Socionext Advances 3DIC Innovation with TSMC SoIC-X Tape-Out for AI and HPC Applications
Socionext, the Solution SoC company, announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of complete solutions for consumer, AI, and HPC data center applications that include chiplets, 2.5D, 3D, and 5.5D packaging. Socionext empowers customers with a proven development process and unmatched expertise delivering high-performance, high-quality sol...
28 Sep 2025 | Sunday | NEWS
