• Sunday | 25 October 2026
Park Systems Opens New Global Headquarters to Support Semiconductor Growth

Park Systems Corp., the world's leading provider of atomic force microscopy (AFM) solutions, announced the opening of its new global headquarters in Gwacheon City, South Korea. The new campus marks the culmination of three decades of growth and the beginning of a new phase of global expansion. The Gwacheon campus reflects Park Systems' evolution from a Stanford-born research venture into a global...

8 Apr 2026 | Wednesday | NEWS
Eltek Secures $5.3m PCB Orders to Strengthen Global Presence

Eltek Ltd. (NASDAQ: ELTK), a leading global manufacturer of high-quality printed circuit boards, announced that it has received purchase orders totalling approximately $5.3 million from an international customer. The orders are scheduled for delivery beginning in the second quarter of 2026, with the final shipment expected in September 2027. "We are pleased with this award, which supports ou...

7 Apr 2026 | Tuesday | NEWS
Roundhill Launches DRAM ETF to Capitalise on AI Memory Demand

Roundhill Investments, an ETF sponsor focused on innovative financial products, announced the launch of the Roundhill Memory ETF (Ticker: DRAM). DRAM seeks to provide investors with targeted exposure to global companies operating within the memory segment of the semiconductor industry, including manufacturers of DRAM, High-Bandwidth Memory (HBM), NAND flash, and solid-state storage devices (SSD)....

7 Apr 2026 | Tuesday | NEWS
ACCM Launches Zero-Skew Laminate for Next-Generation High-Speed Designs

Advanced Chip & Circuit Materials, Inc. (ACCM) introduced Celeritas SF1600, a laminate and prepreg material that eliminates fiber weave skew at its root. Fiber weave skew is a materials problem, not a routing one. Woven glass creates a spatially periodic dielectric in which differential pairs travel alternately through resin-rich and glass-rich regions. In a differential pair, the two conducto...

7 Apr 2026 | Tuesday | NEWS
Corning and Meta Expand Manufacturing to Support AI Infrastructure Growth

Corning and Meta have commenced construction on an expanded cable manufacturing facility in North Carolina to support the growing demand for artificial intelligence (AI) infrastructure. The project is part of a broader multi-year partnership between the two companies, under which Corning will provide advanced optical fibre, cable and connectivity solutions for Meta’s data centres. The agree...

3 Apr 2026 | Friday | NEWS
Tower Semiconductor Targets Capacity Growth with Japan Fab Expansion

Tower Semiconductor has announced plans to increase its 300mm wafer production capacity in Japan as part of a broader strategy to meet rising customer demand and strengthen its position in specialised semiconductor technologies. The initiative forms part of a restructuring of the company’s Japanese operations, currently organised under TPSCo, a joint venture with Nuvoton Technology Corporat...

3 Apr 2026 | Friday | NEWS
GS Microelectronics U.S., Inc. and Tarana Wireless, Inc. Expand Strategic RF Partnership to Accelerate Next-Gen Wireless Innovation

GS Microelectronics U.S., Inc. (GSME) announced a strategic partnership with Tarana Wireless, Inc. to support RF transceiver products and accelerate the future roadmap of wireless technologies. The deal strengthens the long-standing partnership between GSME and Tarana, enhancing the overall market value by providing dedicated RF-Analogue engineering support for Tarana's products. The team will sup...

30 Mar 2026 | Monday | NEWS
Nox Group Expands into Reno with Major Data Centre Development

Nox Group, a hyper-scale industrial builder, is making a new home in Reno through a major data centre development, driving investment in the region’s workforce as it enters one of the country’s most sought-after markets for mission-critical infrastructure. Nox Group is one of the fastest-growing construction enterprises in the United States with four operating companies, including ele...

27 Mar 2026 | Friday | NEWS
EPIC Microsystems Secures $21M Series A to Advance AI Data Centre Power Delivery

 EPIC Microsystems, a semiconductor company developing breakthrough power delivery solutions for AI infrastructure, announced it has raised an oversubscribed $21 million in Series A funding to accelerate the development and commercialisation of its vertical power delivery technology for next-generation AI compute platforms. The funding round was led by Seligman Ventures, with participation fr...

26 Mar 2026 | Thursday | NEWS
OKI Launches Comprehensive EMS for AI Server Manufacturing

OKI (TOKYO: 6703) will launch Comprehensive Electronics Manufacturing Services (EMS) for AI server equipment on March 25, 2026. These comprehensive services will cover all processes, from the design and production of large-size multi-layer printed circuit boards (PCBs) incorporating OKI’s proprietary high heat dissipation technology supporting high-speed high-capacity data transmission, to c...

