• Monday | 21 September 2026
GigaDevice Joins Zephyr Project to Expand GD32 MCU Open-Source Ecosystem

GigaDevice, a leading semiconductor company specialising in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, has officially joined the Zephyr® Project, one of the world’s leading open-source real-time operating systems (RTOS). Hosted by the Linux Foundation®, the Zephyr® Project welcomes GigaDevice as a Silver Member, making Gig...

2 Sep 2026 | Wednesday | NEWS
Teradyne Launches Three UltraFLEXplus Instruments for AI Semiconductor Testing

Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, announced the launch of three new instruments for its UltraFLEXplus platform, designed to meet the increasingly complex demands of AI and data center semiconductor testing. The UltraPin5000-EM, UltraPort-PCIe6, and UltraVS64-HP instruments are designed to deliver unmatched scalability, fle...

2 Sep 2026 | Wednesday | NEWS
Butterfly Network Partners with Merge Labs on Ultrasound-Based Brain-Computer Interfaces

Butterfly Network, Inc. ("Butterfly") (NYSE: BFLY), a pioneer and leader in semiconductor-based ultrasound, programmable cloud software and AI, and Merge Labs announced a multi-year licensing agreement through Butterfly Embedded™. The agreement gives Merge access to Butterfly’s Poseidon Family of Ultrasound-on-Chip™ technology for the development of ultrasound-base...

2 Sep 2026 | Wednesday | NEWS
THine Electronics Unveils DSP-Free Optical Chipset for PCIe 6/7 AI Servers

THine Electronics, Inc. (Tokyo Stock Exchange:6769, “THine”), a global leader in high-speed interface technologies, announced the introduction of two new optical semiconductor products featuring its proprietary ZERO EYE SKEW® technology. By eliminating digital signal processors(DSPs) with innovative proprietary circuit technology, these solutions deliver ultra-low latency, red...

2 Sep 2026 | Wednesday | NEWS
BTU Expands Reflow Technology with Advanced Formic Acid Capability

BTU International has introduced a new Formic Acid Reflow capability across several of its reflow oven platforms, targeting the growing requirements of advanced semiconductor packaging, power electronics and high-reliability electronic assemblies. The technology enables fluxless soldering while providing tighter process control, improved solder joint quality and the potential to reduce operating c...

1 Sep 2026 | Tuesday | NEWS
Qnity Launches Stackplane CMP Slurries for Advanced Semiconductor Packaging

Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, has further expanded its offerings for advanced packaging with the introduction of the Stackplane™ family of slurries for chemical mechanical planarization (CMP). Stackplane™ slurries support the industry's move toward shrink and stack, where continued t...

1 Sep 2026 | Tuesday | NEWS
ACES and Movandi Partner to Advance 5G and 6G Wireless Infrastructure in Saudi Arabia

Advanced Communications and Electronic Systems Company (ACES) and Movandi, the semiconductor and systems connectivity company powering intelligent wireless infrastructure, announced a strategic partnership, formalised through a Memorandum of Understanding (MoU) during LEAP 2026 in Riyadh, to advance the development, validation and commercialisation of next-generation 5G and future 6G wireless...

1 Sep 2026 | Tuesday | NEWS
MemryX Powers Edge AI Safety System at Express LUCK Smart Factory

MemryX Inc., a provider of high-efficiency AI acceleration technology, announced that Express LUCK has deployed a MemryX-powered edge AI system within its manufacturing operations. The system supports real-time safety compliance on active production lines as part of Express LUCK's broader smart factory strategy. Express LUCK is a major global television and consumer electronics manufacturer produ...

1 Sep 2026 | Tuesday | NEWS
CollPlant to Acquire LightSolver in Move into Photonic AI Computing

CollPlant Biotechnologies Ltd. (Nasdaq: CLGN) announced that it has signed a definitive agreement to acquire LightSolver Ltd. ("LightSolver"), an Israeli deep-tech company pioneering a fundamentally new computing architecture based on lasers. The acquisition is expected to close this week. CollPlant is acquiring LightSolver utilising an equity-centric consideration structure c...

1 Sep 2026 | Tuesday | NEWS
GigaDevice Expands EMEA and Asia Distribution with Rutronik Partnership

GigaDevice, a leading semiconductor company specialising in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, announced a new strategic franchise partnership with Rutronik Elektronische Bauelemente GmbH, one of Europe’s leading broadline distributors of electronic components. The agreement covers EMEA and Southeast Asia, including India, and prov...

1 Sep 2026 | Tuesday | NEWS
Lasertec and Japanese Semiconductor Stocks Gain as AI Chip Demand Accelerates

Japan’s semiconductor industry is gaining renewed investor attention as rising demand for artificial intelligence infrastructure creates opportunities for companies supplying equipment and technologies to the chip sector. Among the companies highlighted in a recent market screen are Lasertec and two other Japanese businesses identified for their growth potential and significant insider owner...

