INCERGO S.A. (Symbol: ICG) announces that, effective February 19, 2026, its issued share capital has increased from 5,060,000 to 151,283,387 registered ordinary shares. The issuance of 146,223,387 new shares has been duly registered and is effective on the Vienna Stock Exchange as of today. The company announced further progress in its merger with Visual Semiconductor Inc. (VSI). The newly issued...
SPIE, the international society of optics and photonics, Cadence Design Systems, Inc., and the Cadence Giving Foundation have partnered to jointly fund the Ya-Chieh Lai Memorial Scholarship. Starting in 2027 and spanning five years, the annual $10,000 scholarship will be awarded to a university student during the SPIE Design Technology Co-Optimization (DTCO) conference at ...
SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, announced that it has secured a design win from Niobium, a U.S.-based leader in Fully Homomorphic Encryption (FHE) hardware acceleration platforms. This partnership represents a strategic milestone in SEMIFIVE's expansion in the U.S. market. The contract, valued at around KRW 10 billion (USD 6.86 million), covers the...
Tickeron has reported notable outperformance from its artificial intelligence trading agents focused on the semiconductor sector, with certain strategies generating returns exceeding 100 per cent. The results reflect heightened investor interest in chipmakers and equipment suppliers amid continued momentum in AI-driven technologies. According to the company, its AI-based trading models achieved s...
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, announced a configurable ternary content-addressable memory (TCAM) built on a 3nm FinFET process. The new TCAM simultaneously delivers higher density, lower power and strengthened functional safety, making it suitable for automotive applications. Renesas presented the results at the International So...
Aitech and Teledyne e2v Semiconductors are proud to highlight their continued collaboration in advancing space-grade computing. Through their ongoing partnership, Teledyne e2v’s high-reliability semiconductors are being integrated into Aitech’s SP1, a radiation-tolerant 3U SpaceVPX single-board computer (SBC). Designed for deployment in LEO, GEO, lunar, and deep space missions, t...
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiP...
Keysight Technologies, Inc. (NYSE: KEYS) introduced 3D Interconnect Designer, a new addition to its Electronic Design Automation (EDA) portfolio. The solution addresses the mounting complexity of designing 3D interconnects for high-chiplet and 3DIC advanced packages used in AI infrastructure and data center applications. As chiplet architectures are increasingly adopted, engineers face compl...
Efinix®, Inc., the FPGA pioneer accelerating edge AI innovation, announced that Boon Chye (BC) Ooi has joined its Board of Directors. Ooi, a semiconductor industry veteran with more than 45 years of operational leadership experience, will provide strategic guidance as Efinix scales its business and expands its market presence in FPGA and edge AI applications. Ooi brings unparalleled expertise...
ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. ...
Lam Research Corp. (NASDAQ: LRCX) commemorated the opening of its new office in Boise, Idaho, joined by U.S. Senator Jim Risch, representatives of Micron Technology, Inc. and other distinguished local government, community, and academic leaders. The new office will initially support approximately 150 Lam personnel from the greater Boise area focused on collaborative research, devel...
Ambiq Micro, Inc. (“Ambiq®”)— Ambiq, a leader in ultra-low-power semiconductor solutions, announced soundKIT, its fourth open-source AI Development Kit (ADK), designed to accelerate the adoption of always-on, real-time, on-device audio and speech intelligence for power-constrained edge devices. Built for Ambiq’s ultra-low-power system-on-chips (SoCs), soundKIT ena...
Microchip Technology has reported signs of strengthening demand as semiconductor distribution channels return to more balanced levels, enabling the company to prioritise debt reduction and improve its financial position. According to company leadership, customer orders have begun to exceed shipments, signalling a gradual recovery in market activity and renewed customer confidence. The company exp...
Texas Instruments has introduced a new range of automotive semiconductor solutions designed to enhance vehicle safety and enable higher levels of driving automation. The latest portfolio reflects the company’s ongoing efforts to support the automotive industry’s transition towards more intelligent, connected and software-defined vehicles. A key component of the annou...
SkyWater Technology (NASDAQ: SKYT), the largest exclusively U.S.-based pure-play semiconductor foundry, announced the appointment of Christine Dunbar as senior vice president of sales and solutions engineering, reporting directly to President and COO John Sakamoto. In her role, Dunbar will focus on accelerating customer acquisition and scaling growth across the company’s core platforms....
Munich Security Conference, 15 companies from Africa, Asia, Europe, and North America announced the launch of the Trusted Tech Alliance (TTA), a group of likeminded global technology providers coming together to work across borders, and based on a shared set of principles for a trusted technology stack – from connectivity, cloud infrastructure, and semiconductors to software and AI. &nb...
Dr. Bruce Gnade, professor emeritus of materials science and engineering and director of workforce development at the North Texas Semiconductor Institute at The University of Texas at Dallas, was elected Feb. 10 as a member of the National Academy of Engineering (NAE), one of the highest professional distinctions accorded to an engineer. Gnade is one of 158 members, ...
Efficient Power Conversion (EPC), the world leader in enhancement-mode gallium nitride (eGaN®) power devices, today announced a comprehensive licensing agreement with Renesas Electronics Corporation, a premier global supplier of advanced semiconductor solutions and high-voltage GaN transistors. Under the agreement, Renesas will gain access to EPC’s proven low-voltage eGaN technology and...
Trio-Tech International (NYSE MKT: TRT), a comprehensive provider of semiconductor back-end solutions and a global value-added supplier of electronic equipment, announced financial results for its fiscal second quarter ended December 31, 2025. The Company reported 82% year-over-year revenue growth, driven primarily by strong demand for advanced semiconductor testing services supporting AI compute ...
At SmallSat Symposium 2026, VORAGO Technologies, a radiation-hardened and radiation-tolerant chip provider for space applications, announced a software partnership with wolfSSL, a company specialising in embedded cryptography for secure systems, successfully for the last 20 years. This unique partnership delivers radiation-hardened chips with built-in, standards-based cryptographic secur...