EverProX Launches MSDL 20G Chipset for Low-Power Multi-Camera Vision Systems

EverProX Technologies Munich GmbH, under its Silicon Line® brand—a pioneer in ultra-low-power optical and electrical interconnect technology announced the launch of "MSDL™ 20G", which is the first product in the new MSDL™ family, an end-to-end interconnect chipset comprising the SL8582x serializer and SL8581x deserializer. Engineered to overcome the bandwidth, EMI, and reach limitations of traditional MIPI D-PHY signals, the dual-port chipset delivers up to two simultaneous 10 Gbps serialised links for next-generation vision systems.

Breaking Physical Cabling Bottlenecks

As high-resolution multi-camera systems and high-frame-rate displays drive rapidly increasing bandwidth requirements, traditional copper cabling is increasingly constrained by limited reach and susceptibility to electromagnetic interference (EMI). The "MSDL™ 20G" chipset, comprising SL8582x serializer and SL8581x deserializer, resolves this by aggregating multi-stream video over optical fibres or differential copper pairs, extending link distances to tens of meters while eliminating bulky, shielded cable bundles. The highly integrated architecture delivers ultra-low-power consumption in both optical and electrical modes, with total SerDes power well below 100 mW per 10 Gbps link.

Executive Perspective

"Physical AI is changing the way electronic systems are built. We are seeing more and faster cameras, more sensors, and greater intelligence distributed across devices," said Yifeng Liann, CEO and Managing Director of EverProX Technologies Munich GmbH. "As systems get smarter, moving high-bandwidth data between devices reliably and in real time becomes increasingly challenging. Engineers must balance the flexibility to connect across different subsystems, the reliability that mission-critical applications cannot always get from wireless, and the ultra-low power needed to make it all practical. That's the problem the Silicon Line® team set out to solve: making high-bandwidth connectivity more energy-efficient, more reliable, and easier to integrate into the next generation of intelligent systems."

Key Technical Highlights

• Dual-Port Multi-Camera Aggregation: Supports up to two simultaneous transmissions of single- or stereo-camera streams over one or two serialised links, with one transmission per link
• Optical or Copper Connectivity: Integrated VCSEL drivers and TIA enable optical links over tens of meters, while supporting differential copper links up to 2 meters
• Ultra-Low Power: Consumes just 71 mW per optical link and 87 mW per electrical link, excluding the integrated Sideband SerDes:
• Optical Mode: Serializer 17 mW, De-serializer 54 mW (Typical)
• Electrical Mode: Serializer 27 mW, De-serializer 60 mW (Typical)
• Integrated Bidirectional Sideband SerDes: Transports I²C, GPIO, digital audio, SPI/control signals and sensor clocks alongside MIPI data, reducing cable count, connector complexity, and system components.
• Target Applications:
• AR/VR: Enables lighter, more flexible tethering and greater mobility 
• Medical Endoscopy: Supports 4K/8K imaging, ultra-low heat generation, and thin optical connectivity
• Industrial Robotics and Machine Vision: Delivers reliable, EMI-immune high-speed vision connectivity in electrically noisy environments
• Defence and UAVs: Provides lightweight, low-power multi-camera connectivity that reduces cable weight and increases battery life