• Tuesday | 12 May 2026
Lattice Wins AI Excellence Award for Edge AI Solution

Lattice Semiconductor (NASDAQ: LSCC), the low-power programmable leader, announced it was named a 2026 AI Excellence Award winner by Business Intelligence Group. Lattice was recognised for its Edge AI solution developed in collaboration with NVIDIA, which delivers a flexible, full-stack platform for real-time data acquisition and processing. The solution combines the Latti...

1 May 2026 | Friday | NEWS
FPT and Shinhan Bank Expand AI-Driven Finance Partnership

Global technology corporation FPT and Shinhan Bank Co., Ltd. (Korea) (“Shinhan Bank”) recently signed a memorandum of understanding (MoU) to expand cooperation in digital finance, startup ecosystems, and strategic technologies, with AI as a key enabler to unlock new opportunities across innovation ecosystems in Vietnam and South Korea. The MOU exchange ceremony took place during the V...

1 May 2026 | Friday | NEWS
Ambiq Launches AI Compression for Always-On Devices

Ambiq Micro, Inc. (“Ambiq®”), a technology leader in ultra-low-power semiconductor solutions for edge AI, announced compressionKIT™, a next-generation AI-based codec in beta, proven to substantially reduce the power and memory costs of handling continuous sensor data in wearable and edge devices. As always-on devices—from medical wearables to smart home and indust...

1 May 2026 | Friday | NEWS
SouthernCrossAI Expands Sovereign AI Access via Equinix Fabric

SouthernCrossAI (SCX), Australia's full-stack sovereign AI infrastructure company, announced it is now providing sovereign AI inferencing capacity to the Equinix Fabric AI ecosystem, making its ASIC-powered inference nodes discoverable and accessible to enterprises, government agencies, and developers across the Equinix ecosystem. Alongside this milestone, SCX confirmed that its national infrastr...

30 Apr 2026 | Thursday | NEWS
Trio-Tech Raises $10M to Support Growth in AI and Automotive

Trio-Tech International (“Trio-Tech” or the “Company”) (NYSE MKT: TRT), a comprehensive provider of semiconductor back-end solutions and a global value-added supplier of electronic equipment, announced the closing of its previously announced registered direct offering with fundamental institutional investors. The offering consisted of 1,052,632 shares of the Company’...

30 Apr 2026 | Thursday | NEWS
Majestic Labs Launches AI Server to Solve Memory Bottleneck

Majestic Labs unveiled Prometheus, the first AI server designed from the ground up to tackle the memory wall: the most critical obstacle to the advancement and deployment of AI models. Leveraging an innovative architecture and a complete software stack, the server connects orders of magnitude more memory to each processor, at unprecedented bandwidth, achieving performance equivalent to multiple ra...

30 Apr 2026 | Thursday | NEWS
Kopin and Fabric.AI Partner to Build Optical Links for AI Data Centres

Kopin Corporation (NASDAQ: KOPN), a leading provider of application-specific optical systems and high-performance microdisplays, including MicroLED displays, announced a strategic collaboration with Fabric.AI (NASDAQ: SBLX), a leading developer of fabless semiconductor solutions for AI infrastructure, to develop MicroLED-based optical interconnect technology that will be designed to replace tradit...

30 Apr 2026 | Thursday | NEWS
Cadence and NVIDIA Deepen AI Engineering Partnership

Expanded collaboration combines agentic AI, physics-based simulation, and digital twins to accelerate engineering and unlock new levels of productivity across semiconductors, physical AI systems and AI factories At CadenceLIVE Silicon Valley 2026, Cadence (Nasdaq: CDNS) announced an expanded partnership with NVIDIA to deliver accelerated solutions across agentic AI, physics-based ...

29 Apr 2026 | Wednesday | NEWS
ROHM Co., Ltd. Launches NFC Wireless Power Chipset for Smart Rings and Compact Wearables

ROHM Co., Ltd. has developed a wireless power supply IC chipset consisting of the receiver (ML7670) and transmitter (ML7671) compatible with Near Field Communication (NFC) technology for compact wearables such as smart rings and smart bands. The smart ring market has seen rapid growth in recent years. However, for extremely small ring-shaped devices worn on the finger, wired charging is impr...

29 Apr 2026 | Wednesday | NEWS
Artemis Acquires Optikos Corporation to Accelerate Growth in Advanced Optical Engineering

Optikos® Corporation, a provider of engineering, manufacturing, and metrology expertise in optical systems, is joining forces with Artemis, a Boston-based private equity firm focused on scaling high-impact industrial tech. Through this acquisition, Artemis will provide the strategic support necessary to supercharge the engineering and manufacturing capabilities of Optikos. Through th...

