• Monday | 21 September 2026
EUCLYD Secures More Than €200 Million Series A to Advance AI Infrastructure

EUCLYD has signed a Series A financing round of more than €200 million, the company announced. The round is co-led by Samsung, Somerset Capital Partners, Scaleup Europe Fund, which is managed by EQT, and Innovation Industries, with participation from EIFO, the Export and Investment Fund of Denmark, imec. xpand, Brabant Development Agency (BOM), and Quadri. Peter Wennink, former President...

16 Sep 2026 | Wednesday | NEWS
MediaTek Launches Dimensity 9600 Pro with 2nm Process and Agentic AI

MediaTek, the world's number one provider of mobile chipsets, announced the launch of the Dimensity 9600 Pro. This flagship SoC achieved a significant technological milestone, adopting the new 2nm process node; as the first company to announce reaching this threshold, MediaTek is showcasing its leadership in innovation with the Dimensity 9600 Pro. With the next generation of silicon now avail...

16 Sep 2026 | Wednesday | NEWS
Lorentz Solution and NVIDIA Advance 3D EM Sign-Off for AI Chip and Silicon Photonics Designs

Lorentz Solution, Inc., the world's leading provider of 3D electromagnetic (EM) design platforms for IC, 3DIC, and advanced packaging, announced that it is jointly presenting with NVIDIA at the TSMC 2026 Open Innovation Platform (OIP) Ecosystem Forum, to be held in Santa Clara, CA. Their paper, "Large-scale Chip-level 3D EM Extraction and Sign-off of Ultra-high-speed Silicon Photonics and Custom S...

16 Sep 2026 | Wednesday | NEWS
Teradyne Opens Bengaluru Office to Support India’s Growing Semiconductor Manufacturing Industry

Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, announced the opening of an office in India focused on supporting semiconductor manufacturing, located in Bengaluru, Karnataka. The new office formalises Teradyne’s growing presence in the country and underscores the company’s long-term commitment to India’s semiconductor and elect...

16 Sep 2026 | Wednesday | NEWS
Singular Photonics Launches Litavis SPAD Sensor with In-Pixel Photon Processing

Singular Photonics, an innovator in single-photon imaging, announced the launch of its most advanced image sensor to date. Litavis is the world's first single-photon avalanche diode (SPAD) sensor using in-pixel processing to unify imaging, timing, histogramming and photon statistics on a single chip. Designed to bring unprecedented flexibility and intelligence to imaging applications, Litavis int...

15 Sep 2026 | Tuesday | NEWS
Taiyo Holdings and imec Demonstrate 700nm RDL Technology for Advanced Semiconductor Packaging

Taiyo Holdings Co., Ltd. (Securities code: 4626; hereinafter "Taiyo Holdings"), based in Tokyo, presented a paper, at the 11th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026), held in Helsinki, Finland, on the "FPIM Series" (hereinafter the "Material"), a next-generation semiconductor-packaging material. The FPIM Series is a fine-pitch RDL (*1) negative-tone i-line photo...

15 Sep 2026 | Tuesday | NEWS
Arasan Chip Systems Advances MIPI I3C Interoperability with Host, Device and Software IP Testing

Arasan Chip Systems announces its participation in the I3C® Interoperability Session to be held at the sidelines of the Member Meeting in Taipei. Arasan will test its I3C® Host IP, I3C® Dual Mode IP (supports I3C® Host & Device) and I3C® Device IP with other I3C® interop participants. Arasan will also test its licensable proprietary I3C®...

15 Sep 2026 | Tuesday | NEWS
TAITRA Showcases 56 Taiwanese Manufacturers and Advanced Manufacturing Technologies at IMTS 2026

The Taiwan External Trade Development Council (TAITRA) is launching its premier showcase, inviting manufacturing leaders from around the world to IMTS 2026 on September 14 at McCormick Place. Beyond a week on the show floor, Taiwan is bringing 56 of its manufacturers directly through a full schedule of programming, from hands-on sessions to networking events built for real business excha...

15 Sep 2026 | Tuesday | NEWS
LattePanda Launches Mu Ultra x86 Compute Module for On-Device AI

LattePanda Team launched LattePanda Mu Ultra, a micro x86 compute module purpose-built for on-device AI. Powered by Intel Core Ultra 5 226V and Ultra 7 256V processors, it delivers up to 115 TOPS of AI performance in a compact 69.6 × 60mm form factor. Built to address the hardware, compute, and software challenges of running AI locally, LattePanda Mu Ultra brings powerful AI comput...

15 Sep 2026 | Tuesday | NEWS
Analog Devices to Acquire Alif Semiconductor for $1.35 Billion to Advance Physical Intelligence

Analog Devices, Inc. (NASDAQ: ADI) and Alif Semiconductor announced that they have entered into a definitive agreement under which ADI will acquire Alif in an all-cash transaction for $1.35 billion. Artificial intelligence is entering a new phase as models move beyond interpreting words and images to understanding context and interacting with the physical world. This transition requires syst...

