• Monday | 15 June 2026
ChipMOS TECHNOLOGIES INC. Reports Strong Q1 Growth on AI-Driven Memory Demand

ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and Nasdaq: IMOS), an industry-leading provider of outsourced semiconductor assembly and test services ("OSAT"), reported its unaudited consolidated revenue for March 2026 and for the first quarter ended March 31, 2026. All U.S. dollar figures cited in this press release are based on the exchange rate of NT$32...

13 Apr 2026 | Monday | NEWS
Intel and Google Deepen Strategic Alliance to Power Next-Gen AI Infrastructure

Intel Corporation (NASDAQ: INTC) and Google announced a multiyear collaboration to advance the next generation of AI and cloud infrastructure, reinforcing the critical role of CPUs and custom infrastructure processing units (IPUs) in scaling modern, heterogeneous AI systems. As AI adoption accelerates, infrastructure is becoming more complex and heterogeneous, driving increased reliance on CPUs f...

10 Apr 2026 | Friday | NEWS
Everspin Technologies Partners with Microchip Technology to Expand MRAM Manufacturing Capacity

Everspin Technologies Inc., (NASDAQ: MRAM), the world’s leading developer and manufacturer of persistent Magnetoresistive Random Access Memory (MRAM) solutions, announced its strategic manufacturing agreement with Microchip Technology to expand production capacity and strengthen long-term supply. Everspin has entered into an initial 10-year agreement, that can be extended in 2-year incremen...

10 Apr 2026 | Friday | NEWS
Semiconductor Foundry Market to Hit $266 Billion by 2031 on AI and EV Demand

According to the latest report by Mordor Intelligence, the semiconductor foundry market is set for robust growth over the coming years. The market is projected to reach USD 184.78 billion in 2026, rising from USD 171.72 billion in 2025, and is expected to expand further to USD 266.56 billion by 2031, reflecting a compound annual growth rate (CAGR) of 7.61% between 2026 and 2031. Thi...

10 Apr 2026 | Friday | NEWS
SK hynix Backs Semidynamics to Advance Memory-Centric AI Infrastructure

Semidynamics, an advanced computing company developing memory-centric AI infrastructure for large-scale inference, announced a strategic investment from SK hynix, one of the world's leading memory manufacturers. The investment reflects a shared conviction that memory architecture, not compute alone, will define the economics of next-generation AI inference, where cost per token is the me...

9 Apr 2026 | Thursday | NEWS
Cyient Semiconductors Acquires Majority Stake in Kinetic Technologies for $85 Million

Kinetic Technologies (Kinetic) announced that it has completed the necessary steps to enter into an agreement under which Cyient Semiconductors has secured a majority stake in Kinetic for a total consideration of $85 million USD. The strategic investment marks a significant step in accelerating research and product development, while strengthening Kinetic's ability to serve global c...

9 Apr 2026 | Thursday | NEWS
Cohu Secures $30m in Follow-On Orders for HPC Test Platform

Cohu, Inc. (NASDAQ: COHU), a global supplier of equipment and services optimising semiconductor manufacturing yield and productivity, announced that two customers have placed follow-on orders totalling $30 million for the Eclipse platform configured with active thermal control for testing of next-generation high-performance computing (HPC) processors. The orders, which are expected to be delivere...

6 Apr 2026 | Monday | NEWS
Parade Technologies Launches DP 2.1a MST Hub for Automotive and Display Expansion

Parade Technologies, Ltd. (Taiwan OTC: 4966.TWO), a leading high-speed interface, video display, and touch controller IC supplier, announces the availability of PS8651V DP 2.1a/HBR3 1:2 MST hub controller for automotive, accessories and video display designs that need DP/eDP port expansion. It adds to Parade’s DP MST Hub solutions, which include the PS8650 DP 2.1a/UHBR20 1:4 MST hub controll...

6 Apr 2026 | Monday | NEWS
Renesas Powers NASA’s Artemis II Mission with Radiation-Hardened ICs

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, announced its radiation-hardened (rad-hard) ICs are being used in NASA’s Artemis II mission, which successfully launched from the Kennedy Space Center in Florida on April 1. The first crewed mission around the moon in decades, Artemis II represents a major milestone in NASA’s plans to re...

6 Apr 2026 | Monday | NEWS
Intel to Reclaim Full Ownership of Ireland Fab in $14.2bn Deal

Intel Corporation (Nasdaq: INTC) and Apollo (NYSE: APO) announced a definitive agreement for Intel to repurchase the 49% equity interest in the joint venture related to Intel’s Fab 34 in Ireland not held by Intel for $14.2 billion. The agreement reflects Intel’s continued business momentum underpinned by the growing and essential role CPUs play in the era of AI, a significantly strengt...

