Universal Vapor Jet Unveils NovaJet for Dry, Maskless Semiconductor Thin-Film Deposition
UVJC’s first commercial UVJP system enables digitally patterned, solvent-free thin-film deposition without substrate heating, targeting advanced packaging and next-generation semiconductor manufacturing.
Universal Vapor Jet Corporation (UVJC), a wholly-owned subsidiary of Universal Display Corporation (UDC) (Nasdaq: OLED), is set to unveil NovaJet, the first commercial system built on its proprietary Universal Vapour Jet Printing (UVJP) platform, at the WESEMiBAY Semiconductor Ecosystem Conference and Expo in Shenzhen, China.
The launch marks UVJC’s first trade show appearance and introduces the company’s dry, solvent-free and maskless approach to thin-film deposition to one of Asia’s most important semiconductor ecosystems.
At Booth 8G03, a scale model of NovaJet will serve as the centrepiece of UVJC’s display, alongside coated substrates and printed samples produced on the production system installed and operating at its headquarters and R&D facility in Singapore.
“NovaJet is an important step in bringing UVJP closer to real-world manufacturing,” said Mr Chandran Nair, Chief Executive Officer of UVJC. “We look forward to introducing this advanced system to customers, partners and researchers attending WESEMiBAY, and discussing how UVJP can support a more precise, flexible and efficient path from materials research through manufacturing.”
Nair, together with UVJC’s Head of Business Development in China, Li Jiafan, will also present at the conference on “Enabling Dry and Patterned Thin-Film Printing for Next-Generation Manufacturing” on 15 October 2026, providing attendees with a deeper look at UVJP and its potential applications across semiconductor and advanced electronics manufacturing.
Demand for deposition methods that can deliver greater manufacturing precision, flexibility and process control continues to grow as the industry moves towards more complex device architectures, advanced packaging and new material systems.
A dry vapour-phase process for digitally patterned thin-film deposition, UVJP enables precise placement of functional materials directly onto substrates, while reducing process steps associated with solvents, masks, drying and lithography-related methods.
The process also works without substrate heating, making it suitable for delicate, non-planar and temperature-sensitive surfaces. It can support multiple materials and graded compositions in a single step, opening a broad range of potential applications across semiconductors and electronics, as well as life sciences and renewable energy.
