• Saturday | 27 June 2026
ZEDEDA and SecEdge Partner to Strengthen Edge AI Security with Hardware-Rooted Protection

ZEDEDA, the leader in edge intelligence, and SecEdge, a provider of digital security solutions for physical AI infrastructure, announced a technology partnership to bring hardware-rooted security to ARM edge devices, closing one of the most significant gaps in enterprise edge AI deployments. The integration embeds SecEdge’s SEC-TPM firmware (fTPM) into ZEDEDA Edge Intelligence Platform,...

18 Jun 2026 | Thursday | NEWS
TSMC and Amkor Forge Decade-Long Partnership to Strengthen US Semiconductor Ecosystem

Taiwan Semiconductor Manufacturing Company (NYSE: TSM) and Amkor Technology, Inc. (Nasdaq: AMKR) announced a 10-year agreement to foster a strong partnership that will enhance advanced semiconductor packaging capabilities in Arizona, strengthening and accelerating investment in the U.S. semiconductor supply chain ecosystem. The agreement establishes a collaboration framework for TSMC to procure f...

17 Jun 2026 | Wednesday | NEWS
SEEQC Joins NORDTECH Initiative to Advance Scalable Quantum Chip Manufacturing in the US

SEEQC, Inc. (“SEEQC” or the “Company”), a developer and manufacturer of scalable, energy-efficient digital chips for quantum computing systems, announced its participation in a four-year Microelectronics Commons Northeast Regional Defense Technology Hub (NORDTECH) program. As one of eight U.S. Microelectronics Commons hubs, NORDTECH collaborates with regional part...

17 Jun 2026 | Wednesday | NEWS
Claros and Samsung Foundry Partner to Scale Integrated Voltage Regulators for AI Data Centres

Claros announced that it is collaborating with Samsung Foundry on process technology and semiconductor manufacturing to launch high-volume production of Claros’s integrated voltage regulator (IVR). The company’s IVRs are designed to deliver power directly to processing units in data centres, representing a novel approach to managing energy at the chip level inside AI infrastructur...

17 Jun 2026 | Wednesday | NEWS
PI Introduces High-Precision V-783 XY Stage for Semiconductor Inspection and Advanced Automation

For high-precision applications that do not require the ultimate geometric performance of air bearings, PI's new V-700 series of mechanical-bearing XY stages provides an attractive alternative. The V-783 high-precision linear motion stage combines long travel, nanometer-level positioning performance, and smooth high-speed scanning in a compact monolithic design. Designed and manufactured in t...

17 Jun 2026 | Wednesday | NEWS
Valens Semiconductor Powers Barco’s New ClickShare Extension Solution with HDBaseT Connectivity

Valens Semiconductor (NYSE: VLN) announced that its HDBaseT chipsets will form the connectivity infrastructure inside of Barco's ClickShare USB-C Extension over CAT kit. This product adds wired extension connectivity to Barco's ClickShare Hub, delivering reliable, low-latency USB-C extension for complex video conferencing installations. Barco's ClickShare products are recognised as premium w...

17 Jun 2026 | Wednesday | NEWS
Rapidus and Fondazione Chips-IT Forge Partnership to Strengthen Japan-Italy Semiconductor Collaboration

Rapidus Corporation announced that it signed a Memorandum of Understanding (MoU) with the Fondazione Chips-IT, an Italian private-law foundation dedicated to semiconductor circuit design. The Fondazione Chips-IT plays a central role in Italy's semiconductor ecosystem and collaborates with world-leading international research institutions and industry. In January of this year, the prime ...

17 Jun 2026 | Wednesday | NEWS
Semiconductor Industry Collaboration Unveils Open Ontology for AI-Powered EDA Workflows

The Silicon Integration Initiative (Si2) AI/ML Schema/Ontology Working Group announced the public release of its AI for EDA Ontology Repository, providing the semiconductor design community with a strong example of ontology and use cases to enable EDA agentic system experimentation for broader industry progress and collaboration. As agentic AI systems continue to emerge, the semiconductor in...

16 Jun 2026 | Tuesday | NEWS
Wolfspeed Appoints Dan Whalen to Lead Investor Relations as Company Strengthens Market Engagement

Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide technology, announced the appointment of Daniel (Dan) Whalen as Vice President, Investor Relations. In this role, he will lead the company’s investor relations strategy and engagement with the financial community as Wolfspeed continues to advance its long-term strategic and operational priorities. Dan brings extensive experien...

16 Jun 2026 | Tuesday | NEWS
PicoJool Unveils 200G VCSEL Technology to Accelerate Optical Connectivity for AI Data Centres

PicoJool, a pioneer in optical connectivity, is introducing its 200G Vertical Cavity Surface Emitting Lasers (VCSEL) products with a bandwidth exceeding 37GHz. The company will begin sampling chip-level products in the next quarter, including quad 100G, quad 200G and 32x50G NRZ uVCSELs for slow and wide applications. PicoJool is already working with system startups and hyperscalers to define the n...

