• Thursday | 14 May 2026
YY-IC Integrates ISO 9001 to Strengthen Global Electronic Component Sourcing

As the global electronics manufacturing sector faces the dual challenges of capacity volatility and geoeconomic supply fragmentation, YY-IC, a leading digital ecosystem for electronic component procurement and risk management, announced the formal integration of the ISO 9001 Quality Management System into its global operations. According to YY-IC Supply Chain Intelligence Data...

4 Mar 2026 | Wednesday | NEWS
Nordic Semiconductor Expands Cellular IoT Portfolio with nRF92 and nRF93 Series

Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, announces a major expansion of its ultra-low-power cellular IoT products and technologies designed to deliver secure, global connectivity as networks and satellite NTN evolve.  "Nordic is building the next era of cellular IoT, and we are expanding our portfolio to ...

4 Mar 2026 | Wednesday | NEWS
Xsensio Raises $7M Series A to Advance Continuous Biochemical Monitoring

Xsensio SA, a Swiss deep-tech company pioneering near real-time continuous biochemical monitoring, announced the successful closing of a $7M oversubscribed Series A financing round. The round was led by San Francisco-based venture capital firm WI Harper, with participation from Privilège Ventures, the European Innovation Council, and private investors across the United States, Europe, and A...

4 Mar 2026 | Wednesday | NEWS
MetaOptics Develops Compact Tunable Metalens Module for 3D Fingerprint Biometrics

MetaOptics Ltd (Catalist: 9MT) ("MetaOptics" or the "Company", and together with its subsidiaries, the "Group") has announced plans to develop a compact optical module for 3D non-contact fingerprint biometrics, designed to support future smartphone integration possibilities. The project enhances the Company's existing 3D sensing technology by reducing optical stack size and incorporating elec...

3 Mar 2026 | Tuesday | NEWS
MaxLinear Showcases Expanding Sierra-Powered Open RAN Portfolio at MWC 2026

MaxLinear, Inc. (Nasdaq: MXL), a leading provider of wireless infrastructure solutions, announced that it will showcase a growing range of commercially available Open RAN Radio Units (O-RU) based on its Sierra single‑chip radio SoC at Mobile World Congress (MWC) 2026 in Barcelona. ttendees visiting meeting room 2L8MR in Hall 2 will see demonstrations of several new Sierra-powered O-RUs, in...

3 Mar 2026 | Tuesday | NEWS
GCT Semiconductor to Showcase 5G and IoT Innovations at MWC 2026

GCT Semiconductor Holding, Inc. (“GCT” or the "Company") (NYSE: GCTS), a leading designer and supplier of advanced 5G and 4G semiconductor solutions, announced that it will showcase its latest 5G and IoT capabilities at its exhibit at Mobile World Congress (MWC) 2026, taking place March 2-6, in Barcelona, Spain. GCT will host partners and customers at its booth to unveil its ...

3 Mar 2026 | Tuesday | NEWS
SambaNova Survey Highlights Rising Public Concern Over AI Energy Demand

SambaNova, builders of the fastest chip for agentic AI, released research highlighting the mounting concerns over the energy demands of AI data centres and the impact on households and national power grids. As AI deployment accelerates, business leaders and consumers are aware that legacy, GPU-based infrastructure is not built for the efficiency and scale required in a power‑constrained wor...

3 Mar 2026 | Tuesday | NEWS
Renesas Appoints New Presidents for India and China to Drive Regional Growth

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, announced new leadership appointments to accelerate its growth strategy in two of the world’s most dynamic and fast-expanding markets, India and China. Effective March 1, 2026, Malini Narayanamoorthi assumed the title of Vice President and President of Renesas Electronics India. She formerly ...

3 Mar 2026 | Tuesday | NEWS
Rapidus Secures ¥267.6 Billion to Advance 2nm Semiconductor Production

Rapidus Corporation announced that it has completed a funding round totalling 267.6 billion yen (equivalent to $1.7 billion USD) from the Japanese government and private sector companies. A total of 100 billion yen was invested from the Information-Technology Promotion Agency (IPA), Japan, an independent administrative agency under the jurisdiction of the Ministry of Economy, Trade and Indus...

2 Mar 2026 | Monday | NEWS
DNP Invests in Rapidus to Support 2nm Semiconductor Mass Production

Dai Nippon Printing Co., Ltd. (DNP, TOKYO:7912) announced that it has participated in Rapidus Corporation’s funding round as one of the round investors. This strategic funding initiative supports Rapidus’ plan to steadily progress from its current R&D phase to mass production of 2nm (10⁻⁹ meters) logic semiconductors by 2027. Through this initiative, DNP will advance the devel...

