Trio-Tech International (NYSE American: TRT), a comprehensive provider of semiconductor back-end solutions and a global value-added supplier of electronic equipment, announced financial results for its fiscal third quarter ended March 31, 2026. The Company reported 124% year-over-year revenue growth, driven primarily by strong demand for semiconductor reliability testing services. Trio-Tech Inte...
DEEPX, a leading fabless AI semiconductor company specialising in ultra-low-power Neural Processing Units (NPUs), announced a visionary partnership with Ultralytics, the company behind Ultralytics YOLO, the most widely deployed computer vision architecture in the world, with over 130K GitHub stars. Ultralytics has evolved far beyond a traditional AI model creator to become the definitive develope...
ScioSense, a leading developer and manufacturer of semiconductor-based environmental and flow sensors, launched the UFC23 – the 4th generation ultrasonic flow converter for measurement in water, heat and gas meters. How can meter manufacturers improve measurement accuracy, extend battery life, and retain control of their preferred system architecture? In modern applications, flow calcu...
United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, announced the release of its 14nm embedded high-voltage (eHV) FinFET technology platform for display driver ICs, with the process design kit now available for customer designs. Successfully validated at UMC’s Fab 12A, the new process boosts power efficiency and performance...
AI-related semiconductor stocks rallied again on Wednesday after Nvidia chief executive Jensen Huang joined former US President Donald Trump during a prominent visit to China. Investors viewed the development as a positive indication for future discussions surrounding trade and technology cooperation between the United States and China. The surge in chip shares was also driven b...
QuickLogic Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) Hard IP, Strategic Radiation Hardened and Antifuse FPGAs, and ruggedised programmable solutions, announced it has been awarded a new contract for a large discrete FPGA with a ceiling value of $2.7 million. In the scope of this new contract, QuickLogic will design and tape out FPGA Test Chips that will be i...
T-Global Technology announced that its flagship project, "Development of High Thermal Conductivity Materials and Two-Phase Liquid Cooling Modules for HPC Chips," has been officially approved under Taiwan's Ministry of Economic Affairs' "A+ Driving Industrial Innovation with AI" Program. As demand for AI, high-performance computing (HPC), and data centre infrastructure continues to ...
Oracle announced that the Oracle Java SE Universal Subscription will help standardise global software development at Samsung Electronics, a world leader in advanced semiconductor technology. With the Oracle Java SE Universal Subscription, Samsung can simplify IT operations and strengthen security by consolidating its global internal application development on Oracle Java. To continue to expa...
Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced it has shipped more than 100 million units of the Kingston A400 SATA solid-state drive. Launched in 2017, the Kingston A400 quickly gained recognition for its impressive performance in terms of booting, loading, and transferr...
Cyient Semiconductors Private Limited announced the launch of seven new gallium nitride (GaN) power devices for the Indian market, developed using Navitas Semiconductor's (Nasdaq: NVTS) industry-leading GaN technology. The launch marks Cyient Semiconductors' first commercial GaN product family and a major milestone in advancing India's domestic power semiconductor ecosystem. The new p...
Infineon's Startup Challenge brings together promising founder teams and young high-tech companies from across the globe to work jointly on a highly relevant topic: humanoid robotics. The Challenge is a structured innovation program designed to develop technological concepts into market-ready applications. It is part of Infineon's global Co–Innovation Program, in which Infineon drives innova...
Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, announced a major customer win for its Bluetooth® High Data Throughput (HDT) solution, including Ceva's internally developed RF technology, a significant commercial milestone validating the company's strategy to expand its wireless offering and deliver comprehensive, system-level solutions to it...
FotoNation Ltd., a European-based Perception-Recognition company, and SEMIFIVE Inc., a leading global provider of custom AI semiconductor solutions, today announced a strategic collaboration agreement under which SEMIFIVE will lead turnkey development for TriSilica, FotoNation's ultra-low-power perceptual AI chip family. TriSilica is an ultra-low-power, compact-footprint perceptual AI silicon pla...
At the 2026 European Economic Congress (EEC 2026), MICROIP Chairman Dr James Yang participated in a high-level dialogue at the "Poland-Taiwan Economic Cooperation Forum." Joined by Ambassador Liu Yong-jian and HCG Vice Chairman Michael Chiu, Dr Yang advocated leveraging Taiwan's semiconductor prowess to propel Poland into a strategic hub for European Edge AI. Addressing the "Last Mile" of A...
Board-level and semiconductor test data are often analysed separately, limiting correlation across the product lifecycle. Linking PCB assembly (PCBA) test results, including in-circuit and functional test, with upstream wafer, sort, and final test data remains difficult, particularly in photonics, advanced packaging, and high-density integration environments. yieldWerx and WATS announce a partners...
Nota AI (CEO Myung-su Chae), a specialist in AI model compression and optimisation, announced that it has signed an agreement with Mobilint, a high-performance AI semiconductor (NPU) company, to supply AI optimisation technology and establish a strategic partnership. This agreement was pursued to combine Nota AI's proprietary AI model compression and optimisation software capabilities with M...
SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, and ICY Tech, a Chinese AI semiconductor company, announced the successful tape-out of next-generation Edge AI SoC jointly developed utilising Samsung Foundry's 8nm (8LPU) embedded Magnetic Random Access Memory (eMRAM) technology. This marks a significant milestone toward the first commercial deployment of 8...
TuringEra, a global leader in edge AI computing chips and full-stack solutions, successfully concluded a series of high-level commercial activities in Almaty this week. In addition to unveiling its "Cloud-Edge-End" AI appliance portfolio at GITEX AI Kazakhstan 2026, the company solidified its Central Asian expansion through strategic dialogues with regional industrial leaders and stakeholders...
Amtech Systems, Inc. ("Amtech") (NASDAQ: ASYS), a manufacturer of equipment and consumables enabling AI semiconductor device packaging and advanced substrate fabrication, announced the appointment of Mr Guy Shechter as the Company’s President and Chief Operating Officer, reporting to the Chief Executive Officer of the Company. “I am pleased to announce that Guy Shecter will be joining...
The Health Impact Alliance (HIA) announced it has partnered with Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a world leader in semiconductor solutions, to develop advanced connectivity solutions for the rapidly growing senior care market. This collaboration leverages Infineon’s cutting-edge semiconductor technology to create a comprehensive ecosystem of connected healthcare devices. ...