Flip Electronics, an authorized distributor of obsolete semiconductors and electronic components, announced that it is rebranding its subsidiary, Resurgent Manufacturing Services, to Flip Electronics Manufacturing Services (FMS). In January 2023, Flip Electronics acquired Resurgent Semiconductor, expanding its obsolescence management portfolio with extended-life manufacturing services for obsol...
Frost & Sullivan is pleased to announce that Baya Systems has been recognized with the 2025 Global Technology Innovation Leadership Recognition in the semiconductor IP interconnect solutions industry for its outstanding achievements in product innovation, strategic execution, and customer impact. This recognition highlights Baya Systems' consistent leadership in driving measurable ...
GS Microelectronics US, Inc. (GSME), the fastest-growing semiconductor service provider from North America, announced the acquisition of Sinble Technology Vietnam Company Limited, a strategic move to enhance its design expertise in TSMC-based advanced process nodes. "This acquisition aligns seamlessly with our strategic growth roadmap," - Farhat Jahangir, President and CEO of GSME The acquisitio...
MetaOptics Ltd (the "Company", together with its subsidiary, the "Group") is a cutting-edge semiconductor optics company pioneering glass-based metalenses with AI-enhanced imaging. The Group is a vertically integrated frontrunner in metalens technology headquartered in Singapore, and has lodged its preliminary offer document for its upcoming initial public offering (the "IPO") on the Catali...
iDEAL Semiconductor, a fabless power semiconductor company focused on delivering breakthrough efficiencies, has announced it will partner with Power and RF specialist, Richardson Electronics. Under the agreement, iDEAL will gain access to Richardson Electronics' design teams and sales specialists to expand the reach of its ultra-efficient, high-performance power MOSFETs, which are based o...
Quantum Computing Inc. ("QCi" or the "Company"), an innovative, integrated photonics and quantum optics technology company, announced it has been awarded a contract by the National Institute of Standards and Technology (NIST), part of the U.S. Department of Commerce, for the design and fabrication of thin-film lithium niobate (TFLN) photonic integrated circuits (PICs). In addition, the Comp...
NEO Semiconductor, a leading developer of breakthrough memory technologies, introduced the world's first Extreme High Bandwidth Memory (X-HBM) architecture for AI chips. Built to meet the growing demands of generative AI and high-performance computing, X-HBM delivers unmatched performance with a 32K-bit data bus and potentially 512 Gbit per die, dramatically surpassing the limitations of tra...
In a world increasingly shaped by intelligent devices that connect, sense, and perceive our surroundings, Ceva, Inc., the leading licensor of silicon and software IP for the Smart Edge, today announced it has surpassed 20 billion Ceva-powered devices shipped globally. This milestone not only cements Ceva's legacy as a foundational technology provider of the mobile and IoT eras, but sets the...
Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automobile SoCs, announced the immediate availability of the industry's first MIPI SWI3S Manager IP and SWI3S Peripheral IP Cores. The SWI3S IP gate count is kept extremely low, targeting applications like the Microphones while also ensuring low latency. Arasan's SWI3S IP joins Arasan's extensive MIPI IP portfolio ...
Cyient Semiconductors Private Limited, a fast-growing custom silicon company, announced a strategic Channel Partner Agreement with GlobalFoundries (GF), one of the world's leading pure-play semiconductor foundries. Under the agreement, Cyient Semiconductors becomes an authorized reseller of GF's semiconductor manufacturing services and technologies. This collaboration is a significant step towa...
Axcelis Technologies, Inc., a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced a Joint Development Program (JDP) with GE Aerospace focused on the development of production-worthy 6.5 to 10kV superjunction power devices. Processes will be developed on Axcelis' Purion XEmax™ high energy implanter, which provides the industry's highest beam cur...
Pixelworks, Inc., a leading provider of visual processing solutions, announced that the newly launched realme P4 5G and P4 Pro 5G smartphones incorporate Pixelworks' X7 Gen 2 visual processor. The realme P4 series smartphones are the first models in the P series to integrate a dedicated visual processor solution aimed at setting a new benchmark for mid-range international market segment. Powered...
Hyundai Mobis has obtained the highest grade of ISO 26262 certification, an international standard for functional safety, for its entire vehicle semiconductor R&D process. It is noted that this rigorous certification was obtained not for specific products, but for the entire process ranging from semiconductor design to quality verification. This certification means that when Hyundai M...
After a few sluggish years following COVID-19, the digital authentication and embedded security market is poised for double-digit growth in the coming years, according to global technology intelligence firm ABI Research. This is despite global tariff uncertainty that continues to impact the semiconductor industry. "The relentless, onward march of E.U. regulations is not to be derailed by global...
From smartphones and gaming consoles to artificial intelligence, the powerful chips that drive modern technology generate intense heat. When temperatures rise too high, performance suffers, energy is wasted, and hardware can fail. A research team at Clarkson University is developing a new tool to combat this challenge. Thermal Analysis of Semiconductor Chips, known as TASChips, is an open-sourc...
LG Innotek recently held an event to unveil its newly developed 'Next-generation Digital Key Solution' for the first time to the media. The 'Next-generation Digital Key Solution' is a flagship product of LG Innotek's automotive connectivity business, a key pillar of its automotive components business, along with 5G communication modules and automotive AP modules. The digital key is touted as a...
Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced the industry's first 2nm 64 Gbps bi-directional die-to-die (D2D) interconnect, enabling chip designers to significantly boost the bandwidth and performance of next-generation XPUs while reducing power and silicon area. Delivering 32 Gbps of simultaneous two-way connectivity over a single wire, the interf...
Aion Silicon (formerly Sondrel), a leading ASIC and SoC architecture partner, announced its membership in the Intel Foundry Accelerator Value Chain Alliance (VCA). As a VCA partner, Aion Silicon expands its existing turnkey service offerings to deliver full-stack custom silicon—from architecture through packaged silicon—across multiple market segments and geographies. This new allia...
As AI, HPC, and 5G drive semiconductor innovation, advanced packaging has become the next strategic focus. Yole Group projects the market to exceed USD 50 billion by 2025, with fan-out panel-level packaging (FOPLP) growing more than 15% annually. E&R Engineering (TPE: 8027) will present its latest laser and plasma solutions at SEMICON Taiwan 2025, covering FOPLP, Through-Silicon Via (T...
iDEAL Semiconductor has announced the first of its 200 V family of SuperQ™-based MOSFETs has entered mass production, with four additional 200 V devices now sampling. SuperQ is the first major advance in silicon MOSFET technology in more than 25 years, breaking through long-standing limits in switching and conduction. It delivers a step-change in performance and efficiency while preservin...