• Monday | 27 October 2025
Insyde Software Joins Arm Total Design to Accelerate AI-Ready Silicon Innovation

Insyde Software, a leading global provider of UEFI and OpenBMC-based firmware,  announced that it has joined Arm® Total Design, a collaborative ecosystem designed to simplify and accelerate custom silicon development powered by Arm Neoverse™ Compute Subsystems (CSS). In close alignment with Arm’s shift-left approach, Insyde empowers AI infrastructure providers to validate c...

15 Oct 2025 | Wednesday | NEWS
Johnson Controls Expands Silent-Aire Platform with Scalable CDU Solutions for AI-Driven Data Centres in Asia Pacific

Silent-Aire CDUs offer scalable cooling from 500kW to 10MW for high-density data centres in Asia Pacific Flexible, space-saving design with built-in redundancy helps achieve maximum availability and rapid deployment in dense urban markets like Singapore Johnson Controls full thermal portfolio can cut non-IT energy use by up to 50%, boosting efficiency even in warm-climate data cent...

14 Oct 2025 | Tuesday | NEWS
Getac Launches S510AD Rugged Copilot+ PC Powered by AMD Ryzen™ AI for Next-Generation Edge Intelligence

The new S510AD joins the B360 Plus, F120 and next generation UX10 in Getac's rapidly growing lineup of Copilot+ PCs. Powered by AMD Ryzen™ AI technology, the S510AD delivers strong on-device AI performance, supporting faster insights and reducing reliance on cloud connectivity where applications allow. The S510AD is ideally suited to professionals working in industries including a...

14 Oct 2025 | Tuesday | NEWS
WiMi Explores Quantum Dilated Convolutional Neural Networks to Advance AI Efficiency and Accuracy

WiMi Hologram Cloud Inc. (NASDAQ: WiMi) ("WiMi" or the "Company"), a leading global Hologram Augmented Reality ("AR") Technology provider, today announced that active exploration is underway in the field of Quantum Dilated Convolutional Neural Networks (QDCNN) technology. This technology is expected to break through the limitations of traditional convolutional neural networks in handling complex d...

14 Oct 2025 | Tuesday | NEWS
InPsytech Showcases 3nm UCIe 3.0 Technology at OCP Global Summit 2025

 InPsytech, a subsidiary of Egis Technology (6462.TWO) specializing in high-speed interface intellectual property (IP) development, announced  that it will participate in the Open Compute Project (OCP) Global Summit 2025, to be held in San Jose, California, from October 13–16, 2025. At the event, InPsytech will showcase its latest 3nm UCIe high-speed interface technology dem...

14 Oct 2025 | Tuesday | NEWS
China Intensifies Semiconductor Import Crackdown to Boost Domestic AI Chip Production

China has launched a sweeping crackdown on semiconductor imports as part of its push to reduce reliance on U.S. technology and accelerate self-sufficiency in advanced computing. Over recent weeks, customs teams stationed at major ports have intensified inspections of chip shipments, with particular scrutiny on processors supplied by U.S. chipmaker Nvidia, according to multiple industry sources....

13 Oct 2025 | Monday | NEWS
Cadence Giving Foundation Expands AI Hub at San José State University to Train Future AI Leaders

The Cadence Giving Foundation  announced a multi-year commitment to expand the AI Hub at San José State University (SJSU) to equip students with the skills, hands-on training and experience needed to excel in careers in artificial intelligence (AI). This multi-year agreement will also include a significant donation of AI design software and digital twin technology to SJSU from Caden...

13 Oct 2025 | Monday | NEWS
Smartkem, Inc. Signs LOI with Jericho Energy Ventures to Build U.S. AI Infrastructure Using Organic Semiconductor Technology

Smartkem, Inc. (Nasdaq: SMTK), ("Smartkem"), a company developing a new class of organic semiconductor technology, announced that it has signed a non-binding Letter of Intent ("LOI") with Jericho Energy Ventures Inc. (TSX-V: JEV, OTC: JROOF) ("Jericho" or "JEV"), an energy innovation company, for a proposed all-stock business combination (the "Proposed Transaction"). If completed, the Proposed T...

10 Oct 2025 | Friday | NEWS
Quilter Raises $25 Million from Index Ventures to Revolutionise Hardware Design with Physics-Driven AI

Index Ventures backs Quilter to automate circuit board design, a trillion-dollar bottleneck found in everything from phones to fighter jets. Quilter, the first and only company to publicly demonstrate fully autonomous PCB layout through physics-driven AI, announced $25 million in Series B funding led by Index Ventures. The investment comes as Fortune 500 aerospace, defense, and consum...

9 Oct 2025 | Thursday | NEWS
RealSense Spins Out from Intel with $50 Million Series A and Partners with NVIDIA to Drive the Future of Physical AI

RealSense, a pioneer in AI-powered computer vision, has announced two major milestones: its spinout from Intel Corporation, fueled with a $50 million Series A funding round, and a strategic collaboration with NVIDIA to accelerate the adoption of physical AI across humanoids and autonomous mobile robots (AMRs). “This collaboration cements RealSense’s role as the perception platform o...

