• Wednesday | 12 August 2026
Qnity Launches Advanced Thermal Interface Materials for AI and High-Power Semiconductor Applications

Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, announced the launch of two new thermal interface materials (TIM): Laird™ Tflex™ CR910, a two-part dispensable liquid gap filler, and Tgrease™ 3000 thermal grease, both designed to help customers address increasingly complex thermal management chall...

29 Jul 2026 | Wednesday | NEWS
Micross to Acquire AEMtec to Expand Advanced Semiconductor Packaging and European Operations

Micross Components, Inc. ("Micross" or the "Company"), a leading provider of high-reliability microelectronic product and service solutions for aerospace, defence, space, medical and industrial applications and a portfolio company of Behrman Capital, announced that it has entered into a definitive agreement to acquire AEMtec GmbH ("AEMtec"). AEMtec is a leading provider of complex micro- and optoe...

29 Jul 2026 | Wednesday | NEWS
Keysight Certifies RFPro EM Design Software for Intel 14A and 18A-P Process Technologies

Keysight Technologies, Inc. (NYSE: KEYS) announced certification of its RFPro electromagnetic (EM) design software, part of the Keysight EDA Advanced Design System (ADS), for Intel 14A and Intel 18A-P process technologies. The certification gives radio frequency integrated circuit (RFIC) and mixed-signal designers confidence that their electromagnetic simulations accurately reflect Intel Foun...

29 Jul 2026 | Wednesday | NEWS
Tema Memory ETF Gains Early Exposure to CXMT Following Landmark IPO

Tema ETFs has strengthened the portfolio of its Tema Memory ETF (DISK) by adding shares of ChangXin Memory Technologies (CXMT) as one of its largest holdings immediately following the company's initial public offering (IPO). The addition gives CXMT a 10.56% portfolio weighting, making DISK the U.S.-listed ETF with the highest exposure to the Chinese memory chip manufacturer. The investment reflec...

29 Jul 2026 | Wednesday | NEWS
Lattice Semiconductor Completes AMI Acquisition to Expand AI Infrastructure and Platform Management Portfolio

Lattice Semiconductor Corporation (NASDAQ: LSCC), the low-power programmable leader, announced the completion of its acquisition of AMI. First announced on May 4, 2026, the acquisition creates the industry's most complete secure management and control platform. The acquisition is expected to be accretive to gross margin, free cash flow, and earnings per share on a non-GAAP basis, and supports Latt...

29 Jul 2026 | Wednesday | NEWS
Synopsys and Microsoft Advance Autonomous AI Workflows for Chip Design on Microsoft Discovery

Synopsys, Inc. (NASDAQ: SNPS) announced new autonomous agentic AI workflows for chip design, developed in collaboration with Microsoft and available for evaluation on Microsoft Discovery. AI is fundamentally reshaping engineering, and Synopsys is building a comprehensive, open agentic AI stack to increase engineering autonomy and accelerate product design from silicon to systems. Th...

28 Jul 2026 | Tuesday | NEWS
Silvaco and NVIDIA Partner to Advance AI-Powered Digital Twins for Semiconductor Design and Manufacturing

Silvaco Group, Inc. (Nasdaq: SVCO) (“Silvaco”), a leading provider of TCAD, EDA software, and semiconductor IP solutions, and NVIDIA, a global leader in accelerated computing and AI, announced a collaboration to advance next-generation digital twins for semiconductor design and manufacturing using NVIDIA accelerated computing and AI. Silvaco is combining decades of physics-based model...

28 Jul 2026 | Tuesday | NEWS
Amkor and NVIDIA Form Multi-Year Partnership to Expand Advanced AI Chip Packaging in the U.S.

Amkor Technology, Inc. (Nasdaq: AMKR) announced a multi-year strategic partnership with NVIDIA to develop advanced semiconductor packaging and test technologies for next-generation AI and accelerated computing platforms. Under the agreement, NVIDIA will provide a prepayment to support the expansion of Amkor’s U.S. advanced packaging capacity. Advanced packaging enables the performance, ener...

28 Jul 2026 | Tuesday | NEWS
Synopsys and NVIDIA Advance Agentic AI for Semiconductor Design with Autonomous Chip Verification and Engineering Workflows

Synopsys, Inc. (NASDAQ: SNPS) announced advancements to agentic AI for engineering in collaboration with NVIDIA. Synopsys has developed fully autonomous, long-running agentic capabilities for chip design and electronics system design enabled with NVIDIA Nemotron on NVIDIA's accelerated computing platform and secured by the NVIDIA OpenShell runtime. Demonstrated at DAC for the first ...

28 Jul 2026 | Tuesday | NEWS
Mimik Launches Agentix-Native Platform for AMD Ryzen AI Embedded X100 to Accelerate Industrial Edge AI

Mimik announced mimOE™ Embedded Edition, a package of its Agentix Operating Engine and a set of purpose-built tools for the AMD Ryzen™ AI Embedded X100 Series processor, the newest processor in a family designed for physical AI, autonomous systems, and industrial automation. Available to download today, mimOE Embedded Edition gives OEMs, tier-1 suppliers, system integrators, and agent ...