2 Mar 2026 | Monday | NEWS
MP Materials Selects Texas Site for $1.25 Billion Rare Earth Magnet Campus

MP Materials Corp. (NYSE: MP) today announced it has selected a 120‑acre site in Northlake, Texas, to develop “10X,” the company’s planned large-scale rare earth magnet manufacturing campus. Located less than 10 miles from MP’s existing Independence facility in Fort Worth, the new campus will cement North Texas as the center of gravity for the United States’ rare ea...

2 Mar 2026 | Monday | NEWS
Magnachip Semiconductor Corporation Launches 7th-Gen 24V MOSFET for Tri-Fold Smartphones

Magnachip Semiconductor Corporation (NYSE: MX, “Magnachip”) announced the launch of its new 7th-generation 24V MXT LV MOSFET1 specifically designed for battery protection circuits in next-generation tri-fold smartphones, strengthening its presence in the premium foldable smartphone market. The product is now in mass production and is currently being supplied to a major global smar...

27 Feb 2026 | Friday | NEWS
Renesas Electronics Corporation ADAS SoC Selected for Toyota Motor Corporation RAV4

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, announced that its ADAS automotive system-on-chip (SoC), R-Car V4H, has been selected for the TSS(LSS) control unit used in Toyota Motor Corporation’s new RAV4 model, which debuted in December 2025. The control unit is supplied by Denso Corporation. Engineered for advanced ADAS (Advanced Drive...

26 Feb 2026 | Thursday | NEWS
The Chemours Company Executive Joins SEMI North America Advisory Board

The Chemours Company (Chemours) (NYSE: CC), a global chemistry company, announced that Gerardo Familiar, President of the company's APM business, has been appointed to the SEMI North America Advisory Board (NAAB). SEMI is a global industry association serving thousands of member companies across the semiconductor and electronics design and manufacturing supply chain. The SEMI N...

25 Feb 2026 | Wednesday | NEWS
SambaNova Systems Unveils SN50 AI Chip, Plans Strategic Collaboration with Intel

SambaNova introduced their SN50 AI chip, which boasts a max speed that’s 5X faster than competitive chips. The company also announced a planned collaboration with Intel to deliver high‑performance, cost‑efficient AI inference solutions, and more than $350M in investment from new and existing investors. Positioned as the most efficient chip for agentic AI, the SN50 chip offers ...

25 Feb 2026 | Wednesday | NEWS
Apple Inc. Expands U.S. Chip and Semiconductor Manufacturing in Houston

Apple® announced a significant expansion of factory operations in Houston, bringing the future production of Mac mini® to the U.S. for the first time. The company will also expand advanced AI server manufacturing at the factory and provide hands-on training at its new Advanced Manufacturing Center beginning later this year. Altogether, Apple’s Houston operations will create thousands...

25 Feb 2026 | Wednesday | NEWS
KIOXIA America, Inc. Begins Shipping UFS 5.0 Evaluation Samples

KIOXIA America, Inc. today announced that it has begun shipping evaluation samples1 of embedded flash memory compatible with the next-generation UFS standard, UFS 5.0, which is currently being standardized by JEDEC®2. UFS 5.0 is a new standard for embedded flash storage designed to meet the performance requirements of next-generation mobile devices such as high-end smartphones equip...

25 Feb 2026 | Wednesday | NEWS
proteanTecs and Gubo Technologies Partner to Enhance AI Chip Visibility

proteanTecs®, a leading provider of deep data health and performance monitoring solutions for advanced electronics, and Gubo Technologies Co., Ltd., China’s first post silicon workflow automation solution provider, today announced a collaboration to deliver combined semiconductor analytics solutions. The collaboration is intended to provide broad, actionable insights into yield, quality,...

25 Feb 2026 | Wednesday | NEWS
Fractilia Secures First Production Deployment of FAME 300 System

Fractilia, the industry leader in high-accuracy stochastics metrology and control, announced that its FAME 300™ system has been adopted for production use by a top-five semiconductor device maker, marking the first time an in-line stochastics control solution has been fully integrated into a modern manufacturing environment. Fractilia confirmed that FAME 300 has been deployed as a fully aut...

25 Feb 2026 | Wednesday | NEWS
Baya Systems and Aion Silicon Partner to Accelerate SoC and Chiplet Development

Baya Systems, a pioneer in software-driven, chiplet-ready semiconductor fabric IP for scalable AI, high-performance computing (HPC), and automotive applications, today announced a partnership with Aion Silicon (formerly Sondrel), a leading ASIC and SoC architecture and design services company. Together, the companies are delivering a joint solution that enables faster definition, design,...

24 Feb 2026 | Tuesday | NEWS

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