16 Jun 2026 | Tuesday | NEWS
MicroLED Interconnect Market Gains Momentum as AI and HPC Drive Next-Generation Data Connectivity

The global MicroLED interconnect market is entering a period of accelerated growth as artificial intelligence (AI), high-performance computing (HPC), and next-generation data centre architectures drive demand for faster, more energy-efficient communication technologies. According to a new study by Grand View Research, the global MicroLED interconnect market was valued at USD 181.6 millio...

16 Jun 2026 | Tuesday | NEWS
Rapidus and UK Semiconductor Centre Forge Strategic Partnership to Strengthen Future Chip Manufacturing

Rapidus Corporation announced that it signed a Memorandum of Understanding (MoU) with the UK Semiconductor Centre (UKSC), a national body promoting the semiconductor industry in the UK, for future semiconductor manufacturing. The UKSC supports the development of the country's semiconductor ecosystem and growth strategies, as well as promotes international collaboration and technical par...

16 Jun 2026 | Tuesday | NEWS
Manz Asia Delivers World’s First 310mm Panel-Level Packaging ECD System for Volume Production

A leading semiconductor advanced packaging equipment manufacturer, Manz Asia, has successfully delivered the world's first 310 mm × 310 mm panel-level packaging (PLP) Electrochemical Deposition (ECD) mass production system. The system expands Manz Asia's advanced packaging portfolio and showcases its integrated in-house expertise in process innovation, equipment engineering, and high-volume ...

16 Jun 2026 | Tuesday | NEWS
IQM Quantum Computers Strengthens Board with Technology Industry Veteran Barbara Venneman

IQM Quantum Computers, the global leader in superconducting quantum computers, announced the appointment of Barbara Venneman to its Board of Directors. Venneman deepens the Board's expertise in digital transformation, enterprise technology commercialisation, and global business scaling as IQM expands its commercial footprint worldwide. Additionally, CEO and Co-founder Jan Goetz will replace Co-fou...

15 Jun 2026 | Monday | NEWS
DDN and NVIDIA Advance Enterprise AI Infrastructure for Agentic AI Deployment

DDN, the global leader in AI and data intelligence solutions, announced new advancements to its AI data intelligence platform designed to help enterprises deploy agentic AI faster, strengthen governance and security, reduce operational complexity, and maximise GPU efficiency across enterprise-scale AI factories. The innovations deliver real-time observability, policy-based control, secure multi-te...

15 Jun 2026 | Monday | NEWS
D-Wave Unveils Fault-Tolerant Quantum Computing Roadmap Targeting 100 Logical Qubits by 2032

D-Wave Quantum Inc. (NYSE: QBTS), (“D-Wave” or the “Company”), the only dual-platform quantum computing company providing both annealing and gate-model systems, software and services, announced a new gate-model roadmap designed to accelerate the development of commercial, fault-tolerant quantum computing. Targeting 100 logical qubits capable of successfully performing ...

15 Jun 2026 | Monday | NEWS
Wiwynn and Ecosystem Partners Advance Co-Packaged Optics for Next-Generation AI Data Centres

Wiwynn, an innovative cloud IT infrastructure provider for data centres, announced it will unveil its latest Co-Packaged Optics (CPO) interconnect technologies at Computex 2026 (Nangang Exhibition Centre Hall 1, Booth #J0106). The demonstration brings together ecosystem partners including Ayar Labs, Global Unichip Corp. (GUC), Browave, Corning Incorporated, FOCI, Molex, SENKO, and TE Connectivity....

15 Jun 2026 | Monday | NEWS
Synopsys and Samsung Foundry Deepen Collaboration to Accelerate AI and Multi-Die Chip Development

Synopsys, Inc. (Nasdaq: SNPS) announced at Samsung Advanced Foundry Ecosystem (SAFE) Forum 2026 its latest collaborations with Samsung Foundry on advanced nodes, including an expanded portfolio of production‑ready, AI-powered EDA tools, certified interface IP, and silicon-based test capabilities, enabling customers to bring differentiated AI and multi-die designs to market faster and w...

15 Jun 2026 | Monday | NEWS
Infineon Joins NVIDIA MGX Ecosystem to Advance 800V Power Architecture for AI Data Centres

Infineon Technologies (FSE: IFX) (OTCQX: IFNNY), a leading provider of power systems and IoT, has joined NVIDIA's MGX AI Factory ecosystem to help transform power delivery for next-generation AI data centres. Infineon's power management solutions will support NVIDIA's MGX™ architecture and 800 VDC power architecture, an open, modular reference architecture designed for AI factories in t...

15 Jun 2026 | Monday | NEWS
GigaDevice Strengthens Optical Communications Strategy with New MCU Portfolio

GigaDevice, a leading semiconductor company specialising in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, has introduced the new GD32E512 and GD32E252 series MCUs specifically designed for optical module applications. As a leading supplier of MCUs for optical module applications, GigaDevice has maintained a strong focus on the optical communicatio...

12 Jun 2026 | Friday | NEWS

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