• Sunday | 25 October 2026
GlobalFoundries Selected for $21 Billion US-Japan Semiconductor Fab Initiative

GlobalFoundries (Nasdaq: GFS) (GF) today announced it has been selected as the technology provider and operator for two new semiconductor manufacturing facilities (“fabs”) at its Malta, New York, site under a U.S.-Japan initiative providing up to $21 billion in funding. Enabled by President Donald J. Trump's trade and investment agreement with Japan, the initiative will accelerate trus...

19 Oct 2026 | Monday | NEWS
Applied Materials Opens $5 Billion EPIC Center for Semiconductor R&D

$5 billion investment creates the world’s largest semiconductor equipment and process technology R&D facility Purpose-built to accelerate the path from breakthrough innovation to high-volume manufacturing of next-generation chipmaking technologies Leading chipmakers, systems companies, equipment partners and research universities have committed to develop inside EPIC ...

14 Oct 2026 | Wednesday | NEWS
LG Expands Chiller Production in US and South Korea for AI Data Centres

LG Electronics is expanding chiller production across three manufacturing facilities by establishing a new factory in the United States and expanding production at its existing facilities in Changwon and Pyeongtaek, South Korea. The new U.S. facility in Virginia will enable local chiller production and help LG respond quickly to growing chiller demand across North America. Through its “O...

13 Oct 2026 | Tuesday | NEWS
GlobalFoundries Advances €1.1 Billion Dresden Expansion and Unveils FDX Fusion Platform

GlobalFoundries (NASDAQ: GFS) (GF) celebrated the topping-out of its SPRINT expansion project in Dresden and announced FDX Fusion, a next-generation platform for highly integrated, energy-efficient chips planned for development and manufacturing at the site. The platform is designed for demanding Physical AI applications. Together, the two milestones advance one of Europe's most significant semico...

12 Oct 2026 | Monday | NEWS
Canon Targets India’s Growing Semiconductor Market with Lithography Equipment and Local Support

Japanese technology group Canon is looking to deepen its presence in India's emerging semiconductor manufacturing industry, holding discussions with companies behind major chip projects and preparing to establish local service infrastructure as new fabs come online. Canon India President and CEO Toshiaki Nomura said the company has been in talks with key semiconductor manufacturers involved in pr...

7 Oct 2026 | Wednesday | NEWS
Infineon Opens New Semiconductor Manufacturing Facility in Thailand

German chipmaker Infineon Technologies has opened a new semiconductor manufacturing facility in Thailand, adding backend production capacity as the country steps up efforts to secure a larger role in the global chip supply chain. The new site in Samut Prakan, near Bangkok, begins operations with an initial investment of more than €100 million. Thailand's Board of Investment (BOI) has valued ...

7 Oct 2026 | Wednesday | NEWS
Baya Systems Targets Japan’s AI and Chiplet Market with Advanced Data-Movement Technology

In this exclusive interview,  Semicon Leaders Asia speaks with Nandan Nayampally, Chief Commercial Officer at Baya Systems, about the company’s expansion into Japan and the growing opportunities across the country’s semiconductor ecosystem. Nayampally shares his insights into the rising demand for AI, HPC, automotive and chiplet-based architectures, the importance of efficien...

8 Sep 2026 | Tuesday | Interaction
Baya Systems Expands in Japan to Support AI, HPC and Chiplet Semiconductor Growth

Baya Systems, a pioneer in software-driven, chiplet-ready semiconductor fabric IP, announced its expansion into Japan, one of the world's fastest-growing semiconductor markets. Amid Japan's investment in advanced manufacturing and AI infrastructure, Baya is deepening engagement with Japanese semiconductor companies, foundries and technology leaders building AI, HPC, automotive and chiplet-based sy...

26 Aug 2026 | Wednesday | NEWS
Bosch Secures US CHIPS Funding to Accelerate Silicon Carbide Semiconductor Production

Bosch, a leading provider of technology and services and the largest automotive supplier in the world according to external rankings, announced a definitive agreement with the Trump Administration for up to $225 million in direct funding from the Department of Commerce's CHIPS Program Office to support the up to $2 billion Bosch is investing to transform its Roseville, California site for the prod...

14 Jul 2026 | Tuesday | NEWS
Semiconductor Industry Collaboration Unveils Open Ontology for AI-Powered EDA Workflows

The Silicon Integration Initiative (Si2) AI/ML Schema/Ontology Working Group announced the public release of its AI for EDA Ontology Repository, providing the semiconductor design community with a strong example of ontology and use cases to enable EDA agentic system experimentation for broader industry progress and collaboration. As agentic AI systems continue to emerge, the semiconductor in...

