• Monday | 09 February 2026
Diamond Quanta Introduces Adamantine Thermal™ for Advanced Chip Packaging

Diamond Quanta announced Adamantine Thermal™, an engineered-diamond thermal platform designed for integration into advanced packaging workflows and heterogeneous semiconductor systems. The announcement builds on the company’s CES 2026 Eureka Park debut and reflects growing customer interest in diamond-enabled solutions for next-generation electronics. The announcement follows Diamond ...

20 Jan 2026 | Tuesday | NEWS
Space Forge Completes First Commercial Semiconductor Manufacturing in Orbit

UK based company Space Forge has successfully completed the world’s first commercial semiconductor manufacturing experiment in orbit, marking a historic milestone for both the space and advanced manufacturing industries. The breakthrough demonstration confirms that semiconductor materials can be produced and processed in the unique conditions of microgravity, unlocking performance character...

19 Jan 2026 | Monday | NEWS
U.S. and Taiwan Announce $250 Billion Investment Agreement

The United States and Taiwan have entered into a landmark bilateral investment agreement that will see Taiwanese companies commit at least $250 billion towards expanding semiconductor, artificial intelligence, and advanced energy manufacturing capacity in the United States over the coming years. The agreement marks one of the largest cross border industrial investment commitments to date and sign...

19 Jan 2026 | Monday | NEWS
C&Y Engineering Supports Korean Companies Expanding into the U.S.

C&Y Engineering, a U.S.-based structural engineering firm specializing in industrial and manufacturing facilities, announced that it is emerging as a critical partner for Korean companies entering the U.S. market by addressing one of the most underestimated challenges: local structural design and permitting risk. Unlike Korea’s standardized design environment, the U.S. structural engine...

19 Jan 2026 | Monday | NEWS
SEEQC Announces Merger Agreement with Allegro Merger Corp.

SEEQC, Inc. (“SEEQC” or the “Company”), a developer and manufacturer of scalable, energy efficient digital chips for quantum computing systems, announced that it has entered into a definitive merger agreement with Allegro Merger Corp. (“Allegro”), an SEC reporting company. Under the terms of the merger agreement, and subject to the satisfaction of the condition...

19 Jan 2026 | Monday | NEWS
Silicon Single-Photon Detector Reaches Over 84% Efficiency

Silicon single-photon detectors (Si SPDs) play a central role in quantum photonics and single-photon imaging for detecting single photons in the visible spectrum. Many of these applications demand high photon detection efficiency (PDE) for effectively collecting photons. While Si SPD have compact size and are easy to operate, boosting their efficiency above 80% has been a challenge. To address th...

16 Jan 2026 | Friday | NEWS
Penguin Solutions’ SMART CXL Memory Module Passes Industry Compliance Testing

Penguin Solutions, Inc. (Nasdaq: PENG) a leading provider of high-performance computing and AI infrastructure solutions,  announced that its SMART Modular CXL NV-CMM E3.S 2T non-volatile memory module has successfully passed CXL® compliance testing. This achievement not only signifies adherence to industry standards, but positions Penguin Solutions as a trusted leader in advanced memory t...

16 Jan 2026 | Friday | NEWS
Ionic Mineral Technologies Appoints Shane Porzio as Chief Operating Officer

Ionic Mineral Technologies ("Ionic MT"), a pioneer in developing one of the world’s most comprehensive hubs for rare earths and critical minerals, announced the appointment of Shane Porzio as its Chief Operating Officer (COO). Mr. Porzio will lead the Company's operational scale-up from pilot to full commercial production of its nano-silicon, high-purity alumina, and rare earth elements deri...

16 Jan 2026 | Friday | NEWS
Global Semiconductor Revenues to Pass $1 Trillion in 2026

Global semiconductor revenues will exceed $1tn in 2026, marking a historic milestone for the industry, according to Omdia’s latest market analysis. This growth is being driven by the rapid surge in memory and logic IC revenues, generated by massive demand from AI market. The semiconductor revenue forecast for 2025 increased significantly to 20.3% year-over-year (YoY), reflecting stronger-tha...

16 Jan 2026 | Friday | NEWS
Infinium Launches Immersion Cooling Platform for AI Data Centers

Infinium announced the launch of Infinium Edge™, an advanced data center infrastructure platform designed to enable high-density artificial intelligence (AI) and high-performance computing (HPC) workloads through immersion cooling. As power densities of GPUs, CPUs and supporting components continue to rise, cooling has emerged as one of the primary constraints to data center performance, eff...

