SuperX and Chengtian Weiye Form Singapore Joint Venture to Deliver Advanced Liquid Cooling Solutions for Global AI Infrastructure

SuperX AI Technology Limited  announced that it has entered into a definitive agreement with the Hong Kong wholly-owned subsidiary of Shenzhen Chengtian Weiye Technology Co., Ltd. (Shenzhen Stock Exchange: 300689, "Chengtian Weiye") and its affiliates to jointly establish a joint venture company, SuperX Cooltech Pte. Ltd. ("SuperX Cooltech"), in Singapore. SuperX will become the single largest shareholder of the joint venture.

The joint venture will integrate the advantages of both parties in AI system integration and thermal management core components, operating under the cooperative brand "SuperX Cooltech" to provide liquid cooling products and infrastructure solutions to the global market (excluding mainland China, Hong Kong SAR, and Macau SAR).

Liquid Cooling Solutions: An Inevitable Industry Choice Driven by AI Iteration

As new generation GPU architectures like NVIDIA Blackwell push single-rack power consumption above 100kW, traditional air cooling methods are struggling to meet the high heat flux management demands of AI training and inference clusters. Power consumption and heat dissipation have become key bottlenecks restricting the deployment density, operational efficiency, and total cost of ownership (TCO) of AI data centers.

In this context, efficient rack-level liquid cooling technologies, including Cooling Distribution Units (CDUs), high-performance Micro Channel Liquid Cold Plates (MCLP), and integrated thermal management systems, are rapidly becoming the industry's preferred choice. Large-scale deployment of liquid cooling solutions not only significantly enhances the heat exchange efficiency and server stability of data centers, but also substantially improves the energy efficiency ratio of unit computing power (computing power/W), helping customers build greener, more economical high-performance computing infrastructure.

Strategic Synergy to Unlock Extreme Computing Power for Global Customers

By establishing a joint venture with Chengtian Weiye, SuperX incorporates Chengtian Weiye's research and development (R&D) as well as manufacturing capabilities in the liquid cooling field into its global business map. Chengtian Ketai (Ningbo) Thermal Management System Technology Co., Ltd., controlled by Chengtian Weiye, has already established a complete portfolio of key products such as Micro Channel Liquid Cold Plates (MCLP) and CDU systems, and possesses mass delivery capabilities. Chengtian Weiye's key products include liquid cold plates, VCs, MCLPs, nano-injection molded liquid cooling modules, manifolds, liquid cooling racks, and CDU systems, providing system-level thermal management solutions for global customers in AI, High-Performance Computing (HPC), communications, and renewable energy systems.

This cooperation will bring significant competitive advantages to SuperX:

• Completing the Full-stack Liquid Cooling Solution: SuperX will be able to offer global customers an end-to-end product matrix ranging from AI servers, liquid cold plates, and manifolds to complete liquid-cooled racks, simplifying the customer's procurement, deployment, and integration processes and reducing project risks.

• Building System-Level Technical Barriers: Through joint development in areas such as liquid cooling fluid dynamics, thermal path optimization, and electromechanical interface design, deep coupling of hardware and software will be achieved, building system-level performance advantages that are difficult to replicate quickly and establishing a long-term moat in high-density AI scenarios.

• Enhancing Global Delivery and Mass Production Capabilities: Leveraging Chengtian Weiye's mature engineering and intelligent manufacturing systems, the joint venture can quickly transform advanced R&D achievements into reliable, large-scale production capacity, meeting the stringent demands of global customers for high-quality, stable supply chains.

• Optimizing Customer Return on Investment: Shortening project delivery cycles through standardized modular design and reducing data center operating energy consumption via system-level thermal management optimization, thereby significantly enhancing the customer's long-term return on investment.