• Saturday | 13 June 2026
Polar Semiconductor, LLC and Nexperia B.V. Partner to Expand US Power MOSFET Manufacturing Capacity

Polar Semiconductor, LLC and Nexperia B.V. announced a strategic collaboration to manufacture next‑generation power MOSFET devices at Polar Semiconductor’s U.S.-- based wafer foundry. The partnership supports an expanded power MOSFET portfolio while strengthening supply for customers worldwide. By combining Polar’s deep expertise in power semiconductor manufacturing and ongoing capa...

29 May 2026 | Friday | NEWS
Aeonsemi Begins Production Shipments of Next-Generation ChronoPHY Ethernet Transceiver for AI Edge Infrastructure

Aeonsemi (www.aeonsemi.com), an innovator of mixed-signal and DSP connectivity ICs, today announced production shipments of AS22010, the second generation of its ChronoPHY™ multi-rate 10GBASE-T Ethernet transceiver family. The AS22010 reduces typical per-port power by 40% compared to the previous generation while simultaneously improving link stability, electromagnetic interference (EMI) imm...

29 May 2026 | Friday | NEWS
MaxLinear, Inc. and GCT Semiconductor Holding, Inc. Partner to Develop Integrated 5G Fixed Wireless and Converged Gateway Platforms

MaxLinear, Inc. (Nasdaq: MXL), a leading provider of radio frequency (RF) and mixed-signal integrated circuits for datacenter connectivity, data network, and carrier access infrastructure, and GCT Semiconductor Holding, Inc. (“GCT”) (NYSE: GCTS), a leading designer and supplier of 5G semiconductor solutions enabling advanced wireless connectivity, announced a strategic partne...

29 May 2026 | Friday | NEWS
Fortress Investment Group Acquires Patent Licensing Specialist IPValue Management Group

Fortress Investment Group announced the acquisition of IPValue Management Group (“IPValue”), one of the world’s leading intellectual property (“IP”) licensing companies. Funds managed by Fortress Investment Group affiliates (“Fortress”) led a group of investors that acquired the company. “Coming off our strongest year to date, we view Fortress as un...

29 May 2026 | Friday | NEWS
Gigaphoton Inc. Expands Kyushu Operations to Strengthen Semiconductor Customer Support and Engineer Training

Gigaphoton Inc. (Head Office: Oyama, Tochigi; President and CEO: Tatsuo Enami), a manufacturer of light sources for semiconductor lithography, announced that it has installed training lasers at its Kyushu office, with operations commencing in June 2026, further strengthening its customer support capabilities. The recent growth in the semiconductor industry, driven by increasing AI demand, is...

29 May 2026 | Friday | NEWS
AISIN Corporation Selects Green Hills Software for Next-Generation AI Driver Monitoring and Alcohol Detection Platform

Automotive Engineering Exposition Green Hills Software, the worldwide leader in embedded safety and security, announces that AISIN Corporation (AISIN) has chosen Green Hills Software as the trusted software foundation for its next-generation Driver Monitoring System (DMS) with Alcohol Detection System (DADS). Today, AISIN is developing their systems with Green Hills products integrated with k...

28 May 2026 | Thursday | NEWS
Altera Partners with US Defense Innovation Unit on Next-Generation Optical Networking for Space Communications

Altera, the industry’s largest pure-play FPGA solutions provider, announced it is working with the Defense Innovation Unit (DIU) to advance the development of a highly reconfigurable coherent Free Space Optics (FSO) modem prototype for the Resilient Adaptive Zero-latency Optical Relay for Broadband All-domain Communications (RAZORBAC) program. The effort builds upon prior Space-Based Adaptiv...

28 May 2026 | Thursday | NEWS
Viewtrix Technology Debuts on Hong Kong Stock Exchange with HK$10.9 Billion Valuation

Viewtrix Technology, a portfolio company of Qiming Venture Partners and a leading display chip design enterprise in China, successfully listed on the Hong Kong Stock Exchange, marking Qiming Venture Partners' sixth IPO since the beginning of the year. Viewtrix Technology (03310.HK) offered its shares at a price of HK$20.81 per share and opened at HK$25.48 per share with a market capitalisation of ...

28 May 2026 | Thursday | NEWS
Entegris, Inc. and JSR Corporation Sign EUV Materials Cross-Licensing Deal to Strengthen Next-Generation Semiconductor Manufacturing

Entegris, Inc. (Nasdaq: ENTG), a global leader in advanced materials and purity solutions for the semiconductor industry, and JSR Corporation, a materials innovation leader and the parent company of Inpria Corporation, announced entry into a non-exclusive cross-licensing agreement aimed at helping the semiconductor industry advance extreme ultraviolet (EUV) lithography for next-generation chip man...

28 May 2026 | Thursday | NEWS
Huawei Proposes ‘Tau Scaling Law’ as Post-Moore’s Framework for Future Semiconductor Development

IEEE International Symposium on Circuits and Systems (ISCAS) in Shanghai, He Tingbo, President of HUAWEI's Semiconductor Business Department, presented the Tau (τ) Scaling Law, a proposed successor to Moore's Law for guiding semiconductor development. This law proposes replacing geometric scaling with time (τ) scaling as a new guiding principle for the evolution of both semiconductors and...

