• Sunday | 27 September 2026
HyperLight Corporation Launches 400G-per-Lane Photonic Integrated Circuits for Artificial Intelligence Networking

HyperLight Corporation (“HyperLight”), creator of the TFLN Chiplet™ Platform, announced the availability of 400G-per-lane thin-film lithium niobate (TFLN) photonic integrated circuits (PICs) designed for next-generation AI networking infrastructure. The new PIC family delivers low insertion loss, low drive voltage operation, and exceptional electro-optic bandwidth, enabling energ...

20 Mar 2026 | Friday | NEWS
Qnity Electronics Collaborates with NVIDIA to Advance Artificial Intelligence Driven Semiconductor Materials Innovation

Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, announced a collaboration with NVIDIA to accelerate AI-driven innovation using open NVIDIA Nemotron 3 Nano, ALCHEMI BMD NIM, LAMMPS Kokkos, and CUDA-X accelerated Abaqus for modeling and simulation technologies. The collaboration is focused on advancing materials res...

20 Mar 2026 | Friday | NEWS
Sivers Semiconductors AB Partners with O-Net Technologies and Enablence Technologies Inc. on Optical Interconnect Solution for Artificial Intelligence Data Centres

Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, announced a strategic partnership with O-Net Technologies and Enablence Technologies Inc. (TSXV: ENA) to develop an advanced external light source (ELS) module with Sivers laser arrays to support Co-Packaged Optics (CPO) roll-out in AI datacenters and HPC systems. O-Net ...

19 Mar 2026 | Thursday | NEWS
Halo Industries Selects Eyelit Technologies MES Platform for SiC Wafer Production

Eyelit Technologies (Eyelit), a leader in optimised planning, scheduling, and execution systems for manufacturers, announced that Halo Industries, an innovator in laser-based silicon carbide (SiC) wafering, has selected Eyelit’s solution suite to support its rapidly scaling production needs. Eyelit was chosen following a competitive evaluation, with Halo Industries selecting the platfo...

17 Mar 2026 | Tuesday | NEWS
Semtech Corporation Launches 224Gbps Optical Interconnect Chipset for AI Data Centres

Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, announced a family of 224Gbps per lane Transimpedance Amplifiers (TIAs) and Mach-Zehnder Modulator (MZM) drivers for half retimed (LRO), LPO, XPO, Near-Packaged Optics (NPO) and Co-Packaged Optics (CPO) interconnect applications. ...

17 Mar 2026 | Tuesday | NEWS
HyperLight Corporation Launches 145 GHz Packaged Intensity Modulator

HyperLight Corporation, creator of the TFLN Chiplet™  platform, announced the release of its 145 GHz Packaged Intensity Modulator (IM), expanding the company‘s high-speed modulator portfolio. The new device is designed for ultra-wide modulation bandwidth, high signal fidelity, and stable operation control, enabling 448 Gbps per lane intensity-modulated-direct-detection (IMDD)...

17 Mar 2026 | Tuesday | NEWS
HyperLight Corporation, United Microelectronics Corporation Partner on TFLN Photonics Foundry Production

HyperLight Corporation (“HyperLight”), United Microelectronics Corporation (NYSE: UMC; TWSE: 2303)(“UMC”), and Wavetek Microelectronics Corporation (“Wavetek”), a wholly owned subsidiary of UMC, announced a strategic manufacturing partnership for high-volume foundry production of HyperLight’s TFLN (thin-film lithium niobate) Chiplet™ Platform on both...

16 Mar 2026 | Monday | NEWS
Mouser Electronics Returns as Platinum Sponsor of Create the Future Design Contest

Mouser Electronics, Inc., the New Product Introduction (NPI) leader™ empowering innovation, announces it is once again a Platinum sponsor of the Create the Future Design Contest. Create the Future is a global challenge for engineers and innovators to design the next great thing, with a chance to win the grand prize. Mouser, which has sponsored the contest for over a decade, is joined ag...

16 Mar 2026 | Monday | NEWS
Gateworks Corporation Expands Catalina SBC Family with NXP Semiconductors i.MX 95 Processor

Gateworks Corporation, a leader in industrial embedded technology, announced the expansion of its Catalina Single Board Computer (SBC) family. Engineered around the high-performance NXP® Semiconductors i.MX 95 applications processor, the Catalina platform is designed to bring transformative Edge AI, machine vision and autonomous capabilities to the harshest industrial environments. NXP w...

12 Mar 2026 | Thursday | NEWS
Nanopower Semiconductor Begins Volume Production of nPZero Power-Saving IC

Nanopower Semiconductor, a European fabless semiconductor manufacturer, announces that its award-winning nPZero power-saving integrated circuit (PSIC) is now in volume production, enabling original equipment manufacturers (OEMs) to move from evaluation to high-volume deployment in power-constrained Internet of Things (IoT) products. Nanopower's nPZero is a power-saving integrated circuit (PSIC) de...

