OpenAI announced a series of strategic partnerships with South Korean technology leaders Samsung and SK Group to accelerate the development of Stargate, a landmark $500 billion initiative aimed at building next-generation infrastructure for artificial intelligence. The announcements followed a meeting in Seoul between OpenAI CEO Sam Altman, South Korean President Lee Jae Myung, and senior execu...
Alchip Technologies, the dedicated high-performance and AI computing ASIC leader, validated its 3DIC ecosystem readiness with results from its 3DIC test chip tape out. The results vaulted Alchip into a clear 3DIC technology leadership because it validated an entire, integrated 3DIC solution, as well as its various elements. The test chip provided CPU/NPU core demonstration, UCIe and PCIe ...
QuickLogic Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) Hard IP, Strategic Radiation Hardened, Antifuse and ruggedized FPGAs, announced that its eFPGA Hard IP was selected for a new high-performance Data Center ASIC design that will be fabricated on an industry-proven 12 nm process technology. IP delivery for this contract is scheduled for Q4 2025. "We are excited...
-L&T Technology Services Limited , a global leader in AI, Digital & ER&D Consulting Services, announced a major milestone in its Sustainability segment with the signing of a $100 million multi-year agreement with a US-based industrial equipment manufacturer catering to the semiconductor value chain. Under the terms of the agreement, LTTS will support the clients’ initiat...
Sony Semiconductor Solutions Corporation (Sony) announced the upcoming release of the IMX775 CMOS RGB-IR image sensor with the industry's smallest[*1] pixel size of 2.1 µm, delivering both RGB and IR imaging on a single chip and a resolution of approximately 5 effective megapixels,[*2] designed for in-cabin monitoring cameras. *1 Among CMOS image sensor...
-Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation (TOKYO: 285A) and Sandisk Corporation announced the start of operation at the Fab2 (K2), a state-of-the-art semiconductor fabrication facility, at the Kitakami Plant in Iwate Prefecture, Japan. Fab2 has the capability to produce eighth-generation, 218-layer 3D flash memory, featuring the companies’ revolutionary CBA (CM...
Mitsubishi Electric Corporation announced that it has developed a new type of contactless body data sensor that can detect minute variations in heart rates, respiration, and other vital body indicators with high precision. It will enable the continuous and accurate daily measurement of such data in situations where the use of contact-type sensors, such as smartwatches, may be d...
MemryX, a leading U.S.-based semiconductor innovator specializing in AI acceleration, announced a significant expansion of its presence in the Kingdom of Saudi Arabia. Building on its strategic partnership with NEOM and recent membership in the National Semiconductor Hub, MemryX is accelerating investments in the Kingdom through hiring, training, partnerships, and local innovation initiatives. ...
Fourier Cooling Solutions ("Fourier"), a next-generation company dedicated to AI and HPC data center infrastructure, announced its official launch. Fourier introduces a portfolio of prefabricated, containerized data center solutions engineered to scale in step with the rapid evolution of GPUs, CPUs, and high-computing servers, meeting the accelerating demands of artificial intelligence (AI) and ...
Aiming to strengthen the private-sector-led domestic automotive semiconductor ecosystem, expanding interdisciplinary cooperation across foundries, fabless companies, packaging companies, and more The company hosted the inaugural Auto Semicon Korea with the goal to localize automotive semiconductors and create a self-sustaining domestic value chain and business opportuniti...
ShunYun Technology Ltd (SYT), a world-class manufacturer of optical transceivers, and NewPhotonics, a leading designer of highly integrated photonic integrated circuit (PIC) chips for data center optical interconnect, today announced a strategic OSAT partnership for volume manufacturing of the NewPhotonics NPG product line. Ethernet pluggable optics are forecasted to scale to >100 million by...
Taking place from October 28 to 30, 2025 at the Shenzhen World Exhibition & Convention Center (Bao'an), NEPCON ASIA is the premier platform to discover the latest technologies and market trends, connect with new suppliers and products, and explore potential partnerships and distribution opportunities. Featuring an ever-expanding showcase of automation equipment and technologies, the ...
Senior engineers, company leaders, investors, researchers and students of microelectronics are to have a new opportunity to meet, discover and learn with the launch of the Microelectronics UK exhibition, to be held on 24-25 September 2025 at the Excel London. The event, the first in the UK to bring together the entire microelectronics value chain, will feature zones and content for semiconducto...
SK keyfoundry, an 8-inch pure-play foundry in Korea, announced that it has successfully co-developed core technology and completed reliability testing of Direct RDL (Redistribution Layer) – a core semiconductor packaging technology based on 8-inch wafers – in collaboration with LB Semicon. This achievement marks a significant step forward in advancing next-generation semiconductor pa...
As artificial intelligence continues to reshape the global economy, fiber optic connections have emerged as a key enabler of the scale and speed AI factories require. A little-known but critical component — optical transceivers — is at the core, and FIC Global Inc. (TWSE: 3701; FICG), a leading expert in packaging and installing semiconductors on optical modules, is drawing...
As artificial intelligence continues to reshape the global economy, fiber optic connections have emerged as a key enabler of the scale and speed AI factories require. A little-known but critical component — optical transceivers — is at the core, and FIC Global Inc. (TWSE: 3701; FICG), a leading expert in packaging and installing semiconductors on optical modules, is drawing...
InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced that it has successfully taped out its advanced design for TSMC's Face-to-Face (F2F) SoIC technology, fully compliant with the UCIE 2.0 (Universal Chiplet Interconnect Express) standard. This milestone marks a significant achievement in enabling high-speed interconnects for heterogene...
Tekscend Photomask (formerly Toppan Photomask), the world's largest merchant photomask supplier for the semiconductor industry, has installed a state-of-the-art photomask laser writing system, the SLX1, at its Corbeil, France facility. This marks the first European deployment of the SLX1 system, manufactured by Swedish technology leader, Mycronic AB. The new system represents a strat...
Frost & Sullivan is pleased to announce that Baya Systems has been recognized with the 2025 Global Technology Innovation Leadership Recognition in the semiconductor IP interconnect solutions industry for its outstanding achievements in product innovation, strategic execution, and customer impact. This recognition highlights Baya Systems' consistent leadership in driving measurable ...
Delta, a global leader in power management and smart green solutions, inaugurated in Taiwan its Smart Manufacturing Innovation Center, a strategic hub for equipment validation and talent training programs to support customers implementing geographically-distributed production and smart centralized management. At this one-stop platform site featuring hands-on training as well as production verifi...