Baya Systems and AdoreSys Partner to Expand Chiplet and Data-Movement Solutions Across APAC

04 September 2026 | NEWS

Baya Systems and AdoreSys Partner to Expand Chiplet and Data-Movement Solutions Across APAC

Baya Systems, an innovator in software-driven fabric and system IP solutions, and AdoreSys, a leading semiconductor design solutions provider, announced a strategic partnership to offer Baya’s WeaveIP™ fabric and WeaverPro™ software platform together with AdoreSys’ ASIC design, integration and implementation expertise as a unified solution for semiconductor and systems companies in the rapidly expanding Chinese and Asian-Pacific markets.

Through the partnership, AdoreSys will provide access to Baya’s technology alongside its design and implementation services, creating a more integrated path from system architecture and design through silicon implementation. The collaboration will help customers address increasingly complex data-movement challenges across AI, data centre, automotive and high-performance computing applications.

“As Baya continues to scale globally, AdoreSys provides the local relationships and deep design expertise that can help us expand our reach in China and strengthen our presence across APAC,” said Sailesh Kumar, CEO of Baya Systems. “There’s a clear need for more flexible, data-movement-focused technologies. Together with AdoreSys, we can help bring those capabilities to more customers across the region.”

“As one of the world’s fastest-moving semiconductor markets, succeeding in Asia requires innovating quickly,” said KengSu Teoh, CEO of AdoreSys. “Our focus markets in HPC, data centre and automotive increasingly demand a new generation of data-movement technology. Baya’s software-driven approach is strongly aligned with our vision, helping customers explore and optimize advanced architectures faster and move more efficiently from concept to silicon.”

Baya’s WeaverPro™ software platform enables early architectural exploration and optimisation, while its WeaveIP™ portfolio provides scalable, high-performance fabric IP for implementation. Together with AdoreSys’ ASIC expertise and regional presence, the partnership enables customers to optimise data movement, performance and power while accelerating development of complex SoCs and multi-die systems and reducing design challenges. By combining architecture exploration, fabric technology and implementation expertise, Baya and AdoreSys aim to give customers a more efficient path from concept to silicon.