26 Mar 2026 | Thursday | NEWS
Kulicke and Soffa Industries Expands Memory Interconnect Portfolio with ProMEM Suite Launch

Kulicke and Soffa Industries, Inc. ("K&S", "Company") announced an expanded portfolio of memory–focused interconnect solutions, reinforcing its leadership across Ball, Vertical Wire, Advanced Thermo–Compression, and Hybrid Bonding technologies. As memory assembly evolves to support higher bandwidth, greater power efficiency, and tighter integration for AI-driven workloads, manufac...

25 Mar 2026 | Wednesday | NEWS
Kulicke and Soffa Industries Expands Interconnect Portfolio with ASTERION™-TW Ultrasonic Welding System

Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("K&S" or the "Company"), a global leader in semiconductor assembly solutions and wedge bonding technology, announced ASTERION™-TW, a new ultrasonic terminal welding system designed to support next-generation power module manufacturing. ASTERION™‑TW leverages K&S's longstanding leadership in interconnect innovation, expan...

25 Mar 2026 | Wednesday | NEWS
Advanced Micro Devices Expands Strategic Collaboration with Samsung Electronics for AI Infrastructure

Advanced Micro Devices has expanded its strategic collaboration with Samsung Electronics, reinforcing supply chain alignment for next-generation AI and data centre technologies. The agreement focuses on securing advanced memory solutions while also exploring potential manufacturing partnerships. Under the arrangement, Samsung is expected to supply its latest high-bandwidth memory (HBM4) for AMD&r...

24 Mar 2026 | Tuesday | NEWS
University of Warwick Secures Funding to Expand Semiconductor Reliability Testing Capabilities

The University of Warwick has secured new funding to strengthen the UK’s capacity for testing the reliability of advanced power semiconductors, supporting critical applications across electrification and energy systems. The investment will enable the acquisition of a state-of-the-art wide-bandgap (WBG) reliability and robustness testing platform, supplied by UK-based ipTEST. The system is d...

24 Mar 2026 | Tuesday | NEWS
E&R Engineering Corp. Expands North America Footprint with New Semiconductor Hub in Portland

Semiconductor equipment supplier E&R Engineering Corp. (8027.TW) announced its new office in Hillsboro, Portland. Following the establishment of its Phoenix, Arizona site, this second North American hub marks a milestone in providing localized support within the U.S. semiconductor ecosystem. Closer to Key Customers, with Order Visibility Extending to 2027 Driven by surging de...

19 Mar 2026 | Thursday | NEWS
HyperLight Corporation Launches 145 GHz Packaged Intensity Modulator

HyperLight Corporation, creator of the TFLN Chiplet™  platform, announced the release of its 145 GHz Packaged Intensity Modulator (IM), expanding the company‘s high-speed modulator portfolio. The new device is designed for ultra-wide modulation bandwidth, high signal fidelity, and stable operation control, enabling 448 Gbps per lane intensity-modulated-direct-detection (IMDD)...

17 Mar 2026 | Tuesday | NEWS
KIOXIA America, Inc. Showcases AI-Optimised Flash and SSD Solutions at NVIDIA GTC 2026

Next week at NVIDIA GTC 2026, KIOXIA America, Inc. will showcase its latest high-performance memory and solid-state drive (SSD) solutions designed to meet the growing demands of artificial intelligence (AI) workloads. As the premier global AI conference, GTC brings together developers, researchers, and business leaders to explore advances in accelerated computing and AI. At this ye...

17 Mar 2026 | Tuesday | NEWS
Semtech Corporation, Digital Barriers Partner on AI Video Compression for Cellular Surveillance

Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, announced a partnership with Digital Barriers to deliver a fully integrated device-to-cloud cellular video solution, Semtech Video Compression, purpose-built for critical video surveillance and analytics. The turnkey solution int...

11 Mar 2026 | Wednesday | NEWS
IonQ To Acquire SkyWater Technology In $1.8 Billion Deal To Strengthen Quantum Hardware Capabilities

IonQ, a leading developer of quantum computing hardware and technology platforms, today announced it has entered into a definitive agreement to acquire SkyWater Technology, the largest exclusively U.S.-based pure-play semiconductor foundry, in a transaction valued at approximately $1.8 billion. The deal will expand IonQ’s manufacturing footprint and enhance its hardware development and sup...

3 Feb 2026 | Tuesday | NEWS
Intel Stock Surges as Talk Grows of Potential Apple Partnership

Intel Corporation (NASDAQ: INTC) saw its shares rise more than 10%  as market speculation intensified around a potential manufacturing partnership with Apple Inc. Reports circulating among industry analysts and supply chain observers suggest that Apple may be evaluating Intel’s cutting-edge 18A process node to produce its next-generation M-series processors, including the rumored M6 a...

1 Dec 2025 | Monday | NEWS

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