9 Oct 2025 | Thursday | NEWS
MemryX and Cognitica AI Unite to Deliver Edge AI-Powered Safety Systems for Industrial and Port Operations

MemryX, a pioneer in edge AI accelerators,  announced a collaboration with Cognitica AI, a leader in industrial safety technology, to deliver breakthrough AI-powered safety systems for industrial vehicles and port equipment. By combining MemryX high-performance, energy-efficient AI acceleration with Cognitica AI's advanced vision systems, the partnership provides a complete solution fo...

9 Oct 2025 | Thursday | NEWS
Global 300mm Fab Equipment Investments to Reach $374 Billion by 2028, Driven by AI and Regional Self-Sufficiency

SEMICON West -- Global 300mm fab equipment spending is expected to reach $374 billion from 2026 to 2028, SEMI reported  in its latest 300mm Fab Outlook. This robust investment reflects fab regionalization and surging AI chip demand for data centers and edge devices, while underscoring the growing commitment to semiconductor self-sufficiency across key regions through localized ind...

9 Oct 2025 | Thursday | Reports
Omni Design Technologies Tapes Out 64 GSPS SWIFT™ ADC in TSMC 3nm to Power Next-Gen Data Connectivity

Omni Design Technologies, a leading provider of high-performance, low-power Wideband Signal Processing™ solutions,  announced the tape out of its new ODT-ADS-7B64G-3T, an ultra-high-speed 64 GSPS SWIFT™ analog-to-digital converter (ADC) supporting 7- and 8-bit output modes, designed in TSMC’s 3nm process. This time-interleaved ADC provides the breakthrough speed and perfor...

8 Oct 2025 | Wednesday | NEWS
JEDEC Unveils UFS 5.0 Standard for AI, Mobile, and Edge Devices

Flash Optimized for AI, Mobile, and Edge Devices with Enhanced Speed, Security, and Signal Integrity JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry,  announced it is nearing completion of the next version of its highly anticipated Universal Flash Storage (UFS) standard: UFS 5.0. Designed for mobile app...

7 Oct 2025 | Tuesday | NEWS
OpenAI Partners with South Korea’s Tech Giants to Power the Next Generation of AI Infrastructure

OpenAI announced a series of strategic partnerships with South Korean technology leaders Samsung and SK Group to accelerate the development of Stargate, a landmark $500 billion initiative aimed at building next-generation infrastructure for artificial intelligence. The announcements followed a meeting in Seoul between OpenAI CEO Sam Altman, South Korean President Lee Jae Myung, and senior execu...

6 Oct 2025 | Monday | NEWS
Alchip’s 3DIC Validation Paves Way for 2nm–3nm Stacked Architectures

Alchip Technologies, the dedicated high-performance and AI computing ASIC leader, validated its 3DIC ecosystem readiness with results from its 3DIC test chip tape out. The results vaulted Alchip into a clear 3DIC technology leadership because it validated an entire, integrated 3DIC solution, as well as its various elements.  The test chip provided CPU/NPU core demonstration, UCIe and PCIe ...

6 Oct 2025 | Monday | NEWS
GoSaaS Rebrands to GoSaaS.ai, Signalling AI-First Approach to Oracle Cloud

GoSaaS, Inc., an Oracle Cloud Applications implementation partner, announced it is moving from GoSaaS.io to GoSaaS.ai and introducing an updated logo. The changes reflect a simple idea: the reason to go to SaaS today is to use AI to drive outcomes, not just to move off older systems. “Seven years ago, our brand emphasized getting from on-prem to cloud. Our customers still need that, but t...

3 Oct 2025 | Friday | NEWS
QuickLogic Wins eFPGA Hard IP Contract for 12 nm Data Center ASIC

QuickLogic Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) Hard IP, Strategic Radiation Hardened, Antifuse and ruggedized FPGAs, announced  that its eFPGA Hard IP was selected for a new high-performance Data Center ASIC design that will be fabricated on an industry-proven 12 nm process technology. IP delivery for this contract is scheduled for Q4 2025. "We are excited...

3 Oct 2025 | Friday | NEWS
Phaidra Raises $50M+ Series B to Power Energy-Efficient AI Factories with Intelligent Agents

Phaidra, the company building AI agents for AI factories, announced a Series B funding round of more than $50 million led by Collaborative Fund, with participation from Helena, Index Ventures, NVIDIA, Sony Innovation Fund, and others. The funding will be used to make AI factories — the data center infrastructure purpose-built for AI workloads — radically more resource-efficient via A...

2 Oct 2025 | Thursday | NEWS
Global X Launches CHPX ETF to Capture AI and Quantum Semiconductor Innovation

Global X Management Company LLC ("Global X"), the New York-based provider of exchange traded funds (ETFs), announced the launch of the Global X AI Semiconductor & Quantum ETF (CHPX), designed to capture innovation in the semiconductor industry. The fund is passively managed and priced at 50 bps. The semiconductor industry is evolving to cater to demands of next-gen computing, including AI a...

2 Oct 2025 | Thursday | NEWS

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