28 Jul 2026 | Tuesday | NEWS
T-REX Launches First 2X Inverse DRAM ETF Targeting AI Memory Semiconductor Stocks

T-REX, a joint venture between REX Shares (REX) and Tuttle Capital Management (TCM), has announced the upcoming launch of the T-REX 2X Inverse DRAM Daily Target ETF (Ticker: RAMZ), marking the first-ever U.S. exchange-traded fund designed to deliver -200% of the daily performance of the Roundhill Memory ETF (Ticker: DRAM). The launch gives investors a new leveraged inverse product focused on the ...

27 Jul 2026 | Monday | NEWS
Tensormesh and AMD Collaborate to Boost AI Inference Efficiency with Advanced KV Cache Optimisation

Tensormesh, the company pioneering caching-accelerated inference optimisation for enterprise AI, announced a collaboration with AMD through which the Tensormesh KV cache solution and AMD virtual memory offering will work together to allow more models to be served on fewer GPUs while retaining high KV cache hit rates and throughput even with oversubscribed high-bandwidth memory (HBM). Tensormesh is...

27 Jul 2026 | Monday | NEWS
Cirrus Logic Secures R&D Grant to Advance Smart Energy Semiconductor Technology in Scotland

Cirrus Logic (Nasdaq: CRUS), a leader in high-performance, low-power audio and mixed-signal semiconductor solutions, announced it has received a research and development grant from Scottish Enterprise to support the development of next-generation smart energy technology and expand advanced engineering activities in Scotland. The funding supports development of a new metrology analogue front-...

27 Jul 2026 | Monday | NEWS
Elio Raises $21 Million to Develop AI-Native Optical Sensors for Semiconductors, Robotics, and Defense

Elio, a company building sensors designed for artificial intelligence rather than the human eye, announced a $21 million funding round led by Innovation Endeavours and Xora, with participation from Kevin Weil and Scribble VC. Existing investors UpWest and Resolute Ventures, who led the company's previous round, are continuing their support. Sensors capture one f...

27 Jul 2026 | Monday | NEWS
ChipNexus Launches NEX Agentic AI Platform for Semiconductor Design, Raises Seed Funding

Primis AI announced that it has become ChipNexus and launched NEX, an agentic AI platform for semiconductor and hardware design. The new identity reflects the company’s evolution in response to a changing market: hardware teams increasingly need AI systems that can work across complex engineering workflows, not simply generate code or answer questions. ChipNexus developed NEX to address that...

27 Jul 2026 | Monday | NEWS
Advantech Unveils AMD EPYC 9006-Powered AI Edge and Data Center Servers for Next-Generation Infrastructure

Advantech, a global leader in industrial edge computing and edge AI solutions, announced its next-generation server and network platforms powered by the latest AMD EPYC™ 9006 Series processors. Designed to accelerate AI infrastructure from the data centre to the intelligent edge, Advantech's 6th Gen AMD EPYC-powered servers deliver the performance, scalability, and reliability orga...

27 Jul 2026 | Monday | NEWS
MetaOptics to Deploy Metalens Direct Laser Writer at University of Arizona to Accelerate U.S. Semiconductor Expansion

MetaOptics Ltd (Catalist: 9MT) ("MetaOptics" or the "Company," and together with its subsidiaries, the "Group"), announced that it has agreed to deploy its key metalens Direct Laser Writer ("DLW") system at the University of Arizona's Centre of Semiconductor Manufacturing (the "University"). The agreement marks a critical step in advancing its U.S. expansion strategy and its collaborativ...

24 Jul 2026 | Friday | NEWS
Wistron Opens US$700 Million Texas AI Factory to Mass Produce NVIDIA GB300 and Vera Rubin Superchips

Wistron Corporation ("Wistron") celebrated the grand opening of its D1 AI smart facility in Fort Worth, Texas, the site where the first NVIDIA GB300 Grace Blackwell Ultra Superchip was built and mass-produced in the United States. The US$ 700 million facility, spanning approximately 324,000 square feet, was officially unveiled during a ceremony led by Wistron Chairman Simon Lin and NVIDI...

24 Jul 2026 | Friday | NEWS
FemtoAI Reports 5X Growth in H1 2026 as SPU AI Inference Platform Expands Across Samsung, Marshall and Edge AI Markets

FemtoAI, a leading AI inference platform and creator of the Sparse Processing Unit (SPU), announced 5X growth in 1H 2026, driven by engagements with Samsung and Marshall, new customer use cases and increased developer adoption. The demand for AI inference globally continues to outpace supply, and femtoAI is filling a gap. With 200K+ chips already deployed, and customers across data centre, enterp...

24 Jul 2026 | Friday | NEWS
Acrab Unveils GΞLIX 1 Edge AI SoC and Agent Box to Run 100B-Parameter AI Models Locally

Acrab, a technology company building agentic AI compute infrastructure for the next generation of intelligent systems, unveiled GΞLIX 1, its first-generation edge AI system-on-chip (SoC), together with Agent Box, a personal edge AI system powered by the company's full-stack computing platform. As AI moves from generating answers to completing tasks, agents increasingly need to understand conte...

24 Jul 2026 | Friday | NEWS

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