• Wednesday | 10 June 2026
Amtech Raises $60 Million to Expand Semiconductor Packaging and Wafer Substrate Business

Amtech Systems, Inc. ("Amtech") (NASDAQ: ASYS), a manufacturer of equipment, consumables and services for semiconductor device packaging, wafer production and device fabrication, announced the closing of its oversubscribed underwritten public offering of 2,926,829 shares of common stock, at a public offering price of $20.50 per share, for total gross proceeds of $60 million before deducting underw...

5 Jun 2026 | Friday | NEWS
Mouser Electronics Named Hirose Electric’s 2025 High Service Distributor of the Year

Mouser Electronics, Inc., the authorised global distributor of the latest semiconductors and electronic components, proudly announces it has been named the 2025 High Service Distributor of the Year by Hirose Electric USA, a global leader in the design and manufacture of innovative connector solutions. The Mouser team received the prestigious award at the recent EDS 2026 event in Las Vegas. Hi...

5 Jun 2026 | Friday | NEWS
Teledyne HiRel Launches Space-Screened Low-Noise Amplifier for LEO and MEO Satellites

Teledyne HiRel Semiconductors, a business unit of Teledyne Technologies Incorporated (NYSE: TDY) and a leading supplier of high-reliability RF and microwave solutions, announced the TDLNA0840SEP, a space-screened, ultra-low-power, wideband low-noise amplifier (LNA) designed to support the growing demands of satellite constellations in low Earth orbit (LEO) and medium Earth orbit (MEO), spaceb...

5 Jun 2026 | Friday | NEWS
Lightmatter Joins NVIDIA NVLink Fusion Ecosystem to Advance Optical AI Infrastructure

Lightmatter, the leader in photonic (super)computing, announced it has joined the NVIDIA NVLink Fusion ecosystem to accelerate the deployment of high-performance optical connectivity for AI infrastructure. Through this collaboration, Lightmatter will deliver Co-Packaged Optics (CPO) and Near-Packaged Optics (NPO) products that are compatible with NVIDIA’s optical and SerDes technol...

5 Jun 2026 | Friday | NEWS
Cenfire Launches CF2140 MEMS Switch Platform to Improve Semiconductor Test Efficiency

Cenfire announced sampling availability of its CF2140 MEMS switch platform, a 4-channel SPST switching solution designed to help semiconductor test organisations reduce switching complexity, improve system density, and lower the cost of test as semiconductor devices become faster, denser, and more complex. The CF2140 is a 4-channel SPST MEMS switch engineered using a silicon-based switching archi...

4 Jun 2026 | Thursday | NEWS
SurplusGLOBAL Secures Patents for AI-Powered Semiconductor Marketplace Technology

SurplusGLOBAL (CEO: Bruce Kim) announced that it has secured Korean patents covering two core technologies implemented within its global semiconductor equipment and parts marketplace, SemiMarket (www.SemiMarket.com): Demand & Supply Predictive Matching and Global Transaction Risk Management. The significance of these patents lies in their approach to treating export control compliance and tra...

4 Jun 2026 | Thursday | NEWS
Arasan Launches Industry’s First 16-Bit xSPI and PSRAM IP Solution for Next-Generation SoCs

Arasan Chip Systems, a leading provider of IP for mobile and automobile SoC's, is proud to announce the launch of the industry's first Sureboot™ Total 16-bit xSPI + PSRAM IP. The Sureboot™ Total xSPI + PSRAM 16-bit IP includes the controller IP, seamlessly integrated PHY IP and software stack. This IP is specifically engineered to support AP Memory's Xccela™ P...

4 Jun 2026 | Thursday | NEWS
SEMIFIVE Showcases 3D-IC and Big Die AI Chip Innovations at SAFE Forum 2026

SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, announced its participation in the Samsung Advanced Foundry Ecosystem (SAFE™) Forum 2026 in San Jose. At this forum, Brandon Cho, CEO and co-founder of SEMIFIVE, will deliver a presentation titled "Leading 3D-IC/Big Die Solution for AI Innovation." He will share SEMIFIVE's advanced design expertise in AI and Hi...

4 Jun 2026 | Thursday | NEWS
SEMIFIVE and ICY Tech Achieve Tape-Out of 8nm eMRAM-Based Edge AI SoC

SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, and ICY Tech, a Chinese AI semiconductor company, announced the successful tape-out of a next-generation Edge AI SoC jointly developed utilising Samsung Foundry's 8nm (8LPU) embedded Magnetic Random Access Memory (eMRAM) technology. This marks a significant milestone toward the first commercial deployment of 8nm ...

4 Jun 2026 | Thursday | NEWS
Airoha Expands Beyond Audio with New Bluetooth Chips for Smart Retail Applications

Airoha Technology announced its inaugural exhibition at the ePaper Pavilion during Computex 2026. Leveraging 20 years of deep technological expertise in wireless transmission, Airoha's Bluetooth® audio chips have earned widespread adoption and validation from global Tier-1 acoustic brands. Building on this robust foundation, Airoha is expanding its footprint in the "Short-range Wireless"...

