Park Systems Corp. (KOSDAQ: 140860), a global leader in atomic force microscopy (AFM) and nanometrology, announced the successful completion of a KRW 100 billion (approximately USD 72 million) strategic financing through the issuance of perpetual bonds with warrants, with Kiwoom Securities and Dominus Investment Management each subscribing KRW 50 billion. The proceeds will support the company's pr...
Robotics, semiconductor equipment, and intelligent automation systems are evolving at an accelerating pace, placing OEM manufacturers under growing engineering and supply chain pressure. Product development cycles continue to shorten while system complexity keeps rising. Expectations for validation efficiency, long-term reliability, and cost control are becoming increasingly demanding across the i...
GIGABYTE, the world's leading computer brand, continues to advance motherboard innovation by pushing its performance to a new industry standard. From Ultra Durable™, performance-focused Super Overclocking technology to the latest AI-enhanced D5 Bionic Corsa and X3D Turbo Mode 2.0, GIGABYTE continues to transform engineering challenges into leading innovations for AI computing and gaming...
Rapidus Corporation announced that it has completed an additional funding round of 150 billion yen (equivalent to about $943 million USD) from the Information-Technology Promotion Agency (IPA), Japan, an independent administrative agency under the jurisdiction of the Ministry of Economy, Trade and Industry (METI) based on the "Act on Facilitation of Information Processing." Earlier this year...
Sony Semiconductor Solutions Corporation (Sony) announced the upcoming release, mass production, and shipment of the IMX711 direct conversion charge-integrating X-ray CMOS image sensor. The IMX711 is an X-ray image sensor for inspection and measurement instrumentation which directly detects X-rays and outputs signals proportional to their energy. The new sensor offers the industry's fastest*1&nbs...
Covalent announced a strategic collaboration with Oxford Instruments that expands its semiconductor characterisation offering with customer-ready, wafer-level Raman and photoluminescence (PL) workflows. The capability is now available to customers tackling defectivity, stress and strain mapping, process development, and failure analysis at full-wafer scale. As materials such as silicon ...
COMPUTEX 2026 in Taipei runs under the theme "AI Together." Longsys (301308.SZ) showcases its full-stack edge AI storage portfolio under "Edge AI Storage • Integrated Implementation," together with its high-end consumer storage brand Lexar, to optimise local LLM performance and accelerate AI ecosystem collaboration Global Launch: AIDIMM™ & AILPBGA™ for Edge AI Inference &nbs...
Quobly, a French quantum computing company, announced the closing of a €115 million Series A financing to accelerate the industrialisation of its silicon-based quantum computers and bring its first commercial product to market by the end of 2026. The round is led by Bpifrance, SEALSQ and STMicroelectronics, with participation from the European Innovation Council (EIC Fund), Blast, ALIAD (A...
Metanoia Communications, a pioneer in semiconductor solutions for next-generation wireless infrastructure, announced the integration of its 5G Open SDR (Software-Defined Radio) platform with AI-RAN-enabled 5G Distributed Unit (DU) servers at COMPUTEX 2026. The company also unveiled the commercial launch of MOSART (Metanoia Open Source Advanced Radio Technology), an open SDR foundation de...
In this interview with Semicon Leaders Asia, Mr. Kosuke Inoue, Vice Sales General Manager at Asahi Kasei, outlines how the rapid growth of AI and high-performance computing is reshaping semiconductor packaging requirements and driving demand for advanced materials solutions. He highlights the company’s strategy to support next-generation package architectures through innovations in PSPI...
In this interview with Semicon Leaders Asia, Dominic Rizzo, Governing Board Chair, Pavana, and CEO, ZeroRISC, outlines how Pavana is fostering a more accessible and collaborative semiconductor ecosystem through its open-source silicon distribution model. He also shares insights into the growing importance of post-quantum cryptography and how secure, standards-based silicon soluti...
Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components™, announces that it has received the 2025 Catalogue Distributor of the Year and the 2025 Passives Distributor of the Year Award from Vishay Intertechnology, Inc., a leading global manufacturer of a wide range of discrete semico...
Atomera Incorporated (NASDAQ: ATOM), a semiconductor materials and technology licensing company, announced a new approach to GaN-on-Silicon that addresses a key performance barrier limiting its use in mainstream RF applications. Today, high-performance RF GaN devices are typically built on silicon carbide substrates, which provide excellent performance but remain costly and difficult to scale. Sil...
At COMPUTEX TAIPEI 2026, DEEPX Inc., an ultra-low-power Physical AI semiconductor company, announced a strategic three-year Global Mass Production Cooperation agreement with AAEON Technology Inc., a leading provider of advanced industrial and embedded AI computing platforms. The agreement, signed by both company CEOs, establishes a commercialisation pipeline to integrate DEEPX's high-performance N...
Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, announced a strategic collaboration with GlobalFoundries (NASDAQ: GFS) (GF), to develop advanced silicon photonics solutions for the high-growth AI infrastructure market. Sivers Semiconductors' laser arrays will be integrated into reference designs built on GF's silicon photonics...
pSemi®, a Murata company leading in semiconductor integration and advanced connectivity, announced two additions to its UltraCMOS+™ RF switch portfolio: the PE42544 SP4T RF switch and the PE42429 SPDT RF switch. Both devices deliver high isolation, low insertion loss, and industry-leading linearity for next-generation wireless infrastructure, test and measurement, and...
Murata Manufacturing Co., Ltd. (TOKYO: 6981) (ISIN: JP3914400001) introduces the GCJ21BD72A225KE02, a soft-termination chip multilayer ceramic capacitor (MLCC) for automotive powertrain and safety equipment. This world's first soft-termination chip MLCC product achieves the highest available capacitance of 2.2μF at 100Vdc in the smallest 0805-inch (2.0×1.25mm) size*. As vehicle electrifi...
Amtech Systems, Inc. ("Amtech") (NASDAQ: ASYS), a manufacturer of equipment, consumables and services for semiconductor device packaging, wafer production and device fabrication, announced the closing of its oversubscribed underwritten public offering of 2,926,829 shares of common stock, at a public offering price of $20.50 per share, for total gross proceeds of $60 million before deducting underw...
Mouser Electronics, Inc., the authorised global distributor of the latest semiconductors and electronic components, proudly announces it has been named the 2025 High Service Distributor of the Year by Hirose Electric USA, a global leader in the design and manufacture of innovative connector solutions. The Mouser team received the prestigious award at the recent EDS 2026 event in Las Vegas. Hi...
Teledyne HiRel Semiconductors, a business unit of Teledyne Technologies Incorporated (NYSE: TDY) and a leading supplier of high-reliability RF and microwave solutions, announced the TDLNA0840SEP, a space-screened, ultra-low-power, wideband low-noise amplifier (LNA) designed to support the growing demands of satellite constellations in low Earth orbit (LEO) and medium Earth orbit (MEO), spaceb...