SuperX AI Technology Limited announced that it has entered into a definitive agreement with the Hong Kong wholly-owned subsidiary of Shenzhen Chengtian Weiye Technology Co., Ltd. (Shenzhen Stock Exchange: 300689, "Chengtian Weiye") and its affiliates to jointly establish a joint venture company, SuperX Cooltech Pte. Ltd. ("SuperX Cooltech"), in Singapore. SuperX will become the single larg...
Sales 50x YoY, Deployments at 50 leading semiconductor companies. Former CEOs of Cadence and Mentor Graphics, Plus Former Synopsys CTO, Join Advisory Board. ChipAgents, the agentic AI platform transforming chip design and verification, announced the close of a $21 million Series A funding round, bringing the total fundraise to $24 million to date. This latest round closed with Besseme...
Argyll Data Development announced a strategic partnership with SambaNova, a next-gen AI infrastructure leader, to deliver the UK’s first renewable-powered AI inference cloud. The deployment will anchor the Killellan AI Growth Zone, a 184-acre green digital campus on Scotland’s Cowal Peninsula, creating a blueprint for how nations can combine AI sovereignty, energy independence and su...
TurinTech, a leader in AI-driven code optimization and validation, announced a collaboration with Intel to develop and deliver a fully offline, on-device version of Artemis, TurinTech’s AI engineering platform. The collaboration brings Artemis to Intel-powered systems, optimized for the latest Intel® Core™ Ultra processors. Designed to run entirely on-device, Artemis enables dev...
Lightning, creators of PyTorch Lightning, announced a suite of new tools built to accelerate distributed training, reinforcement learning, and experimentation for PyTorch developers and researchers. The launch comes as the PyTorch community gathers for PyTorch Conference 2025, reflecting Lightning’s continued commitment to building the best platform for PyTorch developers and researchers....
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, introduced the RA8M2 and RA8D2 microcontroller (MCU) groups. Based on a 1 GHz Arm® Cortex®-M85 processor with an optional 250 MHz Arm®Cortex®-M33 processor, the new MCUs are the latest Renesas offerings to deliver an unmatched 7300 Coremarks of raw compute performance, the industry...
At EDUCAUSE 2025, Druid will highlight how its platform improves student experiences and boosts campus efficiency Druid AI will showcase its comprehensive agentic AI platform, which drives transformation across the entire academic institution, next week at EDUCAUSE. This purpose-built platform for higher education delivers unprecedented accuracy, on average 95% or higher per universit...
-Axelera AI, the leading provider of purpose-built AI hardware acceleration technology, announced Europa™, an AI processor unit (AIPU) that sets a new performance/price standard for multi-user generative AI and computer vision applications. Europa’s combination of processing power, energy and thermal efficiency, compact packaging, and multiple form factor options make it ideal ...
Technology Advancements Align with the Industry’s Shift Toward 800 VDC Architectures Capstone Green Energy Holdings, Inc., and its subsidiaries (the "Company” or “Capstone”) (OTCQX: CGEH) a leading provider of clean, low-emission microturbine energy systems and clean technology solutions, and Microgrids 4 AI, Inc. (“MG4AI”), a developer of modular, ...
Sales 50x YoY, Deployments at 50 leading semiconductor companies. Former CEOs of Cadence and Mentor Graphics, Plus Former Synopsys CTO, Join Advisory Board. ChipAgents, the agentic AI platform transforming chip design and verification, announced the close of a $21 million Series A funding round, bringing the total fundraise to $24 million to date. This latest round closed with Besseme...
Vertical Semiconductor, a pioneering spin-out from the Massachusetts Institute of Technology (MIT), has raised $11 million in seed funding to accelerate development of its vertical GaN (gallium nitride) transistors — a breakthrough set to redefine how power is delivered to AI chips in data centres. The company’s technology brings power conversion closer to the chip, easing data-cent...
Frore Systems announced the launch of LiquidJet™, a revolutionary direct-to-chip liquid cooling 3D coldplate solution designed to meet the escalating demands of AI Data Centers. Built with Frore's unique semiconductor manufacturing process adapted to metal wafers, LiquidJet unlocks higher performance from the world's most powerful GPUs—starting with NVIDIA Blackwell Ultra—...
The NXLR1 Lidar Processor Unit (LPU) enables enhanced long range LiDAR perception for automotive ADAS and autonomous vehicles. NEXT Semiconductor Technologies has developed a LiDAR Processor System-On-Chip (SoC) component to address the growing market for LiDAR sensors sourcing data for AI-enhanced autonomous vehicles. The immediate addressable market for LiDAR sensors includes on-orbit sa...
Jensen Huang, the chief executive of NVIDIA, is scheduled to participate in the upcoming Asia-Pacific Economic Cooperation (APEC) CEO Summit in South Korea, which runs from October 28 to 31. NVIDIA said Huang will engage with global heads of state and senior Korean executives, including representatives of giants such as Samsung Electronics and SK Hynix. In a statement, the compa...
Asian semiconductor equities climbed sharply on Thursday following TSMC’s unexpectedly strong forecast for the year, as the company pointed to robust demand for high-performance chips used in artificial-intelligence infrastructure. TSMC reported a record quarterly profit and raised its full-year revenue outlook, citing major customers ranging from Nvidia and Apple to global d...
Fibocom, a leading global provider of wireless communication modules and AI solutions, announced the launch of its new 5G FWA (Fixed Wireless Access) portfolio powered by Qualcomm Technologies Inc.'s X85 and X82 Modem-RF Systems at NetworkX 2025. The lineup includes the high-performance 5G modules FG200/FG201, alongside customized device solutions for indoor CPE, outdoor ODU, and mobile hotspots...
SuperX AI Technology Limited announced the launch of the SuperX GB300 NVL72 System, a groundbreaking, rack-scale AI supercomputing platform powered by the NVIDIA GB300 Grace Blackwell Ultra Superchip. Designed to conquer the physical and computational limits of training and deploying next-generation trillion-parameter models, the liquid-cooled GB300 System delivers a significant leap in pe...
Ceva strengthens its leadership as a trusted single source for advancing the smart edge, with Bluetooth® 6.0 Channel Sounding for secure spatial awareness enabling on-device intelligence and Physical AI As industries demand greater positioning accuracy, security, and reliability for wireless connectivity, Bluetooth® 6.0 emerges as a critical enabler for next-generation high perfor...
Continues MediaTek's long history of collaboration with NVIDIA to advance AI innovation from supercomputers to vehicles, IoT devices, data center solutions, and beyond MediaTek has teamed with NVIDIA on the design of the GB10 Grace Blackwell Superchip in NVIDIA DGX Spark, a personal AI supercomputer that allows developers to prototype, fine-tune, and inference large AI models on the ...
New architecture eliminates legacy servers, slashing data storage TCO, and unlocks 800Gbps direct GPU-to-flash storage performance for the most demanding gigawatt-scale AI token factories News Highlights: This collaboration advances the Open Flash Platform (OFP) vision of a democratized, efficient, and radically simplified data storage infrastructure; offering >10x storage density, 90% ...