Kioxia Samples 10th-Generation BiCS FLASH 3D NAND with 4.8 Gb/s Speed for AI Data Centre SSDs

Kioxia Corporation, a world leader in memory solutions, announced that it has commenced sample shipments of 1Tb (terabit) Triple-Level-Cell (TLC) memory devices utilising its 10th-generation BiCS FLASH™ 3D flash memory technology.1 These will be primarily integrated into the company’s enterprise and data centre SSDs, strengthening Kioxia’s lineup to meet the growing demand f...

6 Jul 2026 | Monday | NEWS
Kioxia and Sandisk Begin Production of 10th-Generation 3D NAND Flash Memory at Japan Fab to Meet AI Demand

Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation (TOKYO: 285A) and Sandisk Corporation (Nasdaq: SNDK) today announced the start of production for their 10th-generation 3D Flash memory technology at Fab2 (K2) at the Kitakami Plant in Iwate Prefecture in Japan. The milestone comes as the companies continue to drive meaningful, multi-year bit growth to address the strong demand for the...

6 Jul 2026 | Monday | NEWS
KoMiCo Invests CZK 914 Million in Czech Semiconductor Facility to Support TSMC's ESMC and Europe's Chip Expansion

South Korean semiconductor services company KoMiCo Co., Ltd. is strengthening its presence in Europe with the construction of a new semiconductor parts cleaning and coating facility in the Czech Republic, a move aimed at supporting the region's expanding semiconductor manufacturing sector. The company is investing approximately CZK 914.3 million (around KRW 65 billion) in the project, which will ...

3 Jul 2026 | Friday | NEWS
How AI-Powered EDA, 2nm Design, and Samsung Foundry Collaboration Are Accelerating Next-Generation AI Chip Development

In this exclusive interview with Semicon Leaders Asia, Shekhar Kapoor, Executive Director of Product Line Management, Synopsys, shares how AI-driven design automation, advanced-node collaboration, and system-level optimisation are shaping the future of semiconductor innovation.   Q. As AI, multi-die architectures, and advanced process nodes increase desig...

3 Jul 2026 | Friday | Interaction
Mouser Electronics Wins HARTING Global High Service Distributor of the Year Award for Second Consecutive Year

Mouser Electronics, Inc., the authorised global distributor with the newest electronic components and industrial automation products, announced it has received the prestigious Global High Service Distributor of the Year Award from HARTING. Mouser also received the Distinguished Award for New Product Sales Growth. This is the second consecutive year that Mouser has received these prestigious d...

3 Jul 2026 | Friday | NEWS
GigaDevice Launches GD24CL I²C EEPROM Series with 4 Million Write Cycles for Industrial IoT, Data Centres and Networking Applications

GigaDevice, a leading semiconductor company specialising in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analogue products, announced today the launch of its new GD24CL series I²C EEPROM. The series delivers outstanding performance, comprehensive security protection mechanisms, and excellent reliability that address the stringent requirements for stable ...

3 Jul 2026 | Friday | NEWS
Butterfly Network Launches Handheld Ultrasound Devices in Brazil, Expanding AI-Powered Medical Imaging Across Latin America's Largest Healthcare Market

Butterfly Network, Inc. (“Butterfly”) (NYSE: BFLY), a pioneer and leader in semiconductor-based ultrasound devices, programmable cloud software and AI, announced the commercial availability of its Butterfly iQ+ and iQ3 handheld ultrasound devices and mobile application in Brazil through a network of authorised distribution partners. Brazil is the largest medical device market in Latin...

3 Jul 2026 | Friday | NEWS
Sirin Software Joins Alif Semiconductor Ecosystem as Authorized Design House

Sirin Software, a leading provider of embedded software and IoT engineering services, has officially joined the Alif Semiconductor partner ecosystem as an authorised Design House. The collaboration brings together Alif Semiconductor's high-performance processor architectures and Sirin Software's expertise in embedded software engineering to help customers accelerate the development of next-generat...

2 Jul 2026 | Thursday | NEWS
OXMIQ Raises $35 Million Series A to Scale Licensable GPU Architecture for Custom AI Silicon

OXMIQ Labs Inc., a unified GPU and AI architecture company founded by Raja Koduri, closed its $35 million Series A financing, bringing the company’s total capital raised to $60 million. The funding will scale OxCore™, OXMIQ’s licensable GPU architecture that allows semiconductor companies and AI system builders to build custom AI silicon without a full chip program. The round was...

2 Jul 2026 | Thursday | NEWS
StratEdge Introduces Gold-Plated Tabs for High-Power GaN Semiconductor Packaging

StratEdge Corporation, a leader in the design and production of high-frequency, high-power, and high-reliability packages, offers gold-plated tabs for advanced semiconductors that require superior thermal and electrical performance. StratEdge’s gold-plated tabs are designed to support eutectic die attach for gallium nitride (GaN) and other high-power devices using gold-tin (AuSn) and gold-s...