31 Aug 2026 | Monday | NEWS
Needham Sees Strong Mature-Node Semiconductor Demand as Industry Upcycle Broadens

Needham’s latest semiconductor equipment tracker points to continued strength across mature-node manufacturing, with improving global chip sales and firm memory pricing supporting the broader semiconductor cycle. The 33rd Semicap Tracker, which incorporates July equipment import data from South Korea, Taiwan and China, as well as semiconductor sales through June and memory spot prices throug...

31 Aug 2026 | Monday | NEWS
SK hynix Breaks Ground on $4 Billion US HBM Production Hub in Indiana

  SK hynix Inc. is opening a new future for AI cooperation between the United States and South Korea by establishing the first next-generation High Bandwidth Memory (HBM) production hub in the US. SK hynix announced that it held a groundbreaking ceremony for an advanced packaging[1] production facility for AI memory on the 27th (local time) at the Holloway Gymnasium, Pur...

31 Aug 2026 | Monday | NEWS
Ezurio Launches Compact Wi-Fi 6/6E Connected MCU Modules for IoT Devices

Ezurio, a global leader in wireless connectivity and Premium Partner for Infineon Technologies, announces that the Veda IF912 and IF913 series connected MCU modules are now in stock and available for purchase through its global distribution network. Powered by Infineon's AIROC™ CYW55912 and CYW55913 chipsets, the Veda series is a breakthrough, low-power high, high-performance solution that c...

31 Aug 2026 | Monday | NEWS
NEPCON ASIA 2026 to Showcase AI, Advanced Packaging and Smart Manufacturing in Shenzhen

Driven by booming AI‑led innovation, advanced packaging evolution and global supply‑chain realignment, the electronics manufacturing industry is undergoing profound transformation, with Asia accounting for more than 58% of worldwide electronics production output. As Asia's premier PCBA and smart‑manufacturing event rooted in Shenzhen — China's core electronics‑manufact...

31 Aug 2026 | Monday | NEWS
Diodes Completes $250 Million ElevATE Semiconductor Acquisition to Expand ATE Portfolio

Diodes Incorporated (Diodes) (Nasdaq: DIOD) announced the successful completion of its acquisition of ElevATE Semiconductor, Inc. ("ElevATE"), a leading provider of high-performance integrated circuits for the Automated Test Equipment (ATE) market, in an all-cash transaction for $250 million. ElevATE is a fabless semiconductor company based in San Diego, California that specialises in the develop...

31 Aug 2026 | Monday | NEWS
Movandi Launches Ultra-Low-Power Frequency Synthesiser ICs for 5G, AI Data Centres and Robotics

Movandi, the semiconductor and systems connectivity company powering intelligent wireless infrastructure, announced the MV3564 and MV3514 frequency synthesisers, two new pin- and feature-compatible devices designed for wireless communications, AI data centres, and physical AI applications. Leveraging TSMC’s 40nm radio frequency (RF) CMOS process, the devices deliver 75 fs total jitter at jus...

28 Aug 2026 | Friday | NEWS
Aeonsemi Launches Ultra-Compact ArcadiumNano Silicon Oscillators for Automotive and Robotics

Aeonsemi, an innovator of mixed-signal and DSP connectivity ICs, announced the ArcadiumNano™ family of silicon oscillators, bringing the company’s field-proven Arcadium™ DSP timing technology to ultra-compact packages for automotive, robotics, industrial and other space-constrained applications. ArcadiumNano™ supports any output frequency from 10 kHz to 125 MHz and pac...

28 Aug 2026 | Friday | NEWS
Kioxia Starts Fab3 Construction in Japan to Expand 3D Flash Memory Capacity

Kioxia Corporation, a world leader in memory solutions, announced that it has commenced site preparation and related work for the construction of Fab3, a new state-of-the-art manufacturing facility at the Kitakami Plant in Iwate Prefecture, Japan, to expand production capacity for its advanced three-dimensional flash memory, BiCS FLASH™. Fab3 will be constructed on land south of Fab2, with o...

28 Aug 2026 | Friday | NEWS
Qnity Unveils Advanced Packaging Materials Platform to Support AI Chip Growth

Qnity Electronics has introduced an integrated materials and process technology platform aimed at addressing the manufacturing demands of next-generation 2.5D and 3D semiconductor packaging. The platform is designed to support advanced applications including chiplet-based architectures, high-bandwidth memory (HBM) and emerging substrate technologies, as growing AI workloads drive demand for hi...

28 Aug 2026 | Friday | NEWS

Asia Pacific

Europe

United States of America