3 Apr 2026 | Friday | NEWS
GS Microelectronics U.S., Inc. and Tarana Wireless, Inc. Expand Strategic RF Partnership to Accelerate Next-Gen Wireless Innovation

GS Microelectronics U.S., Inc. (GSME) announced a strategic partnership with Tarana Wireless, Inc. to support RF transceiver products and accelerate the future roadmap of wireless technologies. The deal strengthens the long-standing partnership between GSME and Tarana, enhancing the overall market value by providing dedicated RF-Analogue engineering support for Tarana's products. The team will sup...

30 Mar 2026 | Monday | NEWS
Agileo Automation Launches Agil'EDA to Enable Next-Gen Fab Connectivity

Agileo Automation, a leading global provider of control and connectivity solutions for semiconductor manufacturing, unveils Agil'EDA, a new software implementing Equipment Data Acquisition (EDA/Interface A). This solution enables semiconductor equipment manufacturers to meet the evolving high-performance connectivity requirements of tier-one fabs and advanced packaging facilities. As semicon...

26 Mar 2026 | Thursday | NEWS
HyperLight Corporation Launches 400G-per-Lane Photonic Integrated Circuits for Artificial Intelligence Networking

HyperLight Corporation (“HyperLight”), creator of the TFLN Chiplet™ Platform, announced the availability of 400G-per-lane thin-film lithium niobate (TFLN) photonic integrated circuits (PICs) designed for next-generation AI networking infrastructure. The new PIC family delivers low insertion loss, low drive voltage operation, and exceptional electro-optic bandwidth, enabling energ...

20 Mar 2026 | Friday | NEWS
Longsys Showcases Artificial Intelligence Driven Semiconductor Storage Solutions at Embedded World 2026

At Embedded World 2026, branded semiconductor memory enterprise Longsys (301308.SZ) demonstrated its integrated storage innovation capabilities and dual business-model value under the theme "AI Storage for Embedded World". Automotive-grade Portfolio Powers Intelligent Vehicles With seven years of expertise in automotive-grade storage, Longsys has built comprehensive capabilities across chi...

19 Mar 2026 | Thursday | NEWS
Sony Semiconductor Solutions Corporation Launches 4K Image Sensor with Advanced LOFIC Pixel Technology

Sony Semiconductor Solutions Corporation (Sony) today announced the upcoming launch of the IMX908, a 4K CMOS image sensor for security cameras featuring the industry's smallest 1.45 µm LOFIC pixels. * The new sensor utilises newly developed LOFIC pixels to achieve 96dB high dynamic range images with a single exposure at 4K resolution. This results in improved low-light performance...

18 Mar 2026 | Wednesday | NEWS
Synopsys Showcases Artificial Intelligence Driven Semiconductor Design Collaboration with NVIDIA

At GTC 2026, Synopsys presented the outcomes of its ongoing collaboration with NVIDIA, highlighting how the integration of AI and accelerated computing is reshaping modern engineering and design processes. By combining its expertise in electronic design automation (EDA) and simulation with NVIDIA’s high-performance computing technologies, Synopsys is enabling organisations to tackle increas...

18 Mar 2026 | Wednesday | NEWS
HyperLight Corporation Demonstrates 1.6T Optical Transceiver Using TFLN Chiplet Platform

HyperLight Corporation (“HyperLight”) announced a major milestone in low-power optical networking with the demonstration of a 1.6T-DR8 optical transceiver leveraging HyperLight’s TFLN Chiplet™ Platform. The reference module was demonstrated with engineering and manufacturing support from Suzhou TFC Optical Communication Co., Ltd. (SZSE: 300394, or "TFC"). The reference des...

17 Mar 2026 | Tuesday | NEWS
Marvell Technology and Mojo Vision Partner on Micro-LED Optical Interconnects for AI Data Centres

Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, and Mojo Vision, the high-performance micro-LED platform company, announced a long-term collaboration to develop a new class of optical interconnect solutions to power the next wave of high-performance AI data center infrastructure. Today’s rapidly growing AI workloads are beginning to str...

17 Mar 2026 | Tuesday | NEWS
KIOXIA America, Inc. Showcases AI-Optimised Flash and SSD Solutions at NVIDIA GTC 2026

Next week at NVIDIA GTC 2026, KIOXIA America, Inc. will showcase its latest high-performance memory and solid-state drive (SSD) solutions designed to meet the growing demands of artificial intelligence (AI) workloads. As the premier global AI conference, GTC brings together developers, researchers, and business leaders to explore advances in accelerated computing and AI. At this ye...

17 Mar 2026 | Tuesday | NEWS
India Commits USD 4.8 Billion In Union Budget 2026 To Emerge As A Global Semiconductor Contender

  India’s Union Budget 2026 marks a clear inflection point in the country’s semiconductor ambition. What emerges is not a tactical incentive programme but a calibrated national strategy designed to reposition India from a peripheral electronics base to a credible node in the global semiconductor value chain. For global semiconductor and electronics multinationals,...

2 Feb 2026 | Monday | NEWS

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