29 Apr 2026 | Wednesday | NEWS
FPT Corporation and Intel Corporation Partner to Accelerate AI-Driven Factory Optimisation

FPT and Intel, a global leader in semiconductor and AI technologies, announced a strategic relationship to deliver an end-to-end AI-driven factory optimisation solution. Powered by AI, simulation, and digital manufacturing technologies, the collaboration aims to reduce bottlenecks, accelerate decision-making and improve downtime recovery, facilitating the sector’s transition towards AI-drive...

29 Apr 2026 | Wednesday | NEWS
Kyocera Corporation Launches Ceramic Core Substrate for Next-Generation AI Semiconductor Packaging

Kyocera Corporation (President: Shiro Sakushima; “Kyocera”) announced that it is commercialising a new multilayer ceramic core substrate for advanced semiconductor packages, such as xPUs(1) and switch ASICs, which are rapidly scaling in complexity as AI data centre architectures evolve. The new product will be unveiled at ECTC 2026, an international conference ...

29 Apr 2026 | Wednesday | NEWS
OKI Circuit Technology Develops 180-Layer PCB Technology for Next-Generation AI and HBM Testing

OKI Circuit Technology (OTC; President: Masaya Suzuki; Head office: Tsuruoka City, Yamagata), the OKI Group’s printed circuit board (PCB) business company, has successfully developed design and production technologies for 180-layer, 15 mm-thick PCBs intended for use in wafer testing equipment for high bandwidth memory (HBM) (Note 1) mounted on AI semiconductors. This represents an approximat...

29 Apr 2026 | Wednesday | NEWS
NEO Semiconductor Validates 3D X-DRAM as Scalable Path for AI Memory

NEO Semiconductor, a leading innovator in advanced AI and memory technologies, announced successful proof-of-concept (POC) results for its 3D X-DRAM™ technology, marking a major milestone toward next-generation, high-density memory solutions for AI and data-centric systems. The company also announced a new strategic investment led by Stan Shih, Founder and former Chairman and CEO of Ac...

24 Apr 2026 | Friday | NEWS
Synopsys Expands Collaboration with TSMC to Advance AI Chip Design

Synopsys, Inc. (Nasdaq: SNPS) announced major advances in silicon-proven IP, AI-powered EDA flows, and system-level enablement across TSMC's most advanced processes and packaging technology nodes, including the TSMC 3nm and 2nm families, as well as A16™ with Super Power Rail and A14. By unifying intelligent digital, analogue, and verification flows, advanced 3D multi-die design, a...

24 Apr 2026 | Friday | NEWS
RoboSense Unveils SPAD-SoC Breakthrough to Lead Next Phase of LiDAR Commercialisation

RoboSense (HKEX: 2498), an AI-driven robotics technology company, hosted its 2026 Tech Day in Shenzhen, marking a landmark moment with the global debut of its pioneering self-developed SPAD-SoC architecture, EOCENE, and two flagship image-grade chipsets, Phoenix and Peacock. Alongside these core launches, RoboSense offered a strategic preview of its revolutionary...

22 Apr 2026 | Wednesday | NEWS
DEEPX and Hyundai Motor Group Forge Strategic Partnership to Commercialise Next-Gen Robotics AI

DEEPX (CEO Lokwon Kim), a pioneer in ultra-low-power AI semiconductor technology, and Hyundai Motor Group's Robotics LAB have announced a strategic collaboration to jointly develop a next-generation Physical AI computing platform for advanced robotics. The partnership aims to co-develop an AI computing architecture capable of running large-scale generative AI models in real time within robotic sy...

22 Apr 2026 | Wednesday | NEWS
InPHRED Expands into Data Centre Optical Interconnect Market

InPHRED, a developer of next-generation photonics solutions for consumer sensing and digital health, announced its formal expansion into the data centre optical interconnect market, extending its nanoporous platform into high-speed connectivity solutions for next-generation AI infrastructure. As demand for AI infrastructure surges and hyperscalers push for higher bandwidth density, lower power co...

21 Apr 2026 | Tuesday | NEWS
Mitate Zepto Technica, Inc. Partners in National AI Semiconductor Initiative to Advance Genome Analysis

Mitate Zepto Technica, Inc. (hereinafter "MZT"), based in Tokyo's Shibuya district, announced that it has joined the national research initiative "Next-Generation Edge AI Semiconductor Research and Development Program" promoted by the Japan Science and Technology Agency (JST). MZT participates as a designated social implementation and commercialisation partner for the research theme "Accelerating ...

21 Apr 2026 | Tuesday | NEWS
SK hynix Inc. Begins Mass Production of 192GB SOCAMM2 for AI Servers

SK hynix Inc. (or "the company", www.skhynix.com) announced that it has begun mass production of the 192GB SOCAMM2, a next-generation memory module standard based on the 1cnm process (sixth-generation of the 10-nanometer technology) LPDDR5X low-power DRAM. SOCAMM2[1] is a module that adapts low-power memory – previously used mainly in mobile products like smartphones - for server ...

21 Apr 2026 | Tuesday | NEWS

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