4 Jun 2026 | Thursday | NEWS
ASPEED and Lattice Partner to Deliver Flexible Server Management for AI Data Centres

ASPEED Technology, the global leader in Baseboard Management Controllers (BMC) and Lattice Semiconductor (NASDAQ: LSCC), the low-power programmable leader, announced a strategic partnership to advance flexible, growth-oriented control capabilities for next-generation datacenter systems. As a first commercial result of this collaboration, ASPEED introduced the AST1840 Satellite Management Con...

3 Jun 2026 | Wednesday | NEWS
Nordic Semiconductor Expands AI Across the Entire IoT Development Lifecycle

Nordic Semiconductor (OSE: NOD), a global leader in low-power wireless connectivity solutions, brings AI-assisted development to all parts of the IoT device lifecycle. Nordic's complete chip-to-cloud solution is the first in wireless IoT to enable AI-assisted workflows across every stage - from the prototype to the deployed fleet. For developers, Nordic's AI capabilities deliver three concrete be...

3 Jun 2026 | Wednesday | NEWS
Imec and EVG Advance Hybrid Bonding Technology for Next-Generation 3D Chip Architectures

IEEE Electronic Components and Technology Conference (ECTC), imec, a world-leading research and innovation hub in advanced semiconductor technologies, and EV Group (EVG), leading provider of semiconductor manufacturing equipment and process solutions, present a robust and highly yielding wafer-to-wafer hybrid bonding technology at 200nm Cu interconnect pad pitch, demonstrated on a test vehicl...

3 Jun 2026 | Wednesday | NEWS
AuthenX Unveils Detachable Optical Interconnect Technology to Accelerate AI Data Centre Scaling

AuthenX Inc., a leading innovator in high-speed optical interconnect solutions, announced its exhibition lineup for COMPUTEX Taipei 2026 (June 2–5). The company will present advanced silicon photonics and meta-optics portfolios designed to eliminate the critical physical constraints impeding next-generation AI and HPC cluster scaling. The showcase will be headlined by the first live technica...

3 Jun 2026 | Wednesday | NEWS
Samsung Ships Industry’s First 12-Layer HBM4E Samples to Strengthen AI Memory Leadership

Samsung Electronics, a global leader in advanced memory technology, has begun shipping the industry's first 12-layer HBM4E samples to major global customers, further strengthening its leadership in the next-generation HBM market. Following the industry’s first mass production and commercial shipment of its industry-leading HBM4 earlier this year, Samsung now extends its HBM roadmap with the...

3 Jun 2026 | Wednesday | NEWS
HPE Launches NVIDIA Vera-Powered Server for Agentic AI and High-Performance Computing

COMPUTEX – HPE (NYSE: HPE) announced the expansion of its industry-leading server portfolio with the introduction of the HPE ProLiant Compute DL394 Gen12, powered by NVIDIA Vera CPU. This next-generation server is engineered specifically to address the compute demands of emerging high-performance AI and data processing workloads, delivering industry-leading agentic AI CPU performance, m...

3 Jun 2026 | Wednesday | NEWS
Cadence Unveils Autonomous AI Design Engineer to Accelerate Chip Verification

At Computex 2026, Cadence (Nasdaq: CDNS) announced the industry’s first fully autonomous virtual agentic AI design engineer, extending the ChipStack™ AI Super Agent to Level-5 autonomy. Built on Cadence’s AI-driven electronic design automation (EDA) portfolio with NVIDIA Nemotron models and secured by NVIDIA OpenShell runtime, the new agentic capabilities enab...

2 Jun 2026 | Tuesday | NEWS
Invisix Raises €20 Million to Advance Semiconductor Metrology Technology

Invisix, the semiconductor metrology company developing next-generation measurement tools for advanced chip manufacturing, has raised an oversubscribed €20 million seed round, which includes Hitachi Ventures, Transition Ventures, and imec. xpand, Doosan Investment Co., and a tier-1 semiconductor manufacturer. The funding will be used to grow the Invisix team, accelerate development of its fir...

2 Jun 2026 | Tuesday | NEWS
XCENA Raises $135 Million to Accelerate Global Growth in AI Memory Computing

XCENA, providing memory-centric computing solutions for AI infrastructure, announced it has closed $135 million (KRW 202 billion) in a Series B financing round. XCENA will use the funding to accelerate the company’s global expansion, scale customer deployments, and advance its next-generation computational memory solution. Total fundraising now stands at $185 million with a current valu...

2 Jun 2026 | Tuesday | NEWS
Emtar Technologies Named Semiconductor Startup of the Year at CHIPS NORTH Summit

Emtar Technologies Inc., a Canadian semiconductor company developing next-generation wireless SoCs and RF front-end solutions for satellite communications and non-terrestrial networks, announced it has received the “Semiconductor Achievement Award: Startup of the Year” at the CHIPS NORTH Executive Summit, hosted by Canada’s Semiconductor Council. The award recognises emergi...

2 Jun 2026 | Tuesday | NEWS

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