16 Jan 2026 | Friday | NEWS
Sivers Semiconductors Wins $800K U.S. Defense Contract

Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, today announced it has won an $800K development contract from a leading U.S. defense contractor. Under the agreement, Sivers Semiconductors will apply its industry-leading mmWave beamformers, to support emerging U.S. tactical communications programs. This collaboration represents a strategically signific...

16 Jan 2026 | Friday | NEWS
Diodes Introduces New USB-C Power Delivery Controllers for Portable Devices

Diodes Incorporated (Nasdaq: DIOD) introduces the AP53781 and AP53782 28V USB Type-C® Power Delivery (PD) dual-role power (DRP) controllers designed for managing DC power requests and outputs in battery-powered portable devices. The controllers support the latest USB PD3.1 extended power range (EPR) standard, delivering up to 140W for charging as well as releasing power from the internal batte...

15 Jan 2026 | Thursday | NEWS
Quick Logic Receives First Orders for Radiation-Hardened FPGA Development Kit

Quick Logic Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) Hard IP, Strategic Radiation Hardened, Antifuse and ruggedized FPGAs, announced that it has received orders for its Strategic Radiation Hardened FPGA Development Kit (SRH FPGA Dev Kit). These SRH FPGA Dev Kits include the SRH FPGA test chips, funded last year by QuickLogic, that have been fabricated on Global Foundries' i...

15 Jan 2026 | Thursday | NEWS
Startup Island TAIWAN Silicon Valley Hub Marks One Year of Cross-Border Innovation

Startup Island TAIWAN Silicon Valley Hub celebrated its first anniversary in Palo Alto, bringing together startup founders, technology leaders, accelerators, and community representatives from Taiwan and the United States to reflect on a year of advancing cross-border innovation. Established by Taiwan's National Development Council (NDC) in 2025, the Silicon Valley Hub serves as a two-way bridge ...

15 Jan 2026 | Thursday | NEWS
Beacon Global Strategies Launches New Export Control Practice

Beacon Global Strategies (BGS), a leading strategic advisory firm specializing in global public policy, defense, and national security, announced the launch of its new Export Control and Industrial Strategy Practice. The firm also announced that Meghan Harris has been promoted to Managing Director to lead the newly established practice, and that Kevin Kurland, former Principal Deputy Assistant Sec...

15 Jan 2026 | Thursday | NEWS
Siemens Acquires ASTER Technologies to Strengthen PCB Design and Testing

Siemens announced it has acquired ASTER Technologies ("ASTER"), a privately held market leader in printed circuit board assembly (PCBA) test verification and engineering software. This strategic move integrates ASTER's advanced "shift-left" design for test (DFT) functionality directly into Siemens' Xpedition™ software and Valor™ software – part of the Siemens Xcelerator portfolio...

15 Jan 2026 | Thursday | NEWS
New Photonics Introduces Industry’s First 1.6T Laser-Integrated NPO Transmitter

New Photonics® Ltd., the award-winning fabless semiconductor designer delivering innovative all-optical domain connectivity solutions for data center interconnect, introduced NPC50503 1.6T NPO laser integrated transmitter with integrated OSPic™ all-optical signal processor. The NPC50503 NPO chiplet is the industry's first laser-integrated 1.6T solution for a serviceable NPO environment a...

14 Jan 2026 | Wednesday | NEWS
Synopsys Joins Ignite Next to Support Europe’s Deep Tech Scale-Ups

Ignite Next, the independent scale-up program for deep tech innovation, announced that Synopsys, the leader in engineering solutions from silicon to systems, has joined the program as a focus technology collaborator. This addition significantly strengthens the multi-partner setup launched earlier this month, which is designed to help European deep tech founders move faster from "Pre to B". Synops...

14 Jan 2026 | Wednesday | NEWS
PlayNitride and Brillink Partner on Energy-Efficient Photonic Interconnects for AI and HPC

PlayNitride, a global leader in MicroLED technologies, announced a strategic collaboration with Brillink to develop a next-generation array-based photonic interconnect solution designed to deliver longer reach, lower power consumption, and superior bandwidth density for high-performance computing (HPC)and AI systems. As one of the industry's foremost MicroLED innovators, PlayNitride will contribu...

14 Jan 2026 | Wednesday | NEWS
Applied Brain Research Closes Oversubscribed Seed Funding Round

Applied Brain Research (ABR), the leader in low latency real-time on-device voice AI solutions, announced the successful closure of its oversubscribed seed funding round. The investment round was led by Two Small Fish Ventures (TSF), with Eva Lau joining the ABR board. The investment will fuel continued development and commercialization of ABR's breakthrough TSP1 state space accelerator chip and s...

14 Jan 2026 | Wednesday | NEWS

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