28 May 2026 | Thursday | NEWS
SEMI Foundation Launches First Regional Workforce Hubs to Strengthen US Semiconductor Talent Pipeline

The SEMI Foundation, serving as the Hub Operator for the National Network for Microelectronics Education (NNME), announced the launch of the first four Regional Nodes of the NNME, marking a major national milestone in the effort to build America's microelectronics and semiconductor workforce at unprecedented scale. Funded by the U.S. National Science Foundation Directorate for Tech...

28 May 2026 | Thursday | NEWS
Wiwynn Showcases Rack-Scale AI Infrastructure and Next-Generation Data Centre Technologies at Computex 2026

Wiwynn (6669), an innovative cloud IT infrastructure provider for data centres, today announced to showcase its vision of next-generation data centre designs at Computex 2026 (Booth #J0106, TaiNEX1). The exhibition spans cutting-edge rack-scale AI servers, developed with Wistron, breakthrough cooling technologies, optical scale-up designs, and high-voltage DC (HVDC) power delivery architectures. ...

27 May 2026 | Wednesday | NEWS
Advanced Semiconductor Engineering, Inc. Unveils Industry-First Automated Panel-Level Packaging Line for AI and HPC Applications

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) and a leading provider of semiconductor assembly and test services, announced the development of an industry-first automated 310mm × 310mm panel-level packaging production line, advancing its leadership in next-generation advanced packaging technologies. This milestone expand...

27 May 2026 | Wednesday | NEWS
Magnachip Semiconductor Corporation Targets AI Data Centre Growth with Advanced MV MOSFET Portfolio at PCIM Europe 2026

Magnachip Semiconductor Corporation (NYSE: MX, “Magnachip”), a designer and manufacturer of power semiconductor solutions, announced that it will showcase its Medium-Voltage (MV) MOSFET portfolio for AI server and data centre power systems at PCIM Europe 2026, in Nuremberg, Germany. At Hall 6, Booth 337, Magnachip will exhibit its MV MOSFET solutions for server and data center power s...

27 May 2026 | Wednesday | NEWS
SK hynix Inc. Unveils iHBM Cooling Technology for Next-Generation AI Memory Systems

SK hynix Inc. (or "the company", www.skhynix.com) announced the launch of the iHBM solution that embeds integrated cooling elements(ICEs)[1] within the high-bandwidth memory(HBM) package for next-generation HBM products.  [1] ICE(Integrated Cooling Elements): A cooling element made of electrically non-conductive, thermally conductive silicon-based material, designed to dissipa...

27 May 2026 | Wednesday | NEWS
GlobalPlatform Launches Open-Source “Pavona” Silicon Platform with Embedded Post-Quantum Cryptography Stack

GlobalPlatform launched Pavona, an open-source silicon distribution that delivers production-quality, certification-ready IP components and reference top-level designs — including the first openly available post-quantum cryptography (PQC) stack for embedded silicon. The distribution includes two successfully taped-out reference designs—a standalone chip root of trust and an integrated ...

27 May 2026 | Wednesday | NEWS
Toshiba Electronic Devices & Storage Corporation Launches TXZ+™ Entry-Class M4H Microcontrollers for Consumer and Industrial System Control

Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has announced the TXZ+™ Family Entry‑Class M4H Group, standard microcontrollers[1] featuring an Arm® Cortex®‑M4 core with a floating-point unit (FPU). The new microcontrollers are designed for application in small‑scale system control of consumer products, such as air conditioners a...

27 May 2026 | Wednesday | NEWS
TEMC Acquires 31.17% Stake in A-Tech Solution to Expand Semiconductor Infrastructure Portfolio

TEMC announced that its board has approved the purchase of 3.1 million shares in A-Tech Solution, representing a 31.17% stake in the company. The transaction, valued at 35 billion won, will be completed through a cash acquisition from private equity investor Woori Shinyoung Growth Cap No.1 Private Equity Investment Partnership. The deal is expected to close in early June. The investment forms par...

26 May 2026 | Tuesday | NEWS
SiTime Expands Convertible Notes Offering to US$1.2 Billion Amid AI Infrastructure Growth

SiTime has expanded its convertible senior notes offering to US$1.2 billion as the semiconductor timing technology company strengthens its financial position amid continued growth in demand for advanced chip infrastructure. The enlarged fundraising reflects strong investor interest and is expected to provide additional flexibility to support the company’s long-term expansion strategy, inclu...

26 May 2026 | Tuesday | NEWS
Texas Tech University Secures $4.5 Million Texas CHIPS Funding to Advance Next-Generation Semiconductor Research

Researchers at Texas Tech University have secured approximately $4.5 million in funding from the Texas Semiconductor Innovation Fund to advance the development of wide- and ultrawide-bandgap semiconductor technologies for high-power electronics, defence applications and next-generation communications systems. The three-year project, titled Research and Development of Wide/Ultraw...

26 May 2026 | Tuesday | NEWS

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