16 Jun 2026 | Tuesday | NEWS
PicoJool Unveils 200G VCSEL Technology to Accelerate Optical Connectivity for AI Data Centres

PicoJool, a pioneer in optical connectivity, is introducing its 200G Vertical Cavity Surface Emitting Lasers (VCSEL) products with a bandwidth exceeding 37GHz. The company will begin sampling chip-level products in the next quarter, including quad 100G, quad 200G and 32x50G NRZ uVCSELs for slow and wide applications. PicoJool is already working with system startups and hyperscalers to define the n...

16 Jun 2026 | Tuesday | NEWS
Amtech Raises $60 Million to Expand Semiconductor Packaging and Wafer Substrate Business

Amtech Systems, Inc. ("Amtech") (NASDAQ: ASYS), a manufacturer of equipment, consumables and services for semiconductor device packaging, wafer production and device fabrication, announced the closing of its oversubscribed underwritten public offering of 2,926,829 shares of common stock, at a public offering price of $20.50 per share, for total gross proceeds of $60 million before deducting underw...

5 Jun 2026 | Friday | NEWS
King Yuan Electronics Corp Invests S$100 Million in Singapore Semiconductor Testing Facility

Taiwanese semiconductor testing company King Yuan Electronics Corp (KYEC) is investing S$100 million in a new semiconductor testing facility in Singapore as part of its broader international expansion strategy. The project is expected to create more than 300 jobs across engineering, operations and management roles, strengthening Singapore’s position within the global semicond...

25 May 2026 | Monday | NEWS
TuringEra Expands Central Asia Push with AI Appliance Launches and Kazakhstan Partnerships

TuringEra, a global leader in edge AI computing chips and full-stack solutions, successfully concluded a series of high-level commercial activities in Almaty this week. In addition to unveiling its "Cloud-Edge-End" AI appliance portfolio at GITEX AI Kazakhstan 2026, the company solidified its Central Asian expansion through strategic dialogues with regional industrial leaders and stakeholders...

11 May 2026 | Monday | NEWS
Liftr Insights Launches Predictive AI Scorecard for Hedge Funds and Semiconductor Markets

Liftr Insights announces the release of the Liftr® Indicator Scorecard™, a next-generation market intelligence index. This unique tool will fundamentally change how hedge funds and financial services firms identify, evaluate, and act on emerging signals across semiconductors, cloud providers, and AI infrastructure. The Indicator Scorecard introduces a scoring-based framew...

8 May 2026 | Friday | NEWS
Cadence and NVIDIA Deepen AI Engineering Partnership

Expanded collaboration combines agentic AI, physics-based simulation, and digital twins to accelerate engineering and unlock new levels of productivity across semiconductors, physical AI systems and AI factories At CadenceLIVE Silicon Valley 2026, Cadence (Nasdaq: CDNS) announced an expanded partnership with NVIDIA to deliver accelerated solutions across agentic AI, physics-based ...

29 Apr 2026 | Wednesday | NEWS
Flex and Teradyne Robotics Expand Partnership to Scale Intelligent Automation

Flex (NASDAQ: FLEX) and Teradyne Robotics are expanding their collaboration to accelerate intelligent automation across global manufacturing. Under the expanded relationship, Flex plays a dual role by deploying Teradyne Robotics solutions within its own production facilities while manufacturing key robotics components that enable scalable automation deployments for Teradyne Robotics customers...

24 Apr 2026 | Friday | NEWS
Cadence Design Systems and NVIDIA Expand Partnership to Accelerate AI-Driven Engineering

At CadenceLIVE Silicon Valley 2026, Cadence (Nasdaq: CDNS) announced an expanded partnership with NVIDIA to deliver accelerated solutions across agentic AI, physics-based simulation and digital twins to unlock new levels of productivity and accelerate next‑generation engineering design flows across semiconductor design, physical AI systems and hyperscale AI factories. By combining Cadence&rsquo...

20 Apr 2026 | Monday | NEWS
Silicon Box Expands Automotive Strategy with imec Chiplet Consortium Membership

Silicon Box, an industry leader in advanced semiconductor packaging solutions, announced that it has formally joined imec's Automotive Chiplet Program (ACP), a collaborative research initiative aimed at accelerating chiplet technology adoption required to drive the development of next-generation vehicles. Chiplet technology is recognised as a critical solution to address rising costs and bottlenec...

17 Apr 2026 | Friday | NEWS
Tageos and Pragmatic Semiconductor Expand Partnership with Sustainable NFC Inlay Solutions

Tageos, a global leader in RFID and BLE inlays, and Pragmatic Semiconductor, a pioneer in flexible semiconductor technology, announced the expansion of their long-term strategic partnership with the launch of Tageos' latest product portfolio based on Pragmatic's flexible and sustainable NFC Connect product line. The new Tageos EOS Lite and EOS Zero Lite lines deliver innovative antenna d...

16 Apr 2026 | Thursday | NEWS

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