U.S.-based cloud services provider GMI Cloud revealed plans to build a $500 million AI data center in Taiwan, leveraging the latest NVIDIA Blackwell GB300 chips for unprecedented compute power. This state-of-the-art facility, expected to go live in March 2026, will house around 7,000 GPUs across 96 high-density racks and deliver nearly 2 million tokens per second, all while drawing approximately 1...
Wolfspeed, Inc., a global leader in silicon carbide technology, announced its new 1200V SiC six-pack power modules that redefine performance benchmarks for high-power inverters. By combining its latest advanced Gen 4 SiC MOSFET technology and innovative packaging, Wolfspeed’s modules deliver three times more power cycling capability at operating temperature than competing solutions, and 15% ...
PowerLattice, the company reimagining power delivery for next-generation AI accelerators, announced its emergence from stealth with $25 million in Series A funding jointly led by Playground Global and Celesta Capital. The company’s breakthrough power delivery chiplet tightly couples power and compute, reducing total compute power needs by more than 50%, effectively doubling performance. Powe...
Dell AI Factory with NVIDIA advancements accelerate deployment of AI applications, from traditional to agentic, creating integrated, efficient IT environments Dell ObjectScale and PowerScale, the Dell AI Data Platform’s storage engines, accelerate workflows for AI applications and high performance compute with NVIDIA Dynamo integration Dell Automation Platform expansion offers automate...
Hummink is redefining how the world’s smallest technologies are made, using ultra-precise printing to fix microscopic flaws and power the next generation of chips and displays. As microelectronics underpin the rise of artificial intelligence and high-performance computing, the smallest manufacturing imperfections have become billion-euro problems. Each defect at the sub-micron scale...
Galbot is proud to announce two major technological advancements in embodied intelligence: DexNDM, a neural dynamics model designed to revolutionize robotic dexterous manipulation, and NavFoM, the world's first cross-embodiment, cross-task navigation foundation model. Developed in collaboration with Tsinghua University, Peking University, University of Adelaide, and Zhejiang University, these in...
Targeting edge LLM applications, accelerating edge AI ecosystem development VeriSilicon (688521.SH) recently announced the joint launch of the Coral NPU IP with Google, targeting always-on, ultra-low-energy edge Large Language Model (LLM) applications. The IP is based on Google’s foundational research in open machine learning compilers and enhanced with AI security features, pro...
New program comes in response to surging demand for CoreWeave’s purpose-built AI cloud, saving customers more than a million dollars for typical data migrations CoreWeave, Inc. (Nasdaq: CRWV), The Essential Cloud for AI™, announced the launch of its Zero Egress Migration (0EM) program — a true no-egress-fee data migration program — enabling customers to mov...
First product based on collaboration, the IntelPro IPRO7AI, integrates multi–mode wireless, security, multimedia, and AI processing to power next–generation smart home, industrial, and consumer IoT devices As artificial intelligence and seamless connectivity converge to redefine the Internet of Things (IoT), demand is rising for platforms that combine low–power wireless, securit...
Fabric8Labs, the company pioneering Electrochemical Additive Manufacturing, announced a $50 million funding round to expand its U.S.-based advanced manufacturing facilities, boosting capacity to produce tens of millions of components annually. Powered by its breakthrough Electrochemical Additive Manufacturing (ECAM) technology, Fabric8Labs is scaling up production of next-generation electronic...
SK keyfoundry, an 8-inch pure-play foundry in Korea, announced that it is accelerating the development of SiC (Silicon Carbide)-based compound power semiconductor technology, bolstering its efforts into the global power semiconductor market. Leveraging its advanced manufacturing expertise and extensive intellectual property (IP) portfolio across the semiconductor manufacturing process, the compa...
Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, announced that it has delivered the industry’s first sixth-generation Registered Clock Driver (RCD) for DDR5 Registered Dual In-line Memory Modules (RDIMMs). The new RCD is the first to achieve a data rate of 9600 Mega Transfers Per Second (MT/s), surpassing the industry standard. This brea...
Asahi Kasei Microdevices Corporation (AKM) will showcase its latest sensing technologies for the growing AgeTech and PetTech markets at CES® 2026. The demonstrations, featuring technologies such as millimeter-wave radar and energy-harvesting innovations, will be presented in the Digital Health section of the Venetian Expo at booth 54829. With aging populations driving increased demand for s...
New Cambridge location to be the center of U.K. and EU semiconductor operations Baya Systems, a pioneer in software-driven, chiplet-ready semiconductor fabric IP for scalable AI and high-performance computing, announced the opening of its first European office in the U.K. The move represents a strategic step in Baya’s global growth, expanding its reach into Europe’s rapidl...
400G/Lane, TFLN modulator-based innovation to play a key role in the future of computing POET Technologies Inc.a leader in the design and implementation of highly-integrated optical engines and light sources for artificial intelligence networks, and Quantum Computing Inc. (QCi) (NASDAQ: QUBT), an innovative integrated photonics and quantum optics technology company, today an...
United Micro integrates Ceva-PentaG Lite 5G platform IP in RedCap SoC, delivering cost–efficient, secure, and scalable connectivity for next–generation vehicles As automakers expand connected vehicle offerings, 5G RedCap is emerging as a cost–efficient complement to traditional 5G, enabling mass–market adoption of vehicle connectivity without compromi...
Wolfspeed, Inc. (NYSE: WOLF), a global leader in innovative silicon carbide power solutions, announced a collaboration with Hopewind, a global innovator in renewable energy solutions. Together, the two companies will advance the development of the next generation of wind power solutions by integrating Wolfspeed’s cutting-edge 2.3kV LM Pack Module into Hopewind’s advanced highly modul...
New platform provides a Kubernetes-native foundation for running AI workloads on NVIDIA AI infrastructure, combining advanced isolation, dynamic scaling, and hybrid networking. (KubeCon + CloudNativeCon North America 2025, ) —vCluster Labs, the company pioneering Kubernetes virtualization, today announced its Infrastructure Tenancy Platform for AI to help organizations build and...
Three new endoscopes set to launch, including an innovative laparoscope, a 3D imaging solution for robotic surgeries, and the first single-use colonoscope with 4K video resolution Valens Semiconductor announced that the first endoscopes powered by its VA7000 chipset will be launched by three OEMs, signaling strong momentum for Valens' entry into the medical imaging market. The products in...
New Mini-QD connector enables use of next-generation optical pluggable modules; UQD v2 specification enforces greater precision As AI workloads push thermal limits in data centers higher than ever, Stäubli is leading a new phase of standardization in liquid-cooling technology designed for the next generation of high-performance computing. At the Open Compute Project (O...