Arteris and IC-Link by imec Partner to Accelerate AI and High-Performance Computing Chip Development

10 July 2026 | NEWS

The collaboration combines Arteris' Network-on-Chip IP with IC-Link by imec's ASIC design expertise to streamline custom AI, HPC and chiplet-based semiconductor development while improving scalability and time to market.

Semiconductor system intellectual property (IP) provider Arteris has announced a collaboration with IC-Link by imec to accelerate the development of next-generation artificial intelligence (AI) and high-performance computing (HPC) chips.

The partnership combines Arteris' Network-on-Chip (NoC) interconnect IP with IC-Link by imec's application-specific integrated circuit (ASIC) design and implementation services, enabling customers to address the increasing complexity of AI and HPC semiconductor development.

Under the agreement, IC-Link by imec will integrate Arteris' NoC technology into advanced system-on-chip (SoC) and chiplet-based designs. The collaboration is intended to optimise on-chip data movement, improve scalability and reduce development times for custom silicon solutions.

The companies aim to support semiconductor developers as demand grows for high-performance chips capable of handling increasingly complex AI workloads and compute-intensive applications. As the industry adopts more advanced chiplet architectures and heterogeneous integration, efficient interconnect technologies have become essential for improving system performance and power efficiency.

IC-Link by imec provides end-to-end ASIC development services, covering chip architecture, design, verification, manufacturing and advanced packaging. By combining these capabilities with Arteris' semiconductor IP portfolio, the collaboration is expected to streamline product development, promote design reuse and accelerate time to market.

The partnership also strengthens both organisations' positions within the expanding AI semiconductor ecosystem, where custom silicon is becoming increasingly important for data centres, cloud computing, automotive electronics and other high-performance applications.

As semiconductor designs continue to become more sophisticated, collaborations between IP providers and ASIC design specialists are playing a growing role in helping chip developers reduce design complexity, improve development efficiency and bring advanced semiconductor products to market more quickly.