15 Sep 2026 | Tuesday | NEWS
Stäubli Showcases Connectivity and Automation Solutions for Semiconductor Manufacturing

Building on decades of semiconductor expertise, Stäubli delivers electrical and fluid connectivity solutions that help OEMs maintain process stability, protect yield, and maximise tool availability. As an industry leader, Stäubli will highlight these capabilities this October when Semicon West takes place in San Francisco, California. Visitors will have the opportunit...

14 Sep 2026 | Monday | NEWS
Alif Semiconductor Launches Low-Cost StartKits for Edge AI Microcontrollers

Alif Semiconductor®, a leading global supplier of secure, connected, power-efficient Artificial Intelligence and Machine Learning (AI/ML) microcontrollers (MCUs) and fusion processors, launched a new family of Low-Cost evaluation boards for its Edge AI-enabled Ensemble® and Balletto® Microcontrollers. The SK-B1 and SK-E1C StartKits lower the barrier of ent...

14 Sep 2026 | Monday | NEWS
Kyocera and Tohoku University Develop Laser-Annealed Optical Isolators for Silicon Photonics

Kyocera Corporation (President: Shiro Sakushima; "Kyocera") and the Research Institute of Electrical Communication (RIEC), Tohoku University (Director: Kazushi Ishiyama; "Tohoku University") have developed a new technology*1 for integrating optical isolators onto silicon photonics chips using "laser annealing," a localised, laser-based heat-treatment method.An optical isolator is a component ...

14 Sep 2026 | Monday | NEWS
Wasabi Technologies Launches Dedicated AI Business to Scale AI Storage Infrastructure

Wasabi Technologies, the hot cloud storage company, announced the creation of a dedicated AI business and appointed semiconductor and storage veteran Pinaki Mukherjee as senior vice president and general manager to lead it. Wasabi stores hundreds of petabytes of AI data for frontier model labs, generative AI startups, and neocloud compute providers worldwide. This new AI business brings...

14 Sep 2026 | Monday | NEWS
Ayar Labs Raises $150 Million to Scale Co-Packaged Optics for AI Datacentres

Ayar Labs, the leader in co-packaged optics (CPO) solutions for AI scale-up, announced it has secured an additional $150 million in funding, bringing its total primary capital raised in 2026 to $650 million. Separately, the company disclosed that Wiwynn made a strategic investment earlier this year. Wiwynn, a cloud IT and infrastructure provider for data centres, joins a growing group of strategic...

14 Sep 2026 | Monday | NEWS
Renesas Expands RZ/G Series with New MPUs for Industrial HMI and IoT Edge Systems

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, expanded its RZ/G Series with new 64-bit general-purpose microprocessors (MPUs) for Human Machine Interface (HMI) and IoT edge systems. The RZ/G3L and RZ/G3SE are pin-compatible MPUs that support a broad range of industrial and consumer HMI and IoT gateway and home gateway systems requiring high pro...

14 Sep 2026 | Monday | NEWS
JETRO and Purdue University Partner to Strengthen Japan-US Advanced Technology Innovation

The Japan External Trade Organisation (JETRO) and Purdue University announced the signing of a Memorandum of Understanding (MOU) to strengthen innovation collaboration in advanced technology fields and further connect the innovation ecosystems of Japan and the United States. The MOU was signed by Norihiko Ishiguro, Chairman and CEO of JETRO, and Mitchell E. Daniels, Jr., President of Purdue ...

11 Sep 2026 | Friday | NEWS
Semtech Launches Industry-First 10G PON OLT Chipset for Next-Generation Fibre Networks

Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductors powering AI data centre networking and intelligent, connected Internet of Things (“IoT”) devices worldwide, announced an industry-first chipset for 10G passive optical network (PON) optical line terminal (OLT) applications. As network operators globally begin scaling to 50G PON dep...

11 Sep 2026 | Friday | NEWS
Amkor Expands Arizona Advanced Packaging Campus with $12 Billion Investment

Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of outsourced semiconductor packaging and test services, announced phase 2 of its Arizona Advanced packaging and test campus. Driven by strong customer commitments that have surpassed the 33,000 square meters of cleanroom capacity planned for phase 1, the phase 2 expansion is expected to add 60,000 square meters and bring the campus to appr...

11 Sep 2026 | Friday | NEWS
Samsung and Mistral AI Partner to Advance Semiconductor Design and Manufacturing

Samsung Electronics Co., Ltd. announced it has entered into a strategic partnership with Mistral AI to enhance its semiconductor engineering and manufacturing capabilities, which will reinforce its leadership in AI chip technologies. The announcement of the partnership was made during the state summit held in Paris between South Korea and France. Under the agreement, Samsung will integrate Mistra...

11 Sep 2026 | Friday | NEWS

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