12 Mar 2026 | Thursday | NEWS
ISLE 2026 Highlights Nanchang’s Optoelectronic Industry Cluster

ISLE 2026, Asia's largest exhibition for smart display and integrated systems, held in Shenzhen World Exhibition & Convention Centre (Shenzhen World) from March 5-7, demonstrated more than thousands of new products and solutions for diverse application scenarios in display and AV integration. In this year's ISLE, the Nanchang Optoelectronic Industry Cluster made a collective appearance u...

12 Mar 2026 | Thursday | NEWS
Synopsys Launches Electronics Digital Twin Platform for Automotive Development

Synopsys, Inc. (NASDAQ: SNPS) launched the Synopsys Electronics Digital Twin (eDT) Platform, a first-of-its-kind, open solution to accelerate the creation, management, deployment, and use of electronics digital twins (eDTs) critical for today's software-defined product development, enabling physical AI systems. Initially focused on high-value automotive use cases, the eDT Platform enables OEM...

11 Mar 2026 | Wednesday | NEWS
GigaDevice Expands Ultra-Low-Power SPI NOR Flash Portfolio

GigaDevice (HKEX: 3986), a leading semiconductor company specialising in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analogue products, announced the expanded density range of its GD25UF series 1.2V ultra-low power SPI NOR Flash, now spanning from 8Mb to 256Mb. This expansion precisely addresses diverse storage needs across a wide range of applications,...

11 Mar 2026 | Wednesday | NEWS
Wolfspeed Launches Industry’s First Commercial 10 kV Silicon Carbide MOSFET

Wolfspeed, Inc., a global leader in silicon carbide (SiC) technology, announced the industry's first commercially available 10 kV SiC power MOSFET. This milestone marks a defining moment in the industry — unlocking architectural freedom, delivering unprecedented system durability, and advancing access to reliable and sustainable power for the world's most demanding applications. This groundb...

9 Mar 2026 | Monday | NEWS
FiberHome Showcases AI-Era Network Innovations at MWC 2026

With MWC 2026 taking place in Barcelona, FiberHome has stepped into the spotlight under the theme "Connecting the Bright Intelligent Future", highlighting three core strategic areas: optical-computing infrastructure, boundless intelligent network connectivity, and industrial intelligence elevation, and fully demonstrating its cutting-edge innovations and proven global delivery capabilities. Optic...

6 Mar 2026 | Friday | NEWS
Pickering Interfaces Launches Free Test System Architect Tool for Signal Path Design

Pickering Interfaces, the leading supplier of modular signal switching and simulation solutions for use in electronic test and verification, has announced Test System Architect, a free online graphical toolset designed to simplify signal path design for electronic test systems, allowing engineers to design, configure, and visualise complete test architectures before deployment. “Picker...

6 Mar 2026 | Friday | NEWS
Semtech Corporation Acquires HieFo Corporation to Strengthen AI Optical Connectivity Portfolio

Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, announced the acquisition of HieFo Corporation (HieFo), a California-based private manufacturer of high-efficiency Indium Phosphide (InP) optoelectronic devices for optical transceivers used across data center interconnects (DCI) ...

5 Mar 2026 | Thursday | NEWS
Ceva, Inc. Unveils PentaG-NTN™ to Accelerate 5G Satellite Connectivity

MWC26 – As satellite connectivity rapidly becomes the most strategically important and disruptive extension of the 5G network, Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, announced PentaG-NTN™, a new 5G-NTN (Non-Terrestrial Networks) modem IP subsystem purpose-built for satellite user terminals supporting LEO and ME...

4 Mar 2026 | Wednesday | NEWS
MaxLinear Showcases Expanding Sierra-Powered Open RAN Portfolio at MWC 2026

MaxLinear, Inc. (Nasdaq: MXL), a leading provider of wireless infrastructure solutions, announced that it will showcase a growing range of commercially available Open RAN Radio Units (O-RU) based on its Sierra single‑chip radio SoC at Mobile World Congress (MWC) 2026 in Barcelona. ttendees visiting meeting room 2L8MR in Hall 2 will see demonstrations of several new Sierra-powered O-RUs, in...

3 Mar 2026 | Tuesday | NEWS
GCT Semiconductor to Showcase 5G and IoT Innovations at MWC 2026

GCT Semiconductor Holding, Inc. (“GCT” or the "Company") (NYSE: GCTS), a leading designer and supplier of advanced 5G and 4G semiconductor solutions, announced that it will showcase its latest 5G and IoT capabilities at its exhibit at Mobile World Congress (MWC) 2026, taking place March 2-6, in Barcelona, Spain. GCT will host partners and customers at its booth to unveil its ...

3 Mar 2026 | Tuesday | NEWS

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