9600 Pro. This flagship SoC achieved a significant technological milestone, adopting the new 2nm process node; as the first company to announce reaching this threshold, MediaTek is showcasing its leadership in innovation with the Dimensity 9600 Pro. With the next generation of silicon now avail...

16 Sep 2026 | Wednesday | NEWS
Lorentz Solution and NVIDIA Advance 3D EM Sign-Off for AI Chip and Silicon Photonics Designs

Lorentz Solution, Inc., the world's leading provider of 3D electromagnetic (EM) design platforms for IC, 3DIC, and advanced packaging, announced that it is jointly presenting with NVIDIA at the TSMC 2026 Open Innovation Platform (OIP) Ecosystem Forum, to be held in Santa Clara, CA. Their paper, "Large-scale Chip-level 3D EM Extraction and Sign-off of Ultra-high-speed Silicon Photonics and Custom S...

16 Sep 2026 | Wednesday | NEWS
Teradyne Opens Bengaluru Office to Support India’s Growing Semiconductor Manufacturing Industry

Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, announced the opening of an office in India focused on supporting semiconductor manufacturing, located in Bengaluru, Karnataka. The new office formalises Teradyne’s growing presence in the country and underscores the company’s long-term commitment to India’s semiconductor and elect...

16 Sep 2026 | Wednesday | NEWS
Singular Photonics Launches Litavis SPAD Sensor with In-Pixel Photon Processing

Singular Photonics, an innovator in single-photon imaging, announced the launch of its most advanced image sensor to date. Litavis is the world's first single-photon avalanche diode (SPAD) sensor using in-pixel processing to unify imaging, timing, histogramming and photon statistics on a single chip. Designed to bring unprecedented flexibility and intelligence to imaging applications, Litavis int...

15 Sep 2026 | Tuesday | NEWS

Asia Pacific

Europe

United States of America