2 Jul 2026 | Thursday | NEWS
SiTime Completes Renesas Timing Business Acquisition to Accelerate AI and Clocking Growth

SiTime Corporation (Nasdaq: SITM) (“SiTime” or the “Company”), the Precision Timing company, announced that it has completed the acquisition of certain assets from Renesas Electronics Corporation (TSE: 6723) (“Renesas”). Rajesh Vashist, chairman and CEO of SiTime, said, “SiTime has created the Precision Timing category and is the only semiconductor c...

2 Jul 2026 | Thursday | NEWS
Teledyne e2v Validates Radiation Performance of High-Speed ADC for Space Missions

Teledyne e2v Semiconductors announced new radiation test results for its EV10AS940, a 10-bit, 12.8 GSps, Ka-band-capable analogue-to-digital converter, or ADC, developed for demanding space payloads and mission-critical applications. These results give space engineers additional confidence when designing high-performance satellite communications payloads, synthetic aperture radar, or SAR, systems...

2 Jul 2026 | Thursday | NEWS
Keysight and WIN Semiconductors Streamline GaN MMIC Design for First-Pass Tapeout Success

Keysight Technologies, Inc. (NYSE: KEYS) and WIN Semiconductors Corp. announced a joint MMIC design workflow that enables GaN MMIC design houses to achieve first-pass tapeout success. The workflow connects on-chip multi-domain simulation, 3D layout with verifications, and off-chip MMIC evaluation board design into a single environment. It supports the growing number of companies developing Ga...

1 Jul 2026 | Wednesday | NEWS
Stathera Raises $55 Million to Scale Silicon Timing Solutions for AI Data Centres

Stathera Inc., a fabless semiconductor company pioneering silicon timing solutions, announced the close of an oversubscribed US$55 million Series B financing. As the market consolidates around a dominant incumbent, the round positions Stathera to become the leading independent alternative for AI data centre and hyperscale customers. The round was led by new investor Maverick Silicon with cont...

1 Jul 2026 | Wednesday | NEWS
LG Innotek Targets AI Semiconductor Boom with High-Value Substrate Portfolio Expansion

LG Innotek, renowned for its optical solution business and leadership in high-performance camera modules, is quickly establishing itself as a key player in package solutions, including high-value-added semiconductor substrates. Backed by a combination of structural growth drivers—including the rollout of 5G networks, trend toward higher-performing components in premium smartphones, ongoing ...

1 Jul 2026 | Wednesday | NEWS
Toshiba Launches 80V Power MOSFET to Boost AI Data Centre Power Supply Efficiency

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched “TPM1R408RH,” an 80V N-channel power MOSFET fabricated using U-MOS11-H, Toshiba’s latest-generation process[1]. The MOSFET targets applications such as switched-mode power supplies for industrial equipment used in AI data centres and communications base stations. Shipments start. The ongoing expan...

1 Jul 2026 | Wednesday | NEWS
Tema ETFs and SemiAnalysis Partner to Launch Research-Driven Semiconductor and AI Infrastructure ETFs

Tema ETFs (“Tema”), a leader in institutional-quality and actively managed exchange-traded funds, announced an exclusive ETF partnership with SemiAnalysis, the leading independent research firm specialising in semiconductors and AI infrastructure, founded by Dylan Patel. Through the partnership, Tema and SemiAnalysis will launch the first suite of institutional-grade, research-driven ...

1 Jul 2026 | Wednesday | NEWS
OMNIVISION Launches Ultra-Thin OVMed Cable Modules to Accelerate Single-Use Endoscope Development

OMNIVISION, a leading global developer of semiconductor solutions, including advanced digital imaging, analog, and display technology, announced the availability of several new OVMed® ultra-thin medical-grade LED cable modules for single-use endoscopes. These complete, turnkey solutions include an image sensor with wafer-level optics, illumination, and cabling, and they provide a cost-eff...

30 Jun 2026 | Tuesday | NEWS
Ambiq Launches heliaCORE to Accelerate Edge AI Development on Apollo SoCs

Ambiq Micro, Inc. ("Ambiq®"), a technology leader in ultra-low-power semiconductor solutions for edge AI, announced heliaCORE™, the foundational software layer powering its HELIA™ Edge AI ecosystem. Built specifically for Apollo SoCs, heliaCORE provides optimized AI kernels, broad operator acceleration, and production-scale validation to help developers bring AI-enabled p...

30 Jun 2026 | Tuesday | NEWS
SEMI Forecasts Global 300mm Memory Fab Equipment Investment to Exceed $50 Billion in 2026

Worldwide 300mm fab equipment investment in the memory sector is projected to surpass $50 billion for the first time in 2026, rising 29% to $52 billion before increasing another 11% to $57 billion in 2027, SEMI reported in its latest 300mm Fab Outlook. The growth reflects continued AI-driven demand for advanced memory, supported by rising investment in AI infrastructure, data centers, an...

30 Jun 2